Patents by Inventor Po-Chuan Hsieh
Po-Chuan Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113142Abstract: An image sensor includes a group of sensor units, a color filter layer disposed within the group of sensor units, and a dielectric structure and a metasurface disposed corresponding to the color filter layer. The metasurface includes a plurality of peripheral nanoposts located at corners of the group of sensor units from top view, respectively, a central nanopost enclosed by the plurality of peripheral nanoposts, and a filling material laterally surrounding the plurality of peripheral nanoposts and the central nanopost. The central nanopost is offset from a center point of the group of sensor units by a distance from top view.Type: ApplicationFiled: September 30, 2022Publication date: April 4, 2024Inventors: Po-Han FU, Wei-Ko WANG, Shih-Liang KU, Chin-Chuan HSIEH
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Publication number: 20160079950Abstract: A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.Type: ApplicationFiled: September 12, 2014Publication date: March 17, 2016Inventors: MING-HSIEN CHENG, PO-CHUAN HSIEH, YING-TSO LAI, CHIEN-HSUN CHEN
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Patent number: 9276549Abstract: A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.Type: GrantFiled: September 12, 2014Date of Patent: March 1, 2016Assignee: ScienBiziP Consulting(Shenzhen)Co., Ltd.Inventors: Ming-Hsien Cheng, Po-Chuan Hsieh, Ying-Tso Lai, Chien-Hsun Chen
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Patent number: 9173283Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: GrantFiled: December 18, 2013Date of Patent: October 27, 2015Assignee: ShenZhen Goldsun Network Intelligence Technology Co., Ltd.Inventors: Shao-You Tang, Po-Chuan Hsieh
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Publication number: 20150041207Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground vias are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: ApplicationFiled: April 17, 2014Publication date: February 12, 2015Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH
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Publication number: 20140337704Abstract: A system and a method for converting between data formats converts air flow data from a thermal simulation tool into a format readable by a DC power analyzing tool. Air flow data associated with the locations of certain points on a printed circuit board are taken and an EXCEL document including Main, Data, and Final worksheets is created. The data to be converted is obtained, and the data imported into the Data worksheet. Parameters in the Main worksheet to set an analysis area of the printed circuit board are set, and air flow data associated with the analysis areas from the Data worksheet are obtained and divided into groups, according to the parameters set in the Main worksheet. An equivalence value for each group of data is calculated and the equivalence values are saved in the Final worksheet for reading by the DC power analyzing tool.Type: ApplicationFiled: May 9, 2014Publication date: November 13, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH, WEI-CHIEH CHOU
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Patent number: 8872597Abstract: An equalizer includes a circuit board and a compensation module. The compensation module includes first and second transmission lines, first to fourth resistors, and first to fourth micro-strips. Four vias extend through the circuit board and are grounded. First terminals of the four resistors are grounded through the vias. A second terminal of a first resistor is connected to a second terminal of the second resistor through the first micro-strip, and is connected to the first transmission line through the second micro-strip. A second terminal of the third resistor is connected to the second transmission line through the third micro-strip, and is connected to a second terminal of the fourth resistor through the fourth micro-strip. A length of the first micro-strip is equal to a length of the fourth micro-strip. A length of the second micro-strip is equal to a length of the third micro-strip.Type: GrantFiled: December 26, 2012Date of Patent: October 28, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chien-Hsun Chen, Po-Chuan Hsieh
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Publication number: 20140209369Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: ApplicationFiled: January 16, 2014Publication date: July 31, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH
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Publication number: 20140182893Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: ApplicationFiled: December 18, 2013Publication date: July 3, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH
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Patent number: 8766740Abstract: An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, and at least two resistors. When a signal transmitted by the circuit board is received by the input pins, a first portion of the signal is directly output from the output pins, a second portion of the signal is reflected by the first resistor and transmitted back to the output pins to output, and a third portion of the signal is reflected by the second resistor and transmitted back to the output pins to output, such that output of the equalizer applies two stages of compensation.Type: GrantFiled: November 27, 2012Date of Patent: July 1, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Po-Chuan Hsieh, Ying-Tso Lai, Cheng-Hsien Lee, En-Shuo Chang
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Patent number: 8759693Abstract: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents.Type: GrantFiled: September 4, 2012Date of Patent: June 24, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Cheng-Hsiu Yang, Po-Chuan Hsieh
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Patent number: 8760238Abstract: An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, first and second resistors, first and second vias, and a pair of micro-strips. When a signal transmitted by the circuit board is received by the input pins, a first part of the signal is directly outputted from the output pins, a second part of the signal is reflected by the first resistor and transmitted back to the output pins to be outputted, and a third part of the signal is reflected by the second resistor and transmitted back to the output pins to be outputted, such that the output of the equalizer applies two stages of compensation.Type: GrantFiled: December 24, 2012Date of Patent: June 24, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chien-Hsun Chen, Po-Chuan Hsieh
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Publication number: 20140167887Abstract: An equalizer includes a circuit board and a compensation module. The compensation module includes first and second transmission lines, first to fourth resistors, and first to fourth micro-strips. Four vias extend through the circuit board and are grounded. First terminals of the four resistors are grounded through the vias. A second terminal of a first resistor is connected to a second terminal of the second resistor through the first micro-strip, and is connected to the first transmission line through the second micro-strip. A second terminal of the third resistor is connected to the second transmission line through the third micro-strip, and is connected to a second terminal of the fourth resistor through the fourth micro-strip. A length of the first micro-strip is equal to a length of the fourth micro-strip. A length of the second micro-strip is equal to a length of the third micro-strip.Type: ApplicationFiled: December 26, 2012Publication date: June 19, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIEN-HSUN CHEN, PO-CHUAN HSIEH
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Publication number: 20140146463Abstract: A hard disk drive module includes a bracket, a hard disk drive received in the bracket, and a shielding member. A bar code is mounted on the hard disk drive. The bracket includes a main body defining an opening. The shielding member is made of electromagnetic interference shielding material and received in the opening. The shielding member defines a through slot through which the bar code is exposed.Type: ApplicationFiled: December 5, 2012Publication date: May 29, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: PO-CHUAN HSIEH, EN-SHUO CHANG
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Publication number: 20140125435Abstract: An equalizer assembly for compensating transmission losses of electronic communication signals includes a circuit board and a first equalizer and a second equalizer. Two input pins of each equalizer are parallel to each other. The input pins of the first equalizer are perpendicular to the input pins of the second equalizer.Type: ApplicationFiled: December 26, 2012Publication date: May 8, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: KUN-HUNG TSAI, PO-CHUAN HSIEH
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Publication number: 20140119422Abstract: An equalizer includes a multi-layer printed circuit board, an equalizing module, a first ground via, and a second ground via. The equalizing module includes two inputs, first and second signal vias, first and second resistors, two outputs, first and second microstrip lines. The first microstrip line extends from a side of a pad, which is connected to the first signal via and a bottom layer of the printed circuit board. The first microstrip line is bent and connected to a pad, which is connected to a first terminal of the second resistor. The second microstrip line extends from a side of a pad, which is connected to the second signal via and a bottom layer of the printed circuit board. The second microstrip line is bent and connected to a pad, which is connected to a second terminal of the second resistor.Type: ApplicationFiled: October 30, 2013Publication date: May 1, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: EN-SHUO CHANG, PO-CHUAN HSIEH
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Publication number: 20140060914Abstract: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents.Type: ApplicationFiled: September 4, 2012Publication date: March 6, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHENG-HSIU YANG, PO-CHUAN HSIEH
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Patent number: 8650329Abstract: An exemplary port reducing method is for removing unselected ports of an original S-parameter file and generating an optimized S-parameter file. The method controls a display unit to display a user interface to receive commands from a user in response to user operation; the commands comprise a calling command, a selecting command, and an executing command. The method obtains the original S-parameter file in response to the calling command. Next, the method determines which of the ