Patents by Inventor Piyaphant Utthachoo

Piyaphant Utthachoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solution deposition assembly
    Patent number: 8631757
    Abstract: Methods and devices are provided for improved deposition systems. In one embodiment of the present invention, a deposition system is provided for use with a solution and a substrate. The system comprises of a solution deposition apparatus; at least one heating chamber; at least one assembly for holding a solution over the substrate; and a substrate curling apparatus for curling at least one edge of the substrate to define a zone capable of containing a volume of the solution over the substrate. In another embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: January 21, 2014
    Assignee: Nanosolar, Inc.
    Inventors: Yann Roussillon, Jeremy H. Scholz, Addison Shelton, Geoff T. Green, Piyaphant Utthachoo
  • Solution deposition assembly
    Patent number: 8601973
    Abstract: Methods and devices are provided for improved sputtering systems. In one embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: December 10, 2013
    Assignee: Nanosolar, Inc.
    Inventors: Yann Roussillon, Piyaphant Utthachoo
  • THIN FILM BUFFER LAYER SOLUTION DEPOSITION ASSEMBLY
    Publication number: 20120045533
    Abstract: Methods and devices are provided for improved deposition systems. In one non-limiting example, a deposition system is provided for use with a solution and a substrate. The system comprises of a solution deposition apparatus; at least one heating chamber; at least one assembly for holding a solution over the substrate; and a substrate curling apparatus for curling at least one edge of the substrate to define a zone capable of containing a volume of the solution over the substrate. In another embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.
    Type: Application
    Filed: May 10, 2011
    Publication date: February 23, 2012
    Inventors: Ivano Gregoratto, Jeremy H. Scholz, Piyaphant Utthachoo
  • SOLUTION DEPOSITION ASSEMBLY
    Publication number: 20100300352
    Abstract: Methods and devices are provided for improved deposition systems. In one embodiment of the present invention, a deposition system is provided for use with a solution and a substrate. The system comprises of a solution deposition apparatus; at least one heating chamber; at least one assembly for holding a solution over the substrate; and a substrate curling apparatus for curling at least one edge of the substrate to define a zone capable of containing a volume of the solution over the substrate. In another embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.
    Type: Application
    Filed: October 17, 2008
    Publication date: December 2, 2010
    Inventors: Yann Roussillon, Piyaphant Utthachoo, Geoffrey T. Green, Addison Shelton, Jeremy H. Scholz
  • Solution Deposition Assembly
    Publication number: 20100050935
    Abstract: Methods and devices are provided for improved deposition systems. In one embodiment of the present invention, a deposition system is provided for use with a solution and a substrate. The system comprises of a solution deposition apparatus; at least one heating chamber; at least one assembly for holding a solution over the substrate; and a substrate curling apparatus for curling at least one edge of the substrate to define a zone capable of containing a volume of the solution over the substrate. In another embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.
    Type: Application
    Filed: February 11, 2009
    Publication date: March 4, 2010
    Inventors: Yann Roussillon, Jeremy H. Scholz, Addison Shelton, Geoff T. Green, Piyaphant Utthachoo
  • Solution Deposition Assembly
    Publication number: 20090120359
    Abstract: Methods and devices are provided for improved sputtering systems. In one embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.
    Type: Application
    Filed: September 2, 2008
    Publication date: May 14, 2009
    Inventors: Yann Roussillon, Piyaphant Utthachoo