Patents by Inventor Pinqiang Liu

Pinqiang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230200028
    Abstract: An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.
    Type: Application
    Filed: February 16, 2023
    Publication date: June 22, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Nengwu Xiang, Xiaolin Jia, Shuncheng Pan, Pinqiang Liu, Jianqiang Yin