Patents by Inventor Piotr SYDOW

Piotr SYDOW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11312070
    Abstract: The object of the invention is a print head for three-dimensional printing comprising an extrusion assembly (1) functionally coupled to a drive assembly (3), and a nozzle assembly (2), functionally coupled to the extrusion assembly (1), providing filament (10) transfer, wherein there is a cooling assembly (18) disposed between the extrusion assembly (1) and the drive assembly (2), containing a fluid cooling system, comprising an inlet (15), an outlet (17) and a system of cooling ducts (14) disposed inside the cooling assembly (18), distributing the cooling medium (11), providing maintenance of the preset temperature of the extrusion assembly (1) and the drive assembly (3). The object of the invention is also a print head assembly.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: April 26, 2022
    Assignee: OMNI3D SP. Z.O.O.
    Inventors: Piotr Sydow, Tomasz Michalski, Piotr Maslej, Piotr Nawrocki, Kamil Wojtko, Krzysztof Kardach, Konrad Sierzputowski
  • Publication number: 20190184633
    Abstract: The object of the invention is a print head for three-dimensional printing comprising an extrusion assembly (1) functionally coupled to a drive assembly (3), and a nozzle assembly (2), functionally coupled to the extrusion assembly (1), providing filament (10) transfer, wherein there is a cooling assembly (18) disposed between the extrusion assembly (1) and the drive assembly (2), containing a fluid cooling system, comprising an inlet (15), an outlet (17) and a system of cooling ducts (14) disposed inside the cooling assembly (18), distributing the cooling medium (11), providing maintenance of the preset temperature of the extrusion assembly (1) and the drive assembly (3). The object of the invention is also a print head assembly.
    Type: Application
    Filed: April 3, 2017
    Publication date: June 20, 2019
    Inventors: Piotr SYDOW, Tomasz MICHALSKI, Piotr MASLEJ, Piotr NAWROCKI, Kamil WOJTKO, Krzysztof KARDACH, Konrad SIERZPUTOWSKI