Patents by Inventor Po-An Lin
Po-An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240403478Abstract: The subject system may be implemented by at least one processor configured to, by a system process, receive a request for one or more content item bundles, obtain the one or more content item bundles for presentation of the one or more content item bundles, receive a selection of a content item bundle from the presented one or more content item bundles, and providing, to the application process, one or more content items of the selected content item bundle. The one or more content item bundles are inaccessible to an application process before they are provided to the application process by the system process.Type: ApplicationFiled: October 30, 2023Publication date: December 5, 2024Inventors: Yann J. RENARD, Adeeti V. ULLAL, Daniel M. TRIETSCH, Ehsan JAHANGIRI, Guanling FENG, Hyo Jeong SHIN, Joseph-Alexander P. WEIL, Mariah W. WHITMORE, Po An LIN, Rene F. AGUIRRE RAMOS
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Patent number: 11997783Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.Type: GrantFiled: May 27, 2022Date of Patent: May 28, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Po-An Lin, Huei-Shyong Cho, Shih-Wen Lu
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Publication number: 20240162612Abstract: The present disclosure provides an electronic device. The electronic device includes a first transceiving element, a second transceiving element disposed over the first transceiving element, and a radiating structure configured to radiate a first EM wave having a lower frequency and a second EM wave having a higher frequency. The first transceiving element and the second transceiving element are collectively configured to provide a higher gain or bandwidth for the first EM wave than for the second EM wave.Type: ApplicationFiled: November 10, 2022Publication date: May 16, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-An LIN, Guan-Wei CHEN, Shih-Wen LU
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Publication number: 20230389821Abstract: Enclosed are embodiments for estimating vertical oscillation (VO) at the wrist. In some embodiments, a method comprises: obtaining, with a wearable device worn on a wrist of a user, sensor data indicative of the user's acceleration and rotation rate; estimating centripetal acceleration based on the user's acceleration and rotation rate; calculating a modified user's acceleration by subtracting the estimated centripetal acceleration from the user's acceleration; estimating center of mass (CoM) acceleration by decoupling an arm swing component of the user's acceleration from the modified user's acceleration; and computing vertical oscillation of the user's CoM using a machine learning model with at least the CoM acceleration as input to the machine learning model, or by integrating vertical acceleration derived from the CoM acceleration and a gravity vector.Type: ApplicationFiled: June 2, 2023Publication date: December 7, 2023Inventors: Richard A. Fineman, Adeeti V. Ullal, Allison L. Gilmore, Gabriel A. Blanco, Karthik Jayaraman Raghuram, Mark P. Sena, Maryam Etezadi-Amoli, James J. Dunne, Po An Lin
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Publication number: 20230389824Abstract: Enclosed are embodiments for estimating gait time events and GCT using a wrist-worn device. In some embodiments, a method comprises: obtaining, with at least one processor of a wrist-worn device, sensor data indicative of acceleration and rotation rate; and predicting, with the at least one processor, at least one gait event time based on a machine learning (ML) model with the acceleration and rotation rate as input to the ML model.Type: ApplicationFiled: June 2, 2023Publication date: December 7, 2023Inventors: Allison L. Gilmore, Adeeti V. Ullal, Alexander G. Bruno, Eugene Song, Gabriel A. Blanco, James J. Dunne, João Antunes, Karthik Jayaraman Raghuram, Po An Lin, Richard A. Fineman, William R. Powers, III, Asif Khalak
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Publication number: 20230389173Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.Type: ApplicationFiled: May 27, 2022Publication date: November 30, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-An LIN, Huei-Shyong CHO, Shih-Wen LU
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Patent number: 11478966Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: GrantFiled: December 23, 2019Date of Patent: October 25, 2022Assignee: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Publication number: 20210031489Abstract: The present disclosure provides a composite material including a first thermoplastic adhesive layer made of a first thermoplastic resin, a second thermoplastic adhesive layer made of a second thermoplastic resin, and a core layer. The core layer has a first surface and a second surface, wherein the first surface is bonded to the first thermoplastic adhesive layer, and the second surface is bonded to the second thermoplastic adhesive layer. The core layer has a plurality of cavities, wherein each of the plurality of cavities has a pore diameter smaller than a thickness of the core layer. The first thermoplastic resin and the second thermoplastic resin are respectively adapted to be filled in a part of the plurality of cavities adjacent to the first surface of the core layer and a part of the plurality of cavities adjacent to the second surface of the core layer by heating.Type: ApplicationFiled: October 20, 2019Publication date: February 4, 2021Applicant: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Po-An Lin
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Publication number: 20200130243Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: ApplicationFiled: December 23, 2019Publication date: April 30, 2020Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Patent number: 10369827Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.Type: GrantFiled: October 11, 2017Date of Patent: August 6, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
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Publication number: 20190054750Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.Type: ApplicationFiled: October 11, 2017Publication date: February 21, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
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Publication number: 20190025882Abstract: A casing including a plate member and a resin member is provided. The plate member has a bottom surface and includes a first surface layer, a second surface layer and a core layer. The first surface layer has a plurality of first through holes and disposed on at least one edge of the first surface layer. The first surface layer and the second surface layer are oppositely disposed on two sides of the core layer. The resin member covers edges and the bottom surface of the plate member and has an extension portion. The extension portion extends between the first surface layer and the second surface layer and adjacent to the core layer. The extension portion further extends to the plurality of first through holes. A manufacturing method of the casing is also provided.Type: ApplicationFiled: July 16, 2018Publication date: January 24, 2019Inventors: Han-Ching Huang, Po-An Lin, Jung-Chin Wu, Kuo-Nan Ling
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Publication number: 20180264873Abstract: A decorative film structure includes a foamed resin layer and a protective resin layer. The protective resin layer is disposed on the foamed resin layer and has a stereoscopic patterned surface relatively far from the foamed resin layer. A manufacturing method of the decorative film structure is also provided.Type: ApplicationFiled: March 14, 2018Publication date: September 20, 2018Applicant: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Po-An Lin, Sheng-Hung Lee, Kuo-Nan Ling, Chih-Hua Liu
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Publication number: 20160052247Abstract: A manufacturing process for vacuum heat transfer printing is used for transfer printing a pattern of a film onto a main surface of a workpiece. The manufacturing process for vacuum heat transfer printing includes: disposing the workpiece and the film in a mold cavity, wherein the film is located above the main surface of the workpiece, and the main surface is divided into a plurality of blocks; heating the mold cavity; and providing different negative pressures into the mold cavity corresponding to each of the blocks, such that the film is vacuumed onto the blocks in sequence and the patterns are transfer printed onto the main surface of the workpiece in sequence. A jig for the manufacturing process for vacuum heat transfer printing is also provided.Type: ApplicationFiled: January 18, 2015Publication date: February 25, 2016Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Kuo-Nan Ling, Po-An Lin
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Patent number: 9242426Abstract: A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.Type: GrantFiled: October 18, 2012Date of Patent: January 26, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang, Chih-Wen Chiang, Yen-Ling Liu
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Publication number: 20150366088Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: ApplicationFiled: May 18, 2015Publication date: December 17, 2015Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Patent number: 9176533Abstract: A display device is provided, which includes a back cover and a display module. The back cover has a positioning slot. The display module includes a first frame, a panel module and at least hinge bracket. The first frame is fixed to the back cover. The panel module is fixed to the first frame. The hinge bracket is screwless-mounted to the first frame. One end of the hinge bracket is inserted into the positioning slot to fix the display module to the back cover. Besides, a method for assembling a display device is also provided.Type: GrantFiled: September 13, 2012Date of Patent: November 3, 2015Assignee: COMPAL ELECTRONICS, INC.Inventors: Pai-Feng Chen, Po-An Lin, Kuo-Nan Ling, Yung-Hui Chen
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Patent number: 8911581Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.Type: GrantFiled: June 11, 2013Date of Patent: December 16, 2014Assignee: Compal Electronics, Inc.Inventors: Ju-Chen Chiu, Chien-Min Chang, Po-An Lin, Chih-Hua Liu, Hao-Ying Chang
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Patent number: 8773606Abstract: A display module including an electronic component and a panel module is provided. The electronic component is installed inside the display module. The panel module includes a first side and a second side, and the first side includes a glass module having an electro-conductive material and a display region, wherein the glass module includes an electronic component projection area and the electronic component projection area does not contain the electro-conductive material to prevent affecting the performance of the electronic component. The electronic component projection area is an area where the electronic component is projected on the panel module along a normal direction of the display region. According to a design requirement of the product, the electronic component may be fixed to a frame combined with the panel module or located in the glass module.Type: GrantFiled: June 29, 2011Date of Patent: July 8, 2014Assignee: Compal Electronics, Inc.Inventors: Kuo-Nan Ling, Po-An Lin, Yung-Hui Chen
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Publication number: 20140178636Abstract: Provided is a composite material including a first surface layer, a second surface layer, and a core layer. The first surface layer includes a first fiber material layer and a first resin impregnated therein. The second surface layer includes a second fiber material layer and a second resin impregnated therein. The core layer is disposed between the first surface layer and the second surface layer and has a plurality of through holes, wherein the first resin and the second resin penetrate into each of the through holes, combining with each other, and forming a connecting column in each of the through holes.Type: ApplicationFiled: December 13, 2013Publication date: June 26, 2014Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Han-Ching Huang