Patents by Inventor PO-CHENG LEE

PO-CHENG LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144098
    Abstract: Aspects of the present disclosure provide an automated labeling system. For example, the automated labeling system can include an automated labeling module (ALM) configured to receive wireless signals and ground truth of learning object and label the wireless signals with the ground truth when receiving the ground truth to generate labeled training data. The automated labeling system can also include a training database coupled to the ALM. The training database can be configured to store the labeled training data.
    Type: Application
    Filed: October 16, 2023
    Publication date: May 2, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chao Peng WANG, Chia-Da LEE, Po-Yu CHEN, Hsiao-Chien CHIU, Yi-Cheng LU
  • Publication number: 20240135745
    Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Applicant: InnnoLux Corporation
    Inventors: Kuei-Sheng Chang, Po-Yang Chen, Kuo-Jung Wu, I-An Yao, Wei-Cheng Lee, Hsien-Wen Huang
  • Publication number: 20240136946
    Abstract: This patent presents a multidimensional space vector modulation (MDSVM) circuit formed by coupling a half-bridge logic control circuit not directly coupled to electronic components with at least three half-bridge logic control circuits coupled to electronic components. The half-bridge logic control circuit not directly coupled with any electronic components can form a full-bridge circuit with any other half-bridge logic control circuit coupled with electronic components. Therefore, users can further control the voltage difference between both ends of each electronic component separately and then individually control the strength and direction of current flowing through each electronic component and solving the problem of control attributed to the complexity of prior art.
    Type: Application
    Filed: April 10, 2023
    Publication date: April 25, 2024
    Applicant: TENSOR TECH CO., LTD
    Inventors: Shang Jung LEE, Po-Hsun YEN, Yung-Cheng CHANG, Sung-Liang HOU
  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240117314
    Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Inventors: Ruei-Yue Liang, Chia-Hsin Lee, Kai-Ling Zhang, Po-Cheng Lin, Ming-Hsi Chuang, Yu-Chen Tsai, Peggy Leh Jiunn Wong
  • Publication number: 20240120236
    Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 11, 2024
    Inventors: Tai-Jung Kuo, Po-Cheng Shih, Wan Chen Hsieh, Zhen-Cheng Wu, Chia-Hui Lin, Tze-Liang Lee
  • Publication number: 20240096917
    Abstract: An image sensor structure includes a semiconductor substrate, a plurality of image sensing elements, a reflective element, and a high-k dielectric structure. The image sensing elements are in the semiconductor substrate. The reflective element is in the semiconductor substrate and between the image sensing elements. The high-k dielectric structure is between the reflective element and the image sensing elements.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 21, 2024
    Inventors: PO CHUN CHANG, PING-HAO LIN, WEI-LIN CHEN, KUN-HUI LIN, KUO-CHENG LEE
  • Publication number: 20240079267
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first diffusion barrier layer made of a dielectric material including a metal element, nitrogen, and oxygen and a first protection layer made of a dielectric material including silicon and oxygen and in direct contact with the top surface of the first diffusion barrier layer. The semiconductor device structure also includes a first thickening layer made of a dielectric material including the metal element and oxygen and in direct contact with the top surface of the first protection layer. A maximum metal content in the first thickening layer is greater than that in the first diffusion barrier layer. The semiconductor device structure further includes a conductive feature surrounded by and in direct contact with the first diffusion barrier layer, the first protection layer, and the first thickening layer.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Cheng SHIH, Tze-Liang LEE, Jen-Hung WANG, Yu-Kai LIN, Su-Jen SUNG
  • Publication number: 20240075071
    Abstract: Disclosed in the present invention is an optimized cell transplant. The optimized cell transplant is formed by performing gene induction and modification on a mesenchymal stem cell in the form of a small molecule and protein composition. The expression levels of CD200 gene, Galectin-9 gene and VISTA gene can be increased synchronously after cell culture. Vector virus infection and plasmid transfection are not required in the cell preparation process, so that high biological safety and great clinical application value of cells are achieved.
    Type: Application
    Filed: November 23, 2022
    Publication date: March 7, 2024
    Inventors: Ruei-Yue Liang, Kai-Ling Zhang, Ming-Hsi Chuang, Po-Cheng Lin, Peggy Leh Jiunn Wong, Chia-Hsin Lee
  • Patent number: 11923034
    Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Sheng Wang, Yangsyu Lin, Kao-Cheng Lin, Cheng Hung Lee, Jonathan Tsung-Yung Chang
  • Patent number: 11916146
    Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chiang Wu, Po-Cheng Chen, Kuo-Chan Huang, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen
  • Patent number: 10827128
    Abstract: A camera module of minimal size but with zoom function includes a zoom assembly, a base, and a fixed focus assembly. The zoom assembly and the fixed focus assembly are fixed in the base. The zoom assembly is driven by piezoelectric element instead of voice coil motor and includes an actuator and an optical unit. The actuator defines a first receiving groove holding the optical unit in place over the first through hole. When powered, the piezoelectric element changes a shape of the optical unit to change a focal length of the zoom assembly. An electronic device including such a camera module is also provided.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: November 3, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Shin-Wen Chen, Long-Fei Zhang, Ho-Kai Liang, Po-Cheng Lee, Kun Li, Xiao-Mei Ma
  • Publication number: 20200228718
    Abstract: A camera module of minimal size but with zoom function includes a zoom assembly, a base, and a fixed focus assembly. The zoom assembly and the fixed focus assembly are fixed in the base. The zoom assembly is driven by piezoelectric element instead of voice coil motor and includes an actuator and an optical unit. The actuator defines a first receiving groove holding the optical unit in place over the first through hole. When powered, the piezoelectric element changes a shape of the optical unit to change a focal length of the zoom assembly. An electronic device including such a camera module is also provided.
    Type: Application
    Filed: April 17, 2019
    Publication date: July 16, 2020
    Inventors: SHIN-WEN CHEN, LONG-FEI ZHANG, HO-KAI LIANG, PO-CHENG LEE, KUN LI, XIAO-MEI MA