Abstract: The present application relates to a temperature adjustment apparatus and a testing apparatus for an integrated chip. The temperature adjustment apparatus is applied to an integrated chip testing scene. The temperature adjustment apparatus includes: a first thermoelectric cooling chip, wherein the first thermoelectric cooling chip has a first end surface configured to attach to one side of to-be-tested integrated chip, and is used for absorbing heat from the integrated chip or transferring heat to the integrated chip; and a heat exchange assembly, attached to a second end face of the first thermoelectric cooling chip and used for performing heat exchange with the first thermoelectric cooling chip.