Patents by Inventor Pinyen Lin

Pinyen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190164820
    Abstract: A method for manufacturing a semiconductor structure is provided. The method includes following steps. A MEOL structure is formed on an etch stop layer. A patterned masking layer with at least one opening is formed on the MEOL structure and a first etching process is performed to form a trench in the MEOL structure. A second etching process is performed to modify at least one sidewall of the trench.
    Type: Application
    Filed: January 2, 2018
    Publication date: May 30, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Chang SUN, Po-Chin CHANG, Akira MINEJI, Zi-Wei FANG, Pinyen LIN
  • Publication number: 20190099856
    Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 4, 2019
    Inventors: Chi-Hao HUANG, Hsuan-Pang LIU, Yuan-Chun SIE, Pinyen LIN, Cheng-Chung CHIEN
  • Patent number: 10189143
    Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: January 29, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Chi-Hao Huang, Hsuan-Pang Liu, Yuan-Chun Sie, Pinyen Lin, Cheng-Chung Chien
  • Patent number: 10157773
    Abstract: A method of forming a semiconductor structure is provided. In this method, a semiconductor substrate is provided. A SoC layer is formed on the semiconductor substrate. A hard mask layer is formed over the SoC layer. The hard mask layer is patterned to expose a portion of the SoC layer. At least one opening is formed on the portion of the SoC layer using an ALE operation, thereby enabling the remaining portion of the SoC layer adjacent to the at least one opening to have a re-entrant angle included between a sidewall of the SoC layer and a bottom of the SoC layer.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: December 18, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Shan Chen, Chan-Syun David Yang, Li-Te Lin, Pinyen Lin
  • Publication number: 20170250098
    Abstract: A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.
    Type: Application
    Filed: May 16, 2017
    Publication date: August 31, 2017
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yii-Cheng Lin, Chih-Ming Sun, Pinyen Lin
  • Publication number: 20170151648
    Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.
    Type: Application
    Filed: May 18, 2016
    Publication date: June 1, 2017
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hao HUANG, Hsuan-Pang LIU, Yuan-Chun SIE, Pinyen LIN, Cheng-Chung CHIEN
  • Patent number: 9666461
    Abstract: A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: May 30, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yii-Cheng Lin, Chih-Ming Sun, Pinyen Lin
  • Patent number: 8992857
    Abstract: A mixing method and device are disclosed. The mixing method includes providing a drop generating device including a first drop ejector, a second drop ejector and a collector. The mixing method also includes ejecting a plurality of drops of a first reactant from the first drop ejector and ejecting a plurality of drops of a second reactant from the second drop ejector and collecting the drops with the collector.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: March 31, 2015
    Assignee: Xerox Corporation
    Inventors: David Allen Mantell, Peter Michael Gulvin, Pinyen Lin, Andrew W Hays
  • Patent number: 8613397
    Abstract: An electronic device has an electronic signal source electrically connected to a signal routing circuit, an electrically activated transducer to receive electronic signals through the signal routing circuit, and an anisotropic conductive film to provide electrical continuity between the signal routing circuit and the transducer, the anisotropic conductive film having material removed adjacent the transducer to reduce mechanical loading of the transducer.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: December 24, 2013
    Assignee: Xerox Corporation
    Inventors: Bradley James Gerner, John R. Andrews, Pinyen Lin
  • Patent number: 8563115
    Abstract: This disclosure provides an aperture plate coated with a composition comprising a fluorinated compound and an organic compound selected from the group consisting of a urea, an isocyanate and a melamine. This disclosure also provides a process of applying a coating composition to an aperture plate, comprising adding a fluorinated compound, an organic compound selected from the group consisting of a urea, an isocyanate and a melamine, and an optional catalyst together in a solvent to form a coating composition, applying the coating composition to a base film, and curing the base film. This disclosure also describes replacing the aperture plate with polyimide film, where the polyimide film is coated with the above-described coating composition before a laser cutting process.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: October 22, 2013
    Assignee: Xerox Corporation
    Inventors: Liang-Bih Lin, Pinyen Lin
  • Patent number: 8562114
    Abstract: A manifold assembly has been constructed that filters ink before the ink enters an inkjet ejector in an inkjet print head. The manifold assembly includes an adhesive layer having openings, an ink manifold layer having a plurality of openings, the openings in the adhesive layer being aligned with the openings in the ink manifold layer, and a polymer layer having a plurality of filter areas, the filter areas being aligned with the openings in the ink manifold layer and the openings in the adhesive layer, the adhesive layer being interposed between the polymer layer and the ink manifold layer.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: October 22, 2013
    Assignee: Xerox Corporation
    Inventors: Bradley J. Gerner, John R. Andrews, Bryan R. Dolan, Pinyen Lin, Antonio DeCrescentis
  • Patent number: 8565659
    Abstract: There is described a fuser roller including a surface layer of anodized aluminum oxide impregnated with a fluorine containing sealant. There is also described the method for producing the fuser member.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: October 22, 2013
    Assignee: Xerox Corporation
    Inventors: George C. Cardoso, Pinyen Lin, Anthony S. Condello, Jason M. LeFevre, Richard W. Seyfried, Grace T. Brewington, Christopher G. Lynn, Dale R. Mashtare, James R. Beachner, Daniel Bray
  • Publication number: 20130266774
    Abstract: A package structure and a packaging method for manufacturing the package structure are provided. The package structure comprises a cover wafer, a device wafer and a bonding material. The cover wafer has an optical element, and a surface of the cover wafer is defined with a height difference that is greater than 20 micrometers. The bonding material has a width and continuously surrounds the optical device, and is disposed between the cover wafer and the device wafer, in which the width is between 10 micrometers and 150 micrometers. The bonding material hermetically bonds the cover wafer and the device wafer to make a leakage rate of the package structure less than 5e?8 atm-cc/sec.
