Patents by Inventor Pit Kai Peter Cheng

Pit Kai Peter Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PWB manufacture
    Patent number: 6926922
    Abstract: A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: August 9, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Mei Kiu Leung, Willetta Lai, Pit Kai Peter Cheng, Cecilia Po Sze Wong
  • PWB manufacture
    Publication number: 20040022934
    Abstract: A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.
    Type: Application
    Filed: April 7, 2003
    Publication date: February 5, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Mei Kiu Leung, Willetta Lai, Pit Kai Peter Cheng, Cecilia Po Sze Wong