Abstract: A light guide plate with multi-directional structures includes a main body, a plurality of first microstructures and a plurality of second microstructures. The main body includes a light-incident surface, a light-emitting surface and a reflecting surface. The light-incident surface connects the light-emitting surface and the reflecting surface. The first microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a first extending direction. The second microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a second extending direction. The second microstructures and the first microstructures are disposed on the same plane and intersect with each other. Each of the second microstructures is a single stripe pattern, and has a width which becomes gradually smaller from one end of the second microstructure near the light-incident surface to the other end of the second microstructure away from the light-incident surface.

Abstract: A method for forming a photosensitive module is provided. The method includes providing a substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A cover plate is provided on the first surface of the substrate. An opening is formed. The opening penetrates the substrate and exposes the conducting pad. A redistribution layer is formed in the first opening to electrically connect to the conducting pad. The cover plate is removed and a dicing process is performed to form a sensing device. The sensing device is bonded to a circuit board. An optical component is mounted on the circuit board and corresponds to the sensing device. A photosensitive module formed by the method is also provided.

Abstract: System and method for replacing a resist filter in such a manner as to reduce filter-induced wafer defects are described. In one embodiment, the system comprises a filtration system connected to a dispenser, the filtration system comprising a filter; and a switch connected to the filter for selectively connecting the filtration system to throughput one of a first chemical solution and a second chemical solution.

Abstract: Disclosed herein is a system and method for producing semiconductor devices using overlays, the method comprising associating one or more patterned overlays with respective ones of reserved regions in a layer template, receiving a layer design based on the layer template, identifying the reserved regions in the layer design, generating a production layer design based on the layer design, the production layer design describing at least one production overlay in one of the reserved regions, and fabricating one or more devices based on the production layer design.

Abstract: Disclosed herein is a system and method for producing semiconductor devices using overlays, the method comprising associating one or more patterned overlays with respective ones of reserved regions in a layer template, receiving a layer design based on the layer template, identifying the reserved regions in the layer design, generating a production layer design based on the layer design, the production layer design describing at least one production overlay in one of the reserved regions, and fabricating one or more devices based on the production layer design.

Abstract: Disclosed herein is a system and method for producing semiconductor devices using overlays, the method comprising associating one or more patterned overlays with respective ones of reserved regions in a layer template, receiving a layer design based on the layer template, identifying the reserved regions in the layer design, generating a production layer design based on the layer design, the production layer design describing at least one production overlay in one of the reserved regions, and fabricating one or more devices based on the production layer design.

Abstract: A light guide plate with multi-directional structures includes a main body, a plurality of first microstructures and a plurality of second microstructures. The main body includes a light-incident surface, a light-emitting surface and a reflecting surface. The light-incident surface connects the light-emitting surface and the reflecting surface. The first microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a first extending direction. The second microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a second extending direction. The second microstructures and the first microstructures are disposed on the same plane and intersect with each other. Each of the second microstructures is a single stripe pattern, and has a width which becomes gradually smaller from one end of the second microstructure near the light-incident surface to the other end of the second microstructure away from the light-incident surface.

Abstract: System and method for replacing a resist filter in such a manner as to reduce filter-induced wafer defects are described. In one embodiment, the system comprises a filtration system connected to a dispenser, the filtration system comprising a filter; and a switch connected to the filter for selectively connecting the filtration system to throughput one of a first chemical solution and a second chemical solution.

Abstract: System and method for replacing a resist filter in such a manner as to reduce filter-induced wafer defects are described. In one embodiment, the system comprises a filtration system connected to a dispenser, the filtration system comprising a filter; and a switch connected to the filter for selectively connecting the filtration system to throughput one of a first chemical solution and a second chemical solution.

Abstract: A Schottky diode with a lowered forward voltage drop has an N? type doped drift layer formed on an N+ type doped layer. The N? type doped drift layer has a surface formed with a protection ring inside which is a P-type doped layer. The surface of the N? type doped drift layer is further formed with an oxide layer and a metal layer. The contact region between the metal layer and the N? type doped drift layer within the P-type doped layer forms a Schottky barrier. An upward extending N type doped layer is formed on the N+ type doped layer and under the Schottky barrier to reduce the thickness of the N? type doped drift layer under the Schottky barrier. This lowers the forward voltage drop of the Schottky diode.

Abstract: A wafer edge exposure unit comprises a chuck for supporting a wafer. The chuck is rotatable about a central axis. A plurality of light sources are positioned or movably positionable with a common radial distance from the axis of the rotatable chuck, each light source configured to direct exposure light on a respective edge portion of the wafer simultaneously.

Abstract: A wafer edge exposure unit comprises a chuck for supporting a wafer. The chuck is rotatable about a central axis. A plurality of light sources are positioned or movably positionable with a common radial distance from the axis of the rotatable chuck, each light source configured to direct exposure light on a respective edge portion of the wafer simultaneously.

Abstract: System and method for replacing a resist filter in such a manner as to reduce filter-induced wafer defects are described. In one embodiment, the system comprises a filtration system connected to a dispenser, the filtration system comprising a filter; and a switch connected to the filter for selectively connecting the filtration system to throughput one of a first chemical solution and a second chemical solution.

Abstract: Judgment systems and methods. The system includes a signal gathering module, an attribute retrieval module, a rule retrieval module, and a rule execution module. The signal gathering module receives identification of at least a first card and a second card, and defines statuses thereof. The attribute retrieval module retrieves attributes corresponding to the first and second cards according to the identification thereof. The rule retrieval module retrieves a rule according to the identification and statuses of the first and second cards. The rule execution module performs the rule on the first and second cards to change the attributes thereof.

Abstract: Judgment systems and methods. The system includes a signal gathering module, an attribute retrieval module, a rule retrieval module, and a rule execution module. The signal gathering module receives identification of at least a first card and a second card, and defines statuses thereof. The attribute retrieval module retrieves attributes corresponding to the first and second cards according to the identification thereof. The rule retrieval module retrieves a rule according to the identification and statuses of the first and second cards. The rule execution module performs the rule on the first and second cards to change the attributes thereof.

Abstract: A method and apparatus for rinsing and drying a substrate (100) of a semiconductor wafer (102), has a first nozzle (110) dispensing rinsing fluid against the substrate (100); and a second nozzle (114) dispensing dry gas under pressure against the substrate (100) during a drying cycle to dry the substrate (100) completely. The second nozzle (114) can point to the substrate (100) while the substrate (100) spins. The nozzles (110) and (114) can be positioned by a robot arm (112).

Abstract: A developer dispensing apparatus for dispensing developer solution onto a semiconductor wafer substrate which has a vertically-adjustable knife ring. The knife ring is vertically actuated in the apparatus by pressurized air or fluid. In an application, the gap distance between the upper edge of the knife ring and the backside of the wafer is initially adjusted to a minimum value as the developer solution is dispensed onto the wafer, by adjusting the knife ring to the uppermost position in the apparatus.