Patents by Inventor Po-Chih PAN

Po-Chih PAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE
    Publication number: 20230274998
    Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Chih PAN, Hung-Chun KUO
  • Semiconductor device package and method of manufacturing the same
    Patent number: 10186779
    Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: January 22, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yu Ho, Chen-Chao Wang, Chun-Yen Ting, Ming-Fong Jhong, Po-Chih Pan
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180131094
    Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.
    Type: Application
    Filed: November 10, 2016
    Publication date: May 10, 2018
    Inventors: Cheng-Yu HO, Chen-Chao WANG, Chun-Yen TING, Ming-Fong JHONG, Po-Chih PAN