Patents by Inventor Piotr MAKARUK

Piotr MAKARUK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microphone probe, method, system and computer program product for audio signals processing
    Patent number: 10455323
    Abstract: The invention concerns a microphone probe having a body being substantially a first solid of revolution with a number of audio sensors distributed thereon and located in the recesses. The recesses have substantially a shape of a second body of revolution with an axis of symmetry perpendicular to the surface of the body. The sensors are connected to an acquisition unit, that delivers audio signals to the output. The audio sensors are digital audio sensors comprising printed circuit board with MEMS microphone element mounted thereon, wherein MEMS microphone element is mounted on the side of the printed circuit board facing the inner side of the body, so that the sound reaches MEMS microphone element via recess and opening. The depth of recesses is in a range between 3 and 20 mm. The acquisition unit has a clocking device determining common time base for audio sensors.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: October 22, 2019
    Assignee: ZYLIA SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA
    Inventors: Tomasz Zernicki, Maciej Kurc, Marcin Chryszczanowicz, Jakub Zamojski, Piotr Makaruk, Piotr Szczechowiak, Lukasz Januszkiewicz
  • MICROPHONE PROBE, METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR AUDIO SIGNALS PROCESSING
    Publication number: 20190052957
    Abstract: The invention concerns a microphone probe having a body being substantially a first solid of revolution with a number of audio sensors distributed thereon and located in the recesses. The recesses have substantially a shape of a second body of revolution with an axis of symmetry perpendicular to the surface of the body. The sensors are connected to an acquisition unit, that delivers audio signals to the output. The audio sensors are digital audio sensors comprising printed circuit board with MEMS microphone element mounted thereon, wherein MEMS microphone element is mounted on the side of the printed circuit board facing the inner side of the body, so that the sound reaches MEMS microphone element via recess and opening. The depth of recesses is in a range between 3 and 20 mm. The acquisition unit has a clocking device determining common time base for audio sensors.
    Type: Application
    Filed: February 9, 2017
    Publication date: February 14, 2019
    Inventors: Tomasz ZERNICKI, Maciej KURC, Marcin CHRYSZCZANOWICZ, Jakub ZAMOJSKI, Piotr MAKARUK, Piotr SZCZECHOWIAK, Lukasz JANUSZKIEWICZ