Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.

Abstract: A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.

Abstract: A battery pack includes a group of cells, a current path switch coupled to the group of cells, and a current monitoring system. The current monitoring system includes a signal detection unit, a logic unit and a current path control unit. The signal detection unit is coupled to the group of cells and/or a positive terminal of the battery pack, and used to detect at least one voltage signal of the group of cells and/or of the positive terminal of the battery pack. The logic unit is coupled to the signal detection unit, and used to generate a calculated value of a voltage signal of the at least one voltage signal and generate a logic signal according to the calculated value. The current path control unit is coupled to the logic unit and the current path switch, and used to control the current path switch according to the logic signal.

Abstract: Disclosed herein is an anti-biofouling copolymer including a first structural unit represented by formula (I) and a second structural unit represented by formula (II), wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed herein is a method for preparing an anti-biofouling copolymer which includes subjecting a first compound represented by formula (a) to polymerization reaction with a second compound represented by formula (b), wherein each of the substituents is given the definition as set forth in the Specification and Claims.

Abstract: Disclosed herein is an anti-biofouling copolymer including a first structural unit represented by formula (I) and a second structural unit represented by formula (II), wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed herein is a method for preparing an anti-biofouling copolymer which includes subjecting a first compound represented by formula (a) to polymerization reaction with a second compound represented by formula (b), wherein each of the substituents is given the definition as set forth in the Specification and Claims.

Abstract: A charging control apparatus provides a supply power to first and second mobile devices. Each of the first and the second mobile device includes a mobile charging circuit and a battery. The charging control apparatus includes a switching power converter for converting an input power to the supply power, and a conversion control circuit for controlling the switching power converter according to the following steps: S1: controlling the switching power converter, so as to establish a current versus voltage characteristic curve corresponding to the supply power; and S2: determining a charging mode combinations of the first and the second mobile device and/or adjusting a supply voltage of the supply power to charge the battery of each mobile device according to the current versus voltage characteristic curve, so as to reduce a voltage drop of each mobile device as well as the power loss.

Abstract: Methods of fabricating FinFET devices are provided. The method includes forming a fin over a substrate. The method also includes implanting a first dopant on a top surface of the fin and implanting a second dopant on a sidewall surface of the fin. The first dopant is different from the second dopant. The method further includes forming an oxide layer on the top surface and the sidewall surface of the fin, and forming a gate electrode layer over the oxide layer.

Abstract: Methods of fabricating FinFET devices are provided. The method includes forming a fin over a substrate. The method also includes implanting a first dopant on a top surface of the fin and implanting a second dopant on a sidewall surface of the fin. The first dopant is different from the second dopant. The method further includes forming an oxide layer on the top surface and the sidewall surface of the fin, and forming a gate electrode layer over the oxide layer.

Abstract: A data processing method for a solid state storage device is provided. The solid state storage device includes a non-volatile memory having a least one data segment. The data segment includes multiple memory cells. The data processing method includes the following steps. Whether a data stored in the data segment is an invalid data is determined according to a predetermined condition. A voltage is applied to the data segment to obtain a number of the conducted memory cells under the voltage. The voltage corresponds to a preset value. Whether the data is the invalid data is determined by judging whether a relationship between the number of the conducted memory cells and the preset value satisfies the predetermined condition.