Abstract: The present invention relates to a scanning probe microscope. The scanning probe microscope can be configured to remove a polymeric material from a surface of a nanostructure. The scanning probe microscope includes a metal coated probe tip and a voltage source. The voltage source can be configured to apply a bias voltage between the probe tip and a sample. The bias voltage can be between 0.5 V and 2 V. The scanning probe microscope further includes a sample positioner configured to position the sample in relation to the probe tip and a system controller configured to control the scanning probe microscope.

Abstract: The present invention relates to a method for removing a polymeric material from a surface of a nanostructure. The method includes applying, by a scanning probe microscope, an electrical field between a probe tip of the scanning probe microscope and the nanostructure, and simultaneously scanning over the surface of the nanostructure. Thereby, bonds connecting the polymeric material to the surface of the nanostructure are broken. A further step includes cleaning the surface of the nanostructure. A scanning probe microscope for performing such a method and a computer program product for controlling the scanning probe microscope are also disclosed.

Abstract: The present invention relates to a method for removing a polymeric material from a surface of a nanostructure. The method includes applying, by a scanning probe microscope, an electrical field between a probe tip of the scanning probe microscope and the nanostructure, and simultaneously scanning over the surface of the nanostructure. Thereby, bonds connecting the polymeric material to the surface of the nanostructure are broken. A further step includes cleaning the surface of the nanostructure. A scanning probe microscope for performing such a method and a computer program product for controlling the scanning probe microscope are also disclosed.

Abstract: A semiconductor structure is provided including an electrically-conducting substrate and a layer of a two-dimensional material. The structure further includes a solid organic spacer layer arranged between the electrically-conducting substrate and the layer of the two-dimensional material.

Abstract: A method is provided for fabricating a structure including a two-dimensional material. The method includes a step of providing an electrically-conducting substrate and a step of forming a solid organic spacer layer on the electrically-conducting substrate. The method further includes depositing the two-dimensional material on the spacer layer. A structure formed according to the method includes an electrically-conducting substrate and a layer of a two-dimensional material. A solid organic spacer layer is arranged between the electrically-conducting substrate and the layer of the two-dimensional material.

Abstract: A semiconductor structure is provided including an electrically-conducting substrate and a layer of a two-dimensional material. The structure further includes a solid organic spacer layer arranged between the electrically-conducting substrate and the layer of the two-dimensional material.

Abstract: The present invention relates to a method for removing a polymeric material from a surface of a nanostructure. The method includes applying, by a scanning probe microscope, an electrical field between a probe tip of the scanning probe microscope and the nanostructure, and simultaneously scanning over the surface of the nanostructure. Thereby, bonds connecting the polymeric material to the surface of the nanostructure are broken. A further step includes cleaning the surface of the nanostructure. A scanning probe microscope for performing such a method and a computer program product for controlling the scanning probe microscope are also disclosed.

Abstract: A method is provided for fabricating a structure including a two-dimensional material. The method includes a step of providing an electrically-conducting substrate and a step of forming a solid organic spacer layer on the electrically-conducting substrate. The method further includes depositing the two-dimensional material on the spacer layer. A structure formed according to the method includes an electrically-conducting substrate and a layer of a two-dimensional material. A solid organic spacer layer is arranged between the electrically-conducting substrate and the layer of the two-dimensional material.