    Type: Application
    Filed: June 7, 2012
    Publication date: October 10, 2013
    Applicant: TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
    Inventors: Pinyen Lin, Yu-Fu Kang
  • Patent number: 8491747
    Abstract: A method for assembling an inkjet jet print head enables piezoelectric transducers to be bonded to an inkjet ejector without closing inlets to a pressure chamber within the inkjet ejector. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer with a thermoset adhesive, placing thermoset polymer in areas between the piezoelectric transducers on the diaphragm layer, and drilling inlets through the thermoset polymer and the diaphragm at the openings in the diaphragm.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: July 23, 2013
    Assignee: Xerox Corporation
    Inventors: Bryan R. Dolan, John R. Andrews, Pinyen Lin, Bradley J. Gerner, Antonio DeCrescentis
  • Patent number: 8408683
    Abstract: A method for mounting a piezoelectric transducer layer to a diaphragm layer exposes an electrode for each piezoelectric transducer after thermoset polymer filling the interstitial space between the piezoelectric transducers has been cured. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer, filling areas between the piezoelectric transducers on the diaphragm layer with thermoset polymer, and removing the thermoset polymer from the piezoelectric transducers with a laser to expose a metal electrode on each piezoelectric transducer.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: April 2, 2013
    Assignee: Xerox Corporation
    Inventors: Bradley J. Gerner, John R. Andrews, Bryan R. Dolan, Pinyen Lin
  • Patent number: 8367020
    Abstract: A microfluidic device includes a first substrate, and a phase change ink deposited on a surface of the first substrate. The phase change ink includes an ink vehicle including a polymeric material having one or more hydroxyl groups, and an optional colorant, wherein the phase change ink is solid at room temperature but is liquid at a jetting temperature of from about 60 to about 150° C., and a hydroxyl group mass percentage, measured as a total mass of hydroxyl groups to an entire weight of the ink, is from about 1% to about 35%.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: February 5, 2013
    Assignee: Xerox Corporation
    Inventor: Pinyen Lin
  • Patent number: 8354062
    Abstract: A mixing method is disclosed. The mixing method includes providing a drop generating device including a first drop ejector, a second drop ejector and a collector. The mixing method also includes ejecting a plurality of drops of a first reactant from the first drop ejector and ejecting a plurality of drops of a second reactant from the second drop ejector and collecting the drops with the collector.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: January 15, 2013
    Assignee: Xerox Corporation
    Inventors: David Allen Mantell, Peter Michael Gulvin, Pinyen Lin, Andrew W. Hays
  • Patent number: 8303093
    Abstract: A method for assembling an inkjet jet print head enables piezoelectric transducers to be bonded to an inkjet ejector without closing inlets to a pressure chamber within the inkjet ejector. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer with a thermoset adhesive, placing thermoset polymer in areas between the piezoelectric transducers on the diaphragm layer, and drilling inlets through the thermoset polymer and the diaphragm at the openings in the diaphragm.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: November 6, 2012
    Assignee: Xerox Corporation
    Inventors: Bryan R. Dolan, John R. Andrews, Pinyen Lin, Bradley J. Gerner, Antonio DeCrescentis
  • Patent number: 8303076
    Abstract: A printhead assembly includes a plurality of functional plates bonded together in a stack by polymeric adhesive(s). The surfaces of the functional plates that contact the polymeric adhesives are subjected to a coating process that includes providing a coating of an adhesion promoter, namely polydopamine, prior to application of the adhesive. The adhesive may be a crosslinkable acrylic adhesive or a thermoplastic polyimide. The polydopamine coating is applied by immersing the functional plate in a buffered dopamine solution for a period sufficient to produce a coating having a pre-determined thickness. The thickness of the coating is controlled by submerging the functional plate in the buffered dopamine solution while the pH value of the dopamine solution is maintained at a value sufficient for polymerization of the dopamine during that time period, and then transferring the plates to a solution having a pH value that is insufficient to sustain the polymerization reaction.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: November 6, 2012
    Assignee: Xerox Corporation
    Inventors: Pinyen Lin, John R. Andrews
  • Patent number: 8277032
    Abstract: A microfluidic device includes a first substrate, and a phase change ink deposited on a surface of the first substrate. The phase change ink includes an ink vehicle including a polymeric material having one or more acidic groups, and an optional colorant, wherein the phase change ink is solid at room temperature but is liquid at a jetting temperature of from about 60 to about 150° C., and an acidic group mass percentage, measured as a total mass of acid groups to an entire weight of the ink, is from about 1% to about 35%.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: October 2, 2012
    Assignee: Xerox Corporation
    Inventor: Pinyen Lin