Patents by Inventor Po-Ching Lin

Po-Ching Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12198581
    Abstract: A light emitting diode display device includes: a substrate, a plurality of signal lines, and a plurality of transparent apertures. A plurality of element packages arranged in matrix on one side of the substrate, the two element packages are connected by the signal lines, and the transparent aperture is surrounded by the signal lines. The signal line is a multi-layer structure for transmitting signal, which can reduce the risk of breaking the signal transmission line during stretching. The transparent aperture is stacked with organic materials, and the inorganic material is removed, which reduces the problem of the cracking and extension of the inorganic material layer when the product is stretched. It also has the effect of reducing the penetration loss caused by the refraction of light through multiple layers, so that the transparent aperture forms a high light-transmitting effect.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: January 14, 2025
    Assignee: General Interface Solution Limited
    Inventors: Po-Ching Lin, Po-Lun Chen, Chun-Ta Chen, Ya-Chu Hsu, Chia-Ming Fan
  • Publication number: 20250008693
    Abstract: A heat-dissipating element having a casing having a closed fluid space. At least a part of the fluid space is filled with a coolant fluid, and the coolant fluid is transformed between a liquid phase and a gas phase by an environment temperature transferred by the casing.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 2, 2025
    Inventors: Tzu-Chia TAN, YAO-CHUN WANG, WEN-HUNG LIN, WEN-YUAN CHOU, PO-CHING LIN, SHANTI KARTIKA SARI
  • Patent number: 12028508
    Abstract: A stereoscopic three-dimensional display and manufacturing method thereof includes a three-dimensional display and a depth sensor. The three-dimensional display includes a three-dimensional display module and a parallax optical module that corresponds to a plurality of first depth display portions and a plurality of second depth display portions and a first parallax optical portion and a second parallax optical portion. The depth sensor is electrically connected to the stereoscopic display module, and detects the distance between the user and the stereoscopic display, and selects whether all of the first depth display parts jointly output the first parallax image, or all of the second depth display parts jointly output the second parallax image, so that the user can view the stereoscopic imaging through the first parallax optical unit or the second parallax optical unit at different positions.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: July 2, 2024
    Assignees: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventor: Po-Ching Lin
  • Publication number: 20240203298
    Abstract: A light emitting diode display device includes: a substrate, a plurality of signal lines, and a plurality of transparent apertures. A plurality of element packages arranged in matrix on one side of the substrate, the two element packages are connected by the signal lines, and the transparent aperture is surrounded by the signal lines. The signal line is a multi-layer structure for transmitting signal, which can reduce the risk of breaking the signal transmission line during stretching. The transparent aperture is stacked with organic materials, and the inorganic material is removed, which reduces the problem of the cracking and extension of the inorganic material layer when the product is stretched. It also has the effect of reducing the penetration loss caused by the refraction of light through multiple layers, so that the transparent aperture forms a high light-transmitting effect.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 20, 2024
    Inventors: PO-CHING LIN, PO-LUN CHEN, CHUN-TA CHEN, YA-CHU HSU, CHIA-MING FAN
  • Publication number: 20240194839
    Abstract: A micro light-emitting diode display is based on a conventional micro light-emitting diode display and includes at least one electrically conductive material layer or at least one functional material added to an encapsulation layer, so as to achieve antistatic effect. The micro light-emitting diode display solves the problem that the conventional micro light-emitting diode display is easily damaged by electrostatic breakdown.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 13, 2024
    Inventors: CHIA-MING FAN, WEN-YOU LAI, HSIEN-YING CHOU, PO-LUN CHEN, CHUN-TA CHEN, PO-CHING LIN
  • Patent number: 11963385
    Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: April 16, 2024
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: Wen-You Lai, Ping-Hsiang Kao, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu
  • Publication number: 20240063634
    Abstract: A method and apparatus for simulating breakdown of an electronic component are provided. The method includes: when a terminal of an equivalent circuit model receives test charges, pulling up a voltage level of a first node of the equivalent circuit model; when the voltage level of the first node reaches a first threshold, turning on a first voltage controlled switch to pull up a voltage level of a second node of the equivalent circuit model; when the voltage level of the second mode reaches a second threshold, turning on a second voltage controlled switch to pull down a voltage level of the terminal to a holding voltage level to simulate snapback breakdown of the electronic component; and turning on a third voltage controlled switch to pull down the voltage level of the second node to turn off the second voltage controlled switch, thereby simulating second breakdown of the electronic component.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 22, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Shih-Hsin Liao, Rui-Hong Liu, Tay-Her Tsaur, Po-Ching Lin
  • Patent number: 11895811
    Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: February 6, 2024
    Assignees: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., INTERFACE OPTOELECTRONICS (WUXI) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Ping-Hsiang Kao, Wen-You Lai, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu
  • Publication number: 20230361108
    Abstract: An integrated circuit for power clamping is provided. The integrated circuit for power clamping is electrically coupled to an internal circuit of an integrated circuit through a power line and a ground line, and includes a switch, a first resistor, a capacitor, an inverter and a voltage detection circuit. The voltage detection circuit detects a voltage of the power line, and when the voltage of the power line exceeds a threshold value, the voltage detection circuit electrically connects a first node to the ground line, such that a low potential signal from the ground line is input to the input terminal of the inverter, and then the switch is turned on to form a discharge path.
