Abstract: In some examples, a device can include an antenna to emit waves in a radiation pattern having a first beamwidth, a directional radiation control device located in a path of the waves, where the directional radiation control device is to receive the waves from the antenna and is shaped to cause the waves to be directed in a different radiation pattern having a second beamwidth that is larger than the first beamwidth.

Abstract: The present disclosure provides an USB device and a system type determining method thereof. The system type determining method includes: determining, by the USB device, whether an USB host transmit at least one of an HID interrupt signal and an UAC1 status interrupt signal; and determining, by the USB device, a system type of the USB host according to the result of determining whether the USB host transmit at least one of the HID interrupt signal and the UAC1 status interrupt signal.

Abstract: Example embodiments relate to taking images at certain predetermined angles in order to have consistent exposure throughout the images. An example embodiment includes a method. The method includes determining, using a lidar device, light intensity information of a surrounding environment of the lidar device. The light intensity information includes a plurality of angles within a threshold range of light exposure. The method also includes determining rotation times associated with each of the angles within the threshold range of light exposure. Further, the method includes based on the rotation times associated with each of the angles within the threshold range of light exposure, determining a plurality of target image times. In addition, the method includes capturing, by a camera system, a plurality of images at the plurality of target image times.

Abstract: An example method includes receiving, from a light detector, information indicative of a light intensity of a field of view of an optical system. The optical system includes one or more optical components and a light detector configured to receive light from a field of view of an environment of the optical system by way of the one or more optical components. The optical system also includes an occlusion-detection camera configured to capture images of the one or more optical components. The example method also includes adjusting, based on the received information, at least one operating parameter of the occlusion-detection camera. The example method also includes causing the occlusion-detection camera to capture at least one image of the one or more optical components according to the at least one adjusted operating parameter.

Abstract: A water dispensing apparatus includes a main body having an inlet channel, an outlet channel and a throughpath provided therebetween, a pivot valve mounted pivotally through the throughpath, which includes a water sealing portion and a water passing portion opposite to each other, and a first sheltering member and a second sheltering member coupled respectively at two sides of the main body, and an actuation member extended operatively between the first sheltering member and the second sheltering member of the pivot valve.

Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

Abstract: An assembly of semiconductor and highly thermally conductive heat-dissipating substrates includes a thermally conductive metal substrate, a supporting substrate, and a vertical heat-dissipating block. The thermally conductive metal substrate comprises a substrate body, a receiving groove in the substrate body, and a thin-layer portion at a bottom side of the receiving groove. The supporting substrate is provided in the receiving groove. The two vertically opposite sides of the supporting substrate respectively form a carrying surface for carrying a laser diode LD and a heat-dissipating surface in contact with the thin-layer portion at the bottom side of the receiving groove. The vertical heat-dissipating block is provided on a side of the thermally conductive metal substrate opposing to a side with the receiving groove.

Abstract: The invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer, and an edge emitting laser diode. The heat-dissipating substrate has one side formed with a flat surface for mounting the edge emitting laser diode. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate and/or the metal solder layer have a groove. The ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate and metal solder layer from contacting the ridge of the edge emitting laser diode.

Abstract: An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.

Abstract: An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.

Abstract: The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer. The heat-dissipating substrate includes a substrate body and a socket formed on the substrate body; and the heat-conducting metal layer widely covers the socket of the substrate body and have one side formed as a loaded side on which a laser semiconductor is to be mounted and a opposite side formed as a heat-dissipating side, so that after the loaded side absorbs heat from the laser semiconductor, the heat-dissipating side reverse to the heat-conducting metal layer diffuses the heat to the heat-dissipating substrate.

Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.

Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.

Abstract: The present invention relates to a two-end driving, high-frequency sub-substrate structure, comprising a sub-substrate body, wherein: the sub-substrate body has an upper side provided with a first signal pad area and a second signal pad area, the first signal pad area and the second signal pad area are symmetric with respect to each other, each of the first signal pad area and the second signal pad area extends from one of two lateral portions of the sub-substrate body in an extending direction toward a center of the sub-substrate body and terminates in an end, the end of the first signal pad area is adjacent to but spaced from the end of the second signal pad area, the first signal pad area is configured for supporting a semiconductor chip provided thereon, the second signal pad area is provided with a jumper wire connected to an electrode of the semiconductor chip, there are two grounding pad areas provided respectively on two lateral sides of the first signal pad area and the second signal pad area and con

Abstract: The present invention provides a switching structure of water dispensing apparatus, which is a switch pivotingly coupled in a lateral channel between an inlet channel and an outlet channel of a main body of the water dispensing apparatus. The switch includes a pivot valve, wherein the pivot valve is mounted in the lateral channel of the water dispensing apparatus. Two sides of the pivot valve are assemblingly connecting to an actuation member. The actuation member is arranged to pivotally move the pivot valve so as to bring the pivot valve to pivot and to therefore control the outlet opening between an open state and a close state. The pivot valve has a water sealing portion for closing the inlet opening. Accordingly, when the water sealing portion is misaligned with the inlet opening, the water dispensing apparatus is turned into an open state. When the water sealing portion is relatively seal on the inlet opening, the water dispensing apparatus is turned into an close state.

Abstract: A water dispensing apparatus includes a dispensing body including a nozzle, a control valve including a water sealing member and a pusher member, an actuation member coupled to the pusher member, and a control unit to drive the control valve to rotate. When the control valve is driven to rotate, the pusher member is driven to move correspondingly to reciprocatingly move the actuation member at different locations of the nozzle not only for switching on-and-off the control valve but also for controllably shifting different water spraying patterns of the nozzle. Therefore, is able to easily control different operations of the water dispensing apparatus in one single continuous action of the control unit.

Abstract: A water dispensing apparatus includes a dispensing body including a nozzle, a control valve including a water sealing member and a pusher member, an actuation member coupled to the pusher member, and a control unit to drive the control valve to rotate. When the control valve is driven to rotate, the pusher member is driven to move correspondingly to reciprocatingly move the actuation member at different locations of the nozzle not only for switching on-and-off the control valve but also for controllably shifting different water spraying patterns of the nozzle. Therefore, is able to easily control different operations of the water dispensing apparatus in one single continuous action of the control unit.

Abstract: An optical film has multi-coated layers. Diffusion layers are used to scatter light. Each diffusion layer has an interface microstructure. A condensing optical layer is used to concentrating light. A design of a multi-coating technology is thus used for scattering and concentrating light. By integrating scattering and concentrating materials in a single optical film, cost is effectively reduced. By using diffusion layers having interface microstructures, interface-dominating mechanism, not only hybrid optical performance with luminance and haze is effectively enhanced; but also quality variations owing to particles added or film warp and scoring on the beneath optical film owing to particles coated are reduced.

Abstract: An optical film has multi-coated layers. Diffusion layers are used to scatter light. Each diffusion layer has an interface microstructure. A condensing optical layer is used to concentrating light. A design of a multi-coating technology is thus used for scattering and concentrating light. By integrating scattering and concentrating materials in a single optical film, cost is effectively reduced. By using diffusion layers having interface microstructures, interface-dominating mechanism, not only hybrid optical performance with luminance and haze is effectively enhanced; but also quality variations owing to particles added or film warp and scoring on the beneath optical film owing to particles coated are reduced.