Patents by Inventor Pinxiang Duan

Pinxiang Duan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer scale technique for interconnecting vertically stacked dies
    Patent number: 9331051
    Abstract: A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die (2) on top of a first die (1), heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound (PR), using lithography, from a top surface of the first die (1) to a top surface of the second die (2), heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die (1) top surface and the second die (2) top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die (1) top surface and the second die (2) top surface.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: May 3, 2016
    Assignee: Technische Universiteit Eindhoven
    Inventors: Pinxiang Duan, Elbertus Smalbrugge, Oded Raz, Harmen Joseph Sebastiaan Dorren
  • Wafer scale technique for interconnecting vertically stacked dies
    Publication number: 20140300008
    Abstract: A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die (2) on top of a first die (1), heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound (PR), using lithography, from a top surface of the first die (1) to a top surface of the second die (2), heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die (1) top surface and the second die (2) top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die (1) top surface and the second die (2) top surface.
    Type: Application
    Filed: November 1, 2012
    Publication date: October 9, 2014
    Inventors: Pinxiang Duan, Elbertus Smalbrugge, Oded Raz, Harmen Joseph Sebastiaan Dorren