Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first active region extending lengthwise along a first direction and having a first width along a second direction perpendicular to the first direction, a second active region extending lengthwise along the first direction and having a second width along the second direction, and an epitaxial feature sandwiched between the first active region and the second active region along the first direction. The first width is greater than the second width.

Abstract: A calibration apparatus includes a processor, an alignment device, and an arm. The alignment device captures images in a three-dimensional space, and a tool is arranged on a flange of the arm. The processor records a first matrix of transformation between an end-effector coordinate-system and a robot coordinate-system, and performs a tool calibration procedure according to the images captured by the alignment device for obtaining a second matrix of transformation between a tool coordinate-system and the end-effector coordinate-system. The processor calculates relative position of a tool center point of the tool in the robot coordinate-system based on the first and second matrixes, and controls the TCP to move in the three-dimensional space for performing a positioning procedure so as to regard points in an alignment device coordinate-system as points of the TCP, and calculates the relative positions of points in the alignment device coordinate-system and in the robot coordinate-system.

Abstract: A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.

Abstract: A method and apparatus for simulating breakdown of an electronic component are provided. The method includes: when a terminal of an equivalent circuit model receives test charges, pulling up a voltage level of a first node of the equivalent circuit model; when the voltage level of the first node reaches a first threshold, turning on a first voltage controlled switch to pull up a voltage level of a second node of the equivalent circuit model; when the voltage level of the second mode reaches a second threshold, turning on a second voltage controlled switch to pull down a voltage level of the terminal to a holding voltage level to simulate snapback breakdown of the electronic component; and turning on a third voltage controlled switch to pull down the voltage level of the second node to turn off the second voltage controlled switch, thereby simulating second breakdown of the electronic component.

Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

Abstract: An integrated circuit for power clamping is provided. The integrated circuit for power clamping is electrically coupled to an internal circuit of an integrated circuit through a power line and a ground line, and includes a switch, a first resistor, a capacitor, an inverter and a voltage detection circuit. The voltage detection circuit detects a voltage of the power line, and when the voltage of the power line exceeds a threshold value, the voltage detection circuit electrically connects a first node to the ground line, such that a low potential signal from the ground line is input to the input terminal of the inverter, and then the switch is turned on to form a discharge path.

Abstract: A plurality of package units is on a surface of a substrate, and a driving circuit is on the surface of the substrate. Each package unit includes at least one pixel, and each pixel is provided with a plurality of light-emitting elements. The driving circuit electrically connects to the light-emitting elements and is configured to transmit a plurality of gate driving signals and a plurality of data signals to drive the plurality of light-emitting elements to emit light to display images. The driving circuit is partially in the package units and is partially between adjacent package units. The substrate and a portion of the driving circuit between adjacent package units are made to be stretchable, while the package units are not stretchable.

Abstract: A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.

Abstract: A flex-tolerant structure includes a flexible and foldable substrate and traces on the substrate. Each trace includes a stretch-resistant layer and a metal layer covering the stretch-resistant layer, electrical flow can persist through these layers even if the traces are fractured. A display panel is also disclosed.

Abstract: A plurality of package units is on a surface of a substrate, and a driving circuit is on the surface of the substrate. Each package unit includes at least one pixel, and each pixel is provided with a plurality of light-emitting elements. The driving circuit electrically connects to the light-emitting elements and is configured to transmit a plurality of gate driving signals and a plurality of data signals to drive the plurality of light-emitting elements to emit light to display images. The driving circuit is partially in the package units and is partially between adjacent package units. The substrate and a portion of the driving circuit between adjacent package units are made to be stretchable, while the package units are not stretchable.

Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

Abstract: A conductive module includes spaced conductive layers and connecting lines. Adjacent conductive layers are electrically connected by one connecting line. Each connecting line includes a contact portion and an extending portion, the contact portion is electrically connected to one conductive layer and the extending portion. The extending portion is very stretchable in effective length to render the conductive module stretchable and deformable. A projection of the contact portion on a plane where the extending portion extends is a square, a width of the extending portion is equal to a side length of the contact portion.

Abstract: A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.

Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: A conductive module includes spaced conductive layers and connecting lines. Adjacent conductive layers are electrically connected by one connecting line. Each connecting line includes a contact portion and an extending portion, the contact portion is electrically connected to one conductive layer and the extending portion. The extending portion is very stretchable in effective length to render the conductive module stretchable and deformable. A projection of the contact portion on a plane where the extending portion extends is a square, a width of the extending portion is equal to a side length of the contact portion.

Abstract: A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.

Abstract: The present invention is a display and manufacturing method thereof, including a thin film substrate, a plurality of packaging layers, and a stretch-resistant unit, wherein one side of the thin film substrate has a plurality of pixel areas, each pixel area contains at least one light-emitting element, and each packaging layer respectively covers one of the pixel areas to form an island-shape structure, and there is a spacing between any two adjacent island-shape structures, and each stretch-resistant unit deposed at the spacing and connects the adjacent island-shape structures.

Abstract: A light-emitting diode display and a method for fabricating the same is disclosed. The light-emitting diode display includes a driving backplane and a plurality of pixel units. Each of the plurality of pixel units includes at least one light-emitting diode and a package substrate. The top surface of the package substrate has at least one conductive position and at least one conductive vacant position corresponding to the at least one conductive position. The conductive position is provided with the light-emitting diode. The conductive position is electrically connected to the light-emitting diode. The bottom surface of the package substrate of each pixel unit is arranged on the driving backplane. The driving backplane is electrically connected to the light-emitting diode and the corresponding conductive vacant position of each pixel unit thereon.

Abstract: A micro light-emitting diode (micro LED) display and a package method thereof are described. The micro LED display includes a substrate, various micro LED chips, and an encapsulation film. The substrate includes a wire. The micro LED chips are disposed on a surface of the substrate and are electrically connected to the wire. A light-emitting surface of each of the micro LED chips is set with at least one micro structure, and each micro structure has a top end. The encapsulation film encapsulates the micro LED chips, and covers the surface of the substrate. The top ends of the micro structures are located in a light-emitting surface of the encapsulation film.