Patents by Inventor Piyou Cheng
Piyou Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147134Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: May 2, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137684Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137683Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137682Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137693Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137687Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137689Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137692Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137690Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137681Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 19, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Patent number: D1006787Type: GrantFiled: April 21, 2022Date of Patent: December 5, 2023Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1006788Type: GrantFiled: April 21, 2022Date of Patent: December 5, 2023Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zhi Cai, Lei Zhong, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1012885Type: GrantFiled: April 21, 2022Date of Patent: January 30, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1012886Type: GrantFiled: April 21, 2022Date of Patent: January 30, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zhi Cai, Lei Zhong, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1012889Type: GrantFiled: April 21, 2022Date of Patent: January 30, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1014456Type: GrantFiled: April 21, 2022Date of Patent: February 13, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1014457Type: GrantFiled: April 21, 2022Date of Patent: February 13, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1014458Type: GrantFiled: April 21, 2022Date of Patent: February 13, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1016035Type: GrantFiled: April 21, 2022Date of Patent: February 27, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
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Patent number: D1016778Type: GrantFiled: April 21, 2022Date of Patent: March 5, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zhi Cai, Lei Zhong, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang