Patents by Inventor Pingxia LIANG

Pingxia LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230420422
    Abstract: Provided are an LED package device and a preparation method thereof, and a display device. The package device includes a transparent substrate, a black layer, a transparent bonding layer, multiple LED chips, and a mold protective layer. The multiple LED chips are fixed to the transparent substrate based on the transparent bonding layer. The black layer is configured to cover the transparent bonding layer. The black layer is provided with multiple matching holes. The multiple LED chips are matched in the multiple matching holes in a one-to-one correspondence. The cover area of the transparent bonding layer is S1. The area of the top surface of the transparent substrate is S2. The constraint relationship between S1 and S2 is S1<S2. The mold protective layer is configured to wrap the black layer, the transparent bonding layer, and the multiple LED chips on the transparent substrate.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 28, 2023
    Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Liang NI, Jinhui ZHANG, Lifang LIANG, Pingxia LIANG, Long ZHAO, Danwei LI
  • Publication number: 20230215999
    Abstract: Provided is an LED device. The LED device includes a bracket and a chip. The bracket includes a lead frame and a molded structure connected to the lead frame. The molded structure includes a chip placement body and a reflective structure. The chip placement body defines an avoidance groove. The reflective structure is a cylindrical structure with an inner through hole. The inner through hole communicates with the avoidance groove. The cylindrical structure is disposed around the periphery of the chip placement body. A first end of the cylindrical structure is formed with an opening communicating with the inner through hole. A second end of the cylindrical structure is connected to the chip placement body in the entire circumferential direction. A circumferential sidewall of the inner through hole forms a reflective surface used for reflecting light.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 6, 2023
    Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Libing PAN, Zhiguo XIE, Jiapeng ZHANG, Man ZHAO, Yinling ZHENG, Pingxia LIANG, Fuhai LI
  • Publication number: 20230216011
    Abstract: Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 6, 2023
    Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Libing PAN, Zhiguo XIE, Man ZHAO, Jiapeng ZHANG, Danwei LI, Pingxia LIANG, Fuhai LI
  • Patent number: D1052791
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: November 26, 2024
    Assignee: Foshan NationStar Optoelectronics Co., Ltd.
    Inventors: Libing Pan, Zhiguo Xie, Pingxia Liang, Man Zhao, Fuhai Li, Chengbin Liu