Patents by Inventor Po-Chia Lai

Po-Chia Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960253
    Abstract: A system and a method for parameter optimization with adaptive search space and a user interface using the same are provided. The system includes a data acquisition unit, an adaptive adjustment unit and an optimization search unit. The data acquisition unit obtains a set of executed values of several operating parameters and a target parameter. The adaptive adjustment unit includes a parameter space transformer and a search range definer. The parameter space transformer performs a space transformation on a parameter space of the operating parameters according to the executed values. The search range definer defines a parameter search range in a transformed parameter space based on the sets of the executed values. The optimization search unit takes the parameter search range as a limiting condition and takes optimizing the target parameter as a target to search for a set of recommended values of the operating parameters.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: April 16, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Yu Huang, Chun-Fang Chen, Hong-Chi Ku, Te-Ming Chen, Chien-Liang Lai, Sen-Chia Chang
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Publication number: 20240063253
    Abstract: Integrated circuit (IC) devices include a metal-insulator-metal (MIM) capacitor having a top electrode plate, a bottom electrode plate, and a plurality of intermediate electrode plates between the top electrode plate and the bottom electrode plate. A plurality of dielectric layers may separate each of the electrode plates of the MIM capacitor from adjacent plates of the MIM capacitor. Each of the intermediate electrode plates may have a thickness that is greater than a thickness of the top electrode plate and the bottom electrode plate. By providing multiple intermediate electrode plates between the top and bottom electrode plates of the MIM capacitor, and allocating the greatest plate thicknesses to the intermediate plates, the capacitance density may be increased in a given area of the IC device, which may provide increased performance for the IC device.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 22, 2024
    Inventors: Po-Chia Lai, Stefan Rusu, Chun-Yen Lee
  • Patent number: 11848352
    Abstract: Integrated circuit (IC) devices include a metal-insulator-metal (MIM) capacitor having a top electrode plate, a bottom electrode plate, and a plurality of intermediate electrode plates between the top electrode plate and the bottom electrode plate. A plurality of dielectric layers may separate each of the electrode plates of the MIM capacitor from adjacent plates of the MIM capacitor. Each of the intermediate electrode plates may have a thickness that is greater than a thickness of the top electrode plate and the bottom electrode plate. By providing multiple intermediate electrode plates between the top and bottom electrode plates of the MIM capacitor, and allocating the greatest plate thicknesses to the intermediate plates, the capacitance density may be increased in a given area of the IC device, which may provide increased performance for the IC device.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: December 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Po-Chia Lai, Chun-Yen Lee, Stefan Rusu
  • Publication number: 20230387330
    Abstract: A semiconductor device and a method of manufacturing the semiconductor device are disclosed. In one aspect, the semiconductor device includes a plurality of deep trench capacitors and a plurality of via contacts that at least partially surround the deep trench capacitors. Variations may be made to the number and locations of the plurality of via contacts such that design requirements for the packaging are satisfied.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Chia Lai, Stefan Rusu
  • Publication number: 20230387895
    Abstract: A flip flop circuit includes a first master portion, a second master portion, at least one determining portion and a slave portion. The first master portion is configured to operate at a first mode and to receive a first input and generate first master outputs. The second master portion is configured to operate at a second mode and to receive a second input and generate second master outputs. The at least one determining portion is configured to receive at least one enable signal, and has determining inputs and determining outputs. The determining inputs are connected to the first master outputs and the second master outputs. The determining portion is configured to determine the determining outputs being the first master outputs or the second master outputs according to the at least one enable signal. The slave portion is configured to receive the determining outputs and generate an output signal.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Po-Chia Lai, Stefan Rusu
  • Publication number: 20230378941
    Abstract: A flip flop circuit includes a first master portion, a second master portion, at least one determining portion and a slave portion. The first master portion is configured to operate at a first mode and to receive a first input and generate first master outputs. The second master portion is configured to operate at a second mode and to receive a second input and generate second master outputs. The at least one determining portion is configured to receive at least one enable signal, and has determining inputs and determining outputs. The determining inputs are connected to the first master outputs and the second master outputs. The determining portion is configured to determine the determining outputs being the first master outputs or the second master outputs according to the at least one enable signal. The slave portion is configured to receive the determining outputs and generate an output signal.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 23, 2023
    Inventors: Po-Chia Lai, Stefan Rusu
  • Patent number: 11764766
    Abstract: A flip flop circuit includes a first master portion, a second master portion, at least one determining portion and a slave portion. The first master portion is configured to operate at a first mode and to receive a first input and generate first master outputs. The second master portion is configured to operate at a second mode and to receive a second input and generate second master outputs. The at least one determining portion is configured to receive at least one enable signal, and has determining inputs and determining outputs. The determining inputs are connected to the first master outputs and the second master outputs. The determining portion is configured to determine the determining outputs being the first master outputs or the second master outputs according to the at least one enable signal. The slave portion is configured to receive the determining outputs and generate an output signal.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Chia Lai, Stefan Rusu
  • Publication number: 20230237237
    Abstract: An integrated circuit design method includes receiving an integrated circuit design, and determining a floor plan for the integrated circuit design. The floor plan includes an arrangement of a plurality of functional cells and a plurality of tap cells. Potential latchup locations in the floor plan are determined, and the arrangement of at least one of the functional cells or the tap cells is modified based on the determined potential latchup locations.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 27, 2023
    Inventors: Po-Chia Lai, Kuo-Ji Chen, Wen-Hao Chen, Wun-Jie Lin, Yu-Ti Su, Mohammed Rabiul Islam, Shu-Yi Ying, Stefan Rusu, Kuan-Te Li, David Barry Scott
  • Patent number: 11615227
    Abstract: An integrated circuit design method includes receiving an integrated circuit design, and determining a floor plan for the integrated circuit design. The floor plan includes an arrangement of a plurality of functional cells and a plurality of tap cells. Potential latchup locations in the floor plan are determined, and the arrangement of at least one of the functional cells or the tap cells is modified based on the determined potential latchup locations.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: March 28, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Chia Lai, Kuo-Ji Chen, Wen-Hao Chen, Wun-Jie Lin, Yu-Ti Su, Rabiul Islam, Shu-Yi Ying, Stefan Rusu, Kuan-Te Li, David Barry Scott
  • Publication number: 20230048735
    Abstract: A flip-flop circuit configured to latch an input signal to an output signal is disclosed. The circuit includes a first latch circuit; and a second latch circuit coupled to the first latch circuit. In some embodiments, in response to a clock signal, the first and second latch circuits are complementarily activated so as to latch the input signal to the output signal, and the first and second latch circuits each comprises at most two transistors configured to receive the clock signal.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 16, 2023
    Inventors: Po-Chia LAI, Meng-Hung Shen, Chi-Lin Liu, Stefan Rusu, Yan-Hao Chen, Jerry Chang-Jui Kao
  • Publication number: 20220278191
    Abstract: Integrated circuit (IC) devices include a metal-insulator-metal (MIM) capacitor having a top electrode plate, a bottom electrode plate, and a plurality of intermediate electrode plates between the top electrode plate and the bottom electrode plate. A plurality of dielectric layers may separate each of the electrode plates of the MIM capacitor from adjacent plates of the MIM capacitor. Each of the intermediate electrode plates may have a thickness that is greater than a thickness of the top electrode plate and the bottom electrode plate. By providing multiple intermediate electrode plates between the top and bottom electrode plates of the MIM capacitor, and allocating the greatest plate thicknesses to the intermediate plates, the capacitance density may be increased in a given area of the IC device, which may provide increased performance for the IC device.
    Type: Application
    Filed: September 7, 2021
    Publication date: September 1, 2022
    Inventors: Po-Chia LAI, Chun-Yen LEE, Stefan RUSU
  • Publication number: 20220238515
    Abstract: An integrated circuit is provided, including a first conductive pattern, at least one first conductive segment, and a first via. The first conductive pattern is disposed in a first layer and configured as a terminal of an inverter. The at least one first conductive segment is disposed in a second layer above the first layer and configured to transmit an output signal output from the inverter. The first via contacts the first conductive pattern and the at least one first conductive segment to transmit the output signal. An area, contacting the first conductive pattern, of the first via is smaller than an area, contacting the at least one first conductive segment, of the first via.
    Type: Application
    Filed: April 13, 2022
    Publication date: July 28, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Chia LAI, Shang-Wei FANG, Meng-Hung SHEN, Jiann-Tyng TZENG, Ting-Wei CHIANG, Jung-Chan YANG, Stefan RUSU
  • Patent number: 11309311
    Abstract: An integrated circuit is disclosed, including a first conductive pattern and a second conductive pattern that are disposed in a first layer and extend in a first direction, at least one first conductive segment disposed in a second layer different from the first layer, and at least one via disposed between the first layer and the second layer. The at least one via is coupled between the at least one first conductive segment and one or both of the first conductive pattern and the second conductive pattern, at an output node of the integrated circuit. The at least one via comprises a tapered shape with a width that decreases from a first width to a second width narrower than the first width. The first width of the at least one via is greater than widths of the first conductive pattern and the second conductive pattern.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: April 19, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Chia Lai, Shang-Wei Fang, Meng-Hung Shen, Jiann-Tyng Tzeng, Ting-Wei Chiang, Jung-Chan Yang, Stefan Rusu
  • Publication number: 20220038080
    Abstract: A flip flop circuit includes a first master portion, a second master portion, at least one determining portion and a slave portion. The first master portion is configured to operate at a first mode and to receive a first input and generate first master outputs. The second master portion is configured to operate at a second mode and to receive a second input and generate second master outputs. The at least one determining portion is configured to receive at least one enable signal, and has determining inputs and determining outputs. The determining inputs are connected to the first master outputs and the second master outputs. The determining portion is configured to determine the determining outputs being the first master outputs or the second master outputs according to the at least one enable signal. The slave portion is configured to receive the determining outputs and generate an output signal.
    Type: Application
    Filed: January 14, 2021
    Publication date: February 3, 2022
    Inventors: Po-Chia Lai, Stefan Rusu
  • Patent number: 11151297
    Abstract: A method includes positioning adjacent first through fourth active regions in a cell of an IC layout diagram, the first active region being a first type of an n-type or a p-type and corresponding to a first total number of fins, the second active region being a second type of the n-type or the p-type and corresponding to a second total number of fins, the third active region being the second type and corresponding to a third total number of fins, and the fourth active region being the first type and corresponding to a fourth total number of fins. Each of the first and second total numbers of fins is greater than each of the third and fourth total numbers of fins, and at least one of the positioning the first, second, third, or fourth active regions is performed by a processor.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: October 19, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Chia Lai, Ming-Chang Kuo, Jerry Chang Jui Kao, Wei-Ling Chang, Wei-Ren Chen, Hui-Zhong Zhuang, Stefan Rusu, Lee-Chung Lu
  • Publication number: 20210271797
    Abstract: A method includes positioning adjacent first through fourth active regions in a cell of an IC layout diagram, the first active region being a first type of an n-type or a p-type and corresponding to a first total number of fins, the second active region being a second type of the n-type or the p-type and corresponding to a second total number of fins, the third active region being the second type and corresponding to a third total number of fins, and the fourth active region being the first type and corresponding to a fourth total number of fins. Each of the first and second total numbers of fins is greater than each of the third and fourth total numbers of fins, and at least one of the positioning the first, second, third, or fourth active regions is performed by a processor.
    Type: Application
    Filed: October 7, 2020
    Publication date: September 2, 2021
    Inventors: Po-Chia LAI, Ming-Chang KUO, Jerry Chang Jui KAO, Wei-Ling CHANG, Wei-Ren CHEN, Hui-Zhong ZHUANG, Stefan RUSU, Lee-Chung LU
  • Publication number: 20210249407
    Abstract: An integrated circuit is disclosed, including a first conductive pattern and a second conductive pattern that are disposed in a first layer and extend in a first direction, at least one first conductive segment disposed in a second layer different from the first layer, and at least one via disposed between the first layer and the second layer. The at least one via is coupled between the at least one first conductive segment and one or both of the first conductive pattern and the second conductive pattern, at an output node of the integrated circuit. The at least one via comprises a tapered shape with a width that decreases from a first width to a second width narrower than the first width. The first width of the at least one via is greater than widths of the first conductive pattern and the second conductive pattern.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 12, 2021
    Inventors: Po-Chia LAI, Shang-Wei FANG, Meng-Hung SHEN, Jiann-Tyng TZENG, Ting-Wei CHIANG, Jung-Chan YANG, Stefan RUSU
  • Publication number: 20210175876
    Abstract: A flip-flop circuit configured to latch an input signal to an output signal is disclosed. The circuit includes a first latch circuit; and a second latch circuit coupled to the first latch circuit. In some embodiments, in response to a clock signal, the first and second latch circuits are complementarily activated so as to latch the input signal to the output signal, and the first and second latch circuits each comprises at most two transistors configured to receive the clock signal.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Inventors: Po-Chia LAI, Meng-Hung SHEN, Chi-Lin LIU, Stefan RUSU, Yan-Hao CHEN, Jerry Chang-Jui KAO
  • Patent number: 11025236
    Abstract: A flip-flop circuit using AOI and OAI includes: a MUX unit with a multiplexer selecting between a first signal and a second signal; a master unit with two OAI, wherein the first OAI is coupled between a first node N1 and a third node N3, the second OAI is coupled between a second node N2 and a fourth node N4; a slave unit with two AOI, wherein the first AOI is coupled between the third node N3 and a fifth node N5, the second AOI is coupled between the fourth node N4 and a sixth node N6; and a clock for controlling the two AOI and the two OAI, the clock is connected to the first and the second AOI and the first and the second OAI.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: June 1, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Chia Lai, Chi-Lin Liu, Greg Gruber, Stefan Rusu