    Type: Application
    Filed: May 4, 2023
    Publication date: November 9, 2023
    Inventors: JYUN-REN CHEN, SHIH-HSIN LIAO, PO-CHING LIN, TAY-HER TSAUR
  • Patent number: 11715423
    Abstract: A plurality of package units is on a surface of a substrate, and a driving circuit is on the surface of the substrate. Each package unit includes at least one pixel, and each pixel is provided with a plurality of light-emitting elements. The driving circuit electrically connects to the light-emitting elements and is configured to transmit a plurality of gate driving signals and a plurality of data signals to drive the plurality of light-emitting elements to emit light to display images. The driving circuit is partially in the package units and is partially between adjacent package units. The substrate and a portion of the driving circuit between adjacent package units are made to be stretchable, while the package units are not stretchable.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: August 1, 2023
    Assignees: Interface Technology (ChengDu) Co., Ltd., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., INTERSACE OPTOELECTRONICS (WUXI) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Ya-Chu Hsu, Po-Ching Lin, Po-Lun Chen, Chun-Ta Chen
  • Patent number: 11659655
    Abstract: A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: May 23, 2023
    Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., Interface Optoelectronics (Wuxi) Co., Ltd., General Interface Solution Limited
    Inventors: Chia Ming Fan, Po Lun Chen, Chun Ta Chen, Po Ching Lin, Ya Chu Hsu, Chin I Tu, Kuo Fung Huang
  • Patent number: 11653556
    Abstract: A flex-tolerant structure includes a flexible and foldable substrate and traces on the substrate. Each trace includes a stretch-resistant layer and a metal layer covering the stretch-resistant layer, electrical flow can persist through these layers even if the traces are fractured. A display panel is also disclosed.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: May 16, 2023
    Assignees: Interface Technology (ChengDu) Co, Ltd., INTERFACE OPTOELECTRONICS (SHENZHEN) CO, LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventor: Po-Ching Lin
  • Publication number: 20230119024
    Abstract: A plurality of package units is on a surface of a substrate, and a driving circuit is on the surface of the substrate. Each package unit includes at least one pixel, and each pixel is provided with a plurality of light-emitting elements. The driving circuit electrically connects to the light-emitting elements and is configured to transmit a plurality of gate driving signals and a plurality of data signals to drive the plurality of light-emitting elements to emit light to display images. The driving circuit is partially in the package units and is partially between adjacent package units. The substrate and a portion of the driving circuit between adjacent package units are made to be stretchable, while the package units are not stretchable.
    Type: Application
    Filed: December 10, 2021
    Publication date: April 20, 2023
    Inventors: YA-CHU HSU, PO-CHING LIN, PO-LUN CHEN, CHUN-TA CHEN
  • Publication number: 20230114927
    Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.
    Type: Application
    Filed: November 4, 2021
    Publication date: April 13, 2023
    Inventors: PING-HSIANG KAO, WEN-YOU LAI, PO-LUN CHEN, CHUN-TA CHEN, PO-CHING LIN, YA-CHU HSU
  • Patent number: 11625078
    Abstract: A conductive module includes spaced conductive layers and connecting lines. Adjacent conductive layers are electrically connected by one connecting line. Each connecting line includes a contact portion and an extending portion, the contact portion is electrically connected to one conductive layer and the extending portion. The extending portion is very stretchable in effective length to render the conductive module stretchable and deformable. A projection of the contact portion on a plane where the extending portion extends is a square, a width of the extending portion is equal to a side length of the contact portion.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: April 11, 2023
    Assignees: Interface Technology (ChengDu) Co, Ltd., INTERFACE OPTOELECTRONICS (SHENZHEN) CO, LTD., INTERFACE OPTOELECTRONICS (WUXI) CO, LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Chia-Ming Fan, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu, Chin-I Tu, Kuo-Fung Huang
  • Publication number: 20230096896
    Abstract: A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.
    Type: Application
    Filed: November 4, 2021
    Publication date: March 30, 2023
    Inventors: CHIA MING FAN, PO LUN CHEN, CHUN TA CHEN, PO CHING LIN, YA CHU HSU, CHIN I TU, KUO FUNG HUANG
  • Publication number: 20230099272
    Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.
    Type: Application
    Filed: October 25, 2021
    Publication date: March 30, 2023
    Inventors: Wen-You LAI, Ping-Hsiang KAO, Po-Lun CHEN, Chun-Ta CHEN, Po-Ching LIN, Ya-Chu HSU
  • Publication number: 20230083312
    Abstract: A conductive module includes spaced conductive layers and connecting lines. Adjacent conductive layers are electrically connected by one connecting line. Each connecting line includes a contact portion and an extending portion, the contact portion is electrically connected to one conductive layer and the extending portion. The extending portion is very stretchable in effective length to render the conductive module stretchable and deformable. A projection of the contact portion on a plane where the extending portion extends is a square, a width of the extending portion is equal to a side length of the contact portion.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 16, 2023
    Inventors: CHIA-MING FAN, PO-LUN CHEN, CHUN-TA CHEN, PO-CHING LIN, YA-CHU HSU, CHIN-I TU, KUO-FUNG HUANG
  • Patent number: 11569207
    Abstract: A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: January 31, 2023
    Assignees: Interface Technology (ChengDu) Co., Ltd., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Chien-Yu Huang, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu, Chia-Ming Fan, Ping-Hsiang Kao
  • Patent number: 11552064
    Abstract: The present invention is a display and manufacturing method thereof, including a thin film substrate, a plurality of packaging layers, and a stretch-resistant unit, wherein one side of the thin film substrate has a plurality of pixel areas, each pixel area contains at least one light-emitting element, and each packaging layer respectively covers one of the pixel areas to form an island-shape structure, and there is a spacing between any two adjacent island-shape structures, and each stretch-resistant unit deposed at the spacing and connects the adjacent island-shape structures.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: January 10, 2023
    Assignees: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin