Abstract: A method for manufacturing modified electrically-conductive copper particles, includes introducing copper having an average diameter of 0.5 to 20 ?m into a water bath. The water bath has no complexing agents and no organic buffer agents. The water bath includes at least one water-soluble metal salt with at least one metal cation, at least one phosphoric reducing agent and at least one surfactant. The method includes heating the water bath with the copper particles to a temperature from 30 to 99° C. within a time necessary for forming, on the surface of the copper particles, an epitaxial metal layer of a thickness from 1 to 5 nm.