Patents by Inventor Pingxiang ZHANG

Pingxiang ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-cost and high-strength bi-based superconducting wire/tape and preparation method thereof
    Patent number: 12295269
    Abstract: A low-cost and high-strength Bi-based superconducting wire/tape and a preparation method thereof, the preparation method includes: 1. subjecting a first Bi-based superconducting wire/tape to electrochemical silver reduction to remove a Ag alloy layer to obtain a second Bi-based superconducting wire/tape; and 2. subjecting the second Bi-based superconducting wire/tape to surface enhancement, such that a Cu layer is formed to obtain the low-cost and high-strength Bi-based superconducting wire/tape. An electrochemical silver reduction technology combines with an electrochemical additive method to remove a Ag alloy layer on a surface of a Bi-based superconducting wire/tape and coat a high-strength Cu layer, such that a low-cost and high-strength Bi-based superconducting wire/tape can be prepared, which reduces a preparation cost and improves a strength of a Bi-based superconducting wire/tape to meet the application requirements of large super-strong magnets.
    Type: Grant
    Filed: May 3, 2024
    Date of Patent: May 6, 2025
    Assignee: NORTHWEST INSTITUTE FOR NONFERROUS METAL RESEARCH
    Inventors: Qingbin Hao, Jianfeng Li, Shengnan Zhang, Lihua Jin, Xiaoyan Xu, Gaofeng Jiao, Kai Yao, Chengshan Li, Guoqing Liu, Zhenbao Li, Xueqian Liu, Gaoshan Li, Jianqing Feng, Pingxiang Zhang
  • LOW-COST AND HIGH-STRENGTH Bi-BASED SUPERCONDUCTING WIRE/TAPE AND PREPARATION METHOD THEREOF
    Publication number: 20240389474
    Abstract: A low-cost and high-strength Bi-based superconducting wire/tape and a preparation method thereof, the preparation method includes: 1. subjecting a first Bi-based superconducting wire/tape to electrochemical silver reduction to remove a Ag alloy layer to obtain a second Bi-based superconducting wire/tape; and 2. subjecting the second Bi-based superconducting wire/tape to surface enhancement, such that a Cu layer is formed to obtain the low-cost and high-strength Bi-based superconducting wire/tape. An electrochemical silver reduction technology combines with an electrochemical additive method to remove a Ag alloy layer on a surface of a Bi-based superconducting wire/tape and coat a high-strength Cu layer, such that a low-cost and high-strength Bi-based superconducting wire/tape can be prepared, which reduces a preparation cost and improves a strength of a Bi-based superconducting wire/tape to meet the application requirements of large super-strong magnets.
    Type: Application
    Filed: May 3, 2024
    Publication date: November 21, 2024
    Applicant: NORTHWEST INSTITUTE FOR NONFERROUS METAL RESEARCH
    Inventors: Qingbin HAO, Jianfeng LI, Shengnan ZHANG, Lihua JIN, Xiaoyan XU, Gaofeng JIAO, Kai YAO, Chengshan LI, Guoqing LIU, Zhenbao LI, Xueqian LIU, Gaoshan LI, Jianqing FENG, Pingxiang ZHANG