Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.

Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.

Abstract: A sewing machine includes a main body and a quick release needle plate module. The main body includes a base seat having an inner frame, and an outer case that is mounted to the inner frame and that defines an accommodating compartment. The quick release needle plate module includes a catch member, and a needle plate that covers the accommodating compartment, that is detachably pivoted to a rear section of the inner frame, and that engages the catch member. The quick release needle plate module further includes a press member inserted through the outer case and the inner frame, and operable to push the catch member to disengage the catch member. The needle plate has a plate body that covers the accommodating compartment, and a resilient member mounted between the inner frame and the plate body for driving pivot action of the plate body away from the inner frame.

Abstract: A button mechanism includes a button, a module, and a thin sheet spring. The thin sheet spring is in physical communication with the button and with the module. The thin sheet spring exerts a tension force on the button and the module to bias the button toward a normal position. In response to a force greater than the tension force being exerted on the button, a portion of the thin sheet stretches to enable the button to be placed in a contact position. In response to the force being removed from the button, the tension force causes the thin sheet to snap back to an original position and biases the button toward the normal position.

Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.

Abstract: A glitch measurement device is coupled to a circuit under-test and includes a counter circuitry and a detector circuitry. The counter circuitry is coupled to the circuit under-test, and is configured to perform a first counting operation according to an input signal transmitted to the circuit under-test to generate a first count signal, and to perform a second counting operation according to an output signal outputted from the circuit under-test to generate a second count signal. The detector circuitry is coupled to the circuit under-test and the counter circuitry, and is configured to receive the first count signal and the second count signal according to the input signal, and to generate a glitch indication signal according to the first count signal and the second count signal.

Abstract: A digital-to-analog conversion device and a compensation circuit are provided. A digital-to-analog conversion device includes an R2R digital-to-analog converter and a compensation circuit. The R2R digital-to-analog converter is configured to receive a digital code with a plurality of bits and receive a reference voltage, and convert the digital code into an analog output signal according to the reference voltage. The compensation circuit is configured to receive the digital code, decode the digital code to generate a compensation code with a plurality of bits, and compensate the current value of the reference current according to the compensation code to generate a compensated reference current. The compensated reference current has a constant current value corresponding to different digital codes to make the reference voltage constant.

Abstract: A glitch measurement device is coupled to a circuit under-test and includes a counter circuitry and a detector circuitry. The counter circuitry is coupled to the circuit under-test, and is configured to perform a first counting operation according to an input signal transmitted to the circuit under-test to generate a first count signal, and to perform a second counting operation according to an output signal outputted from the circuit under-test to generate a second count signal. The detector circuitry is coupled to the circuit under-test and the counter circuitry, and is configured to receive the first count signal and the second count signal according to the input signal, and to generate a glitch indication signal according to the first count signal and the second count signal.