Abstract: Packaged MEMS devices are described. One such device includes a substrate having an active surface with an integrated circuit. Two substrate pads are formed on the substrate; one pad is a closed ring pad. The device also includes a cap wafer with two wafer pads. One of these wafer pads is also a closed ring pad. A hermetic seal ring is formed by a first bonding between the two ring pads. The device has a gap between the substrate and the cap wafer. This gap may be filled with a pressurized gas. An electrical connection is formed by a second bonding between one substrate pad and one wafer pad. An electrical contact is disposed over the cap wafer. The device also includes an insulation layer between the electrical contact and the cap wafer. Methods of producing the packaged MEMS devices are also described.

Abstract: The present disclosure discloses a method for wafer-level chip scale packaged wafer testing. The method comprises: dicing a wafer-level chip scale packaged wafer into a plurality of wafer strips each comprising a plurality of un-diced chip scale packaged devices; fixing the wafer strips onto a plurality of corresponding strip carriers respectively; testing the chip scale packaged devices of the wafer strips fixed onto the strip carriers by a testing equipment; and dicing the tested wafer strips into a plurality of individual chip scale packaged devices. Since the proposed method does not involve loading a multitude of diced chips into sockets one by one, but that a limited number of wafer strips are loaded onto corresponding strip carriers, flow jam is avoided.

Abstract: The present disclosure discloses a method for wafer-level chip scale packaged wafer testing. The method comprises: dicing a wafer-level chip scale packaged wafer into a plurality of wafer strips each comprising a plurality of un-diced chip scale packaged devices; fixing the wafer strips onto a plurality of corresponding strip carriers respectively; testing the chip scale packaged devices of the wafer strips fixed onto the strip carriers by a testing equipment; and dicing the tested wafer strips into a plurality of individual chip scale packaged devices. Since the proposed method does not involve loading a multitude of diced chips into sockets one by one, but that a limited number of wafer strips are loaded onto corresponding strip carriers, flow jam is avoided.

Abstract: Packaged MEMS devices are described. One such device includes a substrate having an active surface with an integrated circuit. Two substrate pads are formed on the substrate; one pad is a closed ring pad. The device also includes a cap wafer with two wafer pads. One of these wafer pads is also a closed ring pad. A hermetic seal ring is formed by a first bonding between the two ring pads. The device has a gap between the substrate and the cap wafer. This gap may be filled with a pressurized gas. An electrical connection is formed by a second bonding between one substrate pad and one wafer pad. An electrical contact is disposed over the cap wafer. The device also includes an insulation layer between the electrical contact and the cap wafer. Methods of producing the packaged MEMS devices are also described.

Abstract: Disclosed herein are methods of preparing and using doped MWNT electrodes, sensors and field-effect transistors. Devices incorporating doped MWNT electrodes, sensors and field-effect transistors are also disclosed.

Abstract: Disclosed herein are methods of preparing and using doped MWNT electrodes, sensors and field-effect transistors. Devices incorporating doped MWNT electrodes, sensors and field-effect transistors are also disclosed.

Abstract: Nanostructures comprising carbon and metal catalyst that are formed on a substrate, such as a silicon substrate, are contacted with a composition that, among other useful modifications, protects the nano structures and renders them stable in the presence of oxidizing agents in an aqueous environment. The protected nano structures are rendered stable over an extended period of time and thereby remain useful during such period as components of an electrode, for example, for detecting electrochemical species such as free chlorine, total chlorine, or both in water.

Abstract: Disclosed herein are apparatus and methods for selectively depositing molecular ions on nanoscale substrates such as carbon nanotube arrays using electrospray ionization.

Abstract: Disclosed herein are methods of preparing and using doped MWNT electrodes, sensors and field-effect transistors. Devices incorporating doped MWNT electrodes, sensors and field-effect transistors are also disclosed.

Abstract: Disclosed herein are apparatus and methods for selectively depositing molecular ions on nanoscale substrates such as carbon nanotube arrays using electrospray ionization.

Abstract: Disclosed herein are methods of preparing and using doped MWNT electrodes, sensors and field-effect transistors. Devices incorporating doped MWNT electrodes, sensors and field-effect transistors are also disclosed. Also disclosed are devices comprising nanostructured electrodes and methods for measuring free chlorine in an aqueous environment. Also disclosed are diamond coated electrodes for use in electrochemical applications.

Abstract: A multi-sensor apparatus for monitoring a fluid is described. The apparatus includes a plurality of sensors, wherein each sensor is configured to be exposed to a fluid, and includes at least one membrane that covers the plurality of sensors. A mechanical member or a heating element can be used to selectively expose a particular sensor to the fluid leaving another of the sensors unexposed to the fluid.

Abstract: Various sensor unit configurations are disclosed within the context of a fluid quality monitoring system. The distribution of sensor units can be accomplished using existing product distribution channels to sell, distribute and install sensor units so that a fluid distribution monitoring system can be established at relatively low cost, on a wider basis, and by locating sensor units at the most desirable location from problem detection standpoint, the location of the end user.

Abstract: Various sensor unit configurations are disclosed within the context of a fluid quality monitoring system. The distribution of sensor units can be accomplished using existing product distribution channels to sell, distribute and install sensor units so that a fluid distribution monitoring system can be established at relatively low cost, on a wider basis, and by locating sensor units at the most desirable location from problem detection standpoint, the location of the end user.

Abstract: Various sensor unit configurations are disclosed within the context of a fluid quality monitoring system. The distribution of sensor units can be accomplished using existing product distribution channels to sell, distribute and install sensor units so that a fluid distribution monitoring system can be established at relatively low cost, on a wider basis, and by locating sensor units at the most desirable location from problem detection standpoint, the location of the end user.