Patents by Inventor Piotr Jozef MICHALIK

Piotr Jozef MICHALIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit comprising multi-layer micromechanical structures with improved mass and reliability by using modified vias and method for forming the same
    Patent number: 10065855
    Abstract: An integrated circuit and the method to produce the integrated circuit comprising: a substrate (10); active devices (11); plurality of metal layers (17), wherein said metal layers are separated by dielectric layers (13) and connected to each other by plurality of vias (19); at least one micromechanical region (15) wherein some of the dielectric layers are removed leaving hollow spaces (23), thereby some of said metal and via layers form a micromechanical device in said micromechanical region, wherein said micromechanical device comprises at least one multi-layer structure (165) that is built of a plurality of metal layers and at least one via layer and said multi-layer structure is characterized by that at least two metal layers of said multi-layer structure are joined by at least one modified via (41).
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: September 4, 2018
    Assignees: UNIVERISTAT POLITECNICA DE CATALUNYA
    Inventors: Piotr Jozef Michalik, Daniel Fernández Martínez, Jordi Madrenas Boadas
  • INTEGRATED CIRCUIT COMPRISING MULTI-LAYER MICROMECHANICAL STRUCTURES WITH IMPROVED MASS AND RELIABILITY BY USING MODIFIED VIAS AND METHOD FOR FORMING THE SAME
    Publication number: 20180148329
    Abstract: An integrated circuit and the method to produce the integrated circuit comprising: a substrate (10); active devices (11); plurality of metal layers (17), wherein said metal layers are separated by dielectric layers (13) and connected to each other by plurality of vias (19); at least one micromechanical region (15) wherein some of the dielectric layers are removed leaving hollow spaces (23), thereby some of said metal and via layers form a micromechanical device in said micromechanical region, wherein said micromechanical device comprises at least one multi-layer structure (165) that is built of a plurality of metal layers and at least one via layer and said multi-layer structure is characterised by that at least two metal layers of said multi-layer structure are joined by at least one modified via (41).
    Type: Application
    Filed: April 20, 2016
    Publication date: May 31, 2018
    Inventors: Piotr Jozef MICHALIK, Daniel FERNÁNDEZ MARTÍNEZ, Jordi MADRENAS BOADAS