Abstract: A method for forming resin coated refractory aggregates and the resulting resin coated aggregates which can be used for forming refractory shapes such as furnace linings, bricks, etc. The process includes contacting a heated refractory material in particulate form with a resin or resin solution which is then shaped or projected or otherwise compacted, exhibiting high green strength when cold pressed. Substantially reduced organic emissions are the result.

Abstract: A raw batch composition for use in making a shaped article such as a foundry shape or refractory article is disclosed. The composition comprises a mixture of an aggregate material; a phenol formaldehyde novolak resin; a phenol formaldehyde resole resin; and an ester functional curing agent. A shaped article prepared from the composition and processes for making a refractory body or foundry article are also disclosed.

Abstract: The invention is a novel Soderberg electrode paste composition. The composition is a mixture comprising carbonaceous aggregate, novolac resin binder, plasticizer and optionally hexamethylenetetramine. The novolac resin of the binder has a melting point of at least 100.degree. C. and a free phenol content of not more than 4% by weight based on the weight of novolac resin solids. The residual coking value of the composition of the invention is at least as great as the minimum preferred coking value of traditional Soderberg pastes which are based on coal tar pitch binder.

Abstract: Describes the use of high performance phenol-formaldehyde resins in the fabrication of anodes, cathodes, and electrodes, for use in metallurgy. A carbonaceous aggregate mixed with binder material is formed into a compacted mass in a desired shape, and the resin is permitted to cure to form a self-sustaining shape. Upon carbonization of the shaped, compacted mass, electrodes and other desirable shapes may be produced. Also useful for ramming and tamping mixes. Provide environmentally safe binder replacements for coal tar pitch while providing excellent residual carbon contents and desirable electrical and physical properties.

Abstract: A finished resin comprising a highly condensed phenol formaldehyde resole resin which has green groups formed by a low condensation phenol formaldehyde resin, the finished resin being modified by addition of a weak acid and a non-cellulosic protective colloid to improve reactivity and flow properties thereof.

Abstract: Thermosetting water-immiscible phenol-formaldehyde resins in which a large proportion of the linkages between the benzene rings are benzyl ether linkages located ortho to the phenolic hydroxyl groups are produced by reaction of at least one mole of formaldehyde with 1 mole of phenol in an aqueous reaction medium in the presence of a metal carboxylate catalyst, such as, zinc acetate. Methods of control of the exothermic addition of formaldehyde to phenol are described.

Abstract: Rigid shaped articles are formed by providing a novel thermosetting phenol-formaldehyde resin having a characteristic structure and infra-red spectrum as a coating over the surfaces of a plurality of individual elements, forming the coated elements into a shape and thermosetting the resin of the coating.

Abstract: Stable aqueous emulsions are described which are free from conventional emulsifiers and protective colloids and contains as the dispersed phase uniformly-sized particles of a copolymer of at least 75% by weight of acrylate monomer(s) or a mixture of acrylate monomer(s) and a vinyl monomer, optionally together with up to 10% by weight of the acrylate monomer(s) or the mixture, of a copolymerizable monomer having at least one functional group or reactive site, and up to 25% by weight of a monoester of an unsaturated dicarboxylic acid. The emulsions are formed by copolymerizing the monomers in an aqueous medium which is free from conventional additives including buffers, emulsifiers, stabilizing colloids and chain terminating compounds. The emulsions are particularly useful in formulating water-based air-drying high gloss paints.

Abstract: A rapidly curable phenol-formaldehyde resin is provided in the form of an emulsion which has particular utility in panel board production, particularly waferboard production.

Abstract: Thermosetting phenol-formaldehyde resins having novel structures and properties are described. In one embodiment, there is provided a novel thermosetting phenol-formaldehyde resin having benzyl ether linkages ortho to the phenolic hydroxyl group and characterized by its infra-red spectrum which exhibits absorption at wave numbers of about 1010 cm.sup.-1, 1060 cm.sup.-1 and 1230 cm.sup.-1. The infra-red spectrum has a particular ratio of absorbance at 1010 cm.sup.-1, measured from a base line drawn between wave numbers of 1030 cm.sup.-1 and 950 cm.sup.-1, to that at 1230 cm.sup.-1, measured from a base line drawn between wave numbers of 1130 cm.sup.-1 and 1310 cm.sup.-1 which is less than about 0.1. These novel resins are prepared by the controlled addition of strong acids to thermosetting phenol-formaldehyde resins having the benzyl ether linkages and an infra-red spectrum exhibiting large adsorption at wave numbers of 1230 cm.sup.-1, 1060 cm.sup.-1 and 1010 cm.sup.

Abstract: A novel thermosetting phenol-formaldehyde resin having a preponderance of benzyl ether linkages is characterized by its infra-red spectrum which exhibits absorption at wave numbers of about 1010 cm.sup.-.sup.1, 1050 cm.sup.-.sup.1 and 1230 cm.sup.-.sup.1. The infrared spectrum has a particular ratio of absorbance at 1010 cm.sup.-.sup.1, measured from a base line drawn between wave members of 1030 cm.sup.-.sup.1 and 950 cm.sup.-.sup.1, to that at 1230 cm.sup.-.sup.1, measured from a base line drawn between wave numbers of 1130 cm.sup.-.sup.1 and 1310 cm.sup.-.sup.1 which is less than about 0.1. These novel resins are prepared by the controlled addition of strong acids to thermosetting phenol-formaldehyde resins having a preponderance of benzyl ether linkages and an infrared spectrum exhibiting large adsorption at wave numbers of 1230 cm.sup.-.sup.1, 1050 cm.sup.-.sup.1 and 1010 cm.sup.-.sup.1, causing a decrease of at least 35% in the ratio of absorbance at 1010 cm.sup.-.sup.

Abstract: A rapidly curable phenol-formaldehyde resin is provided in the form of an emulsion which has particular utility in panel board production, particularly waferboard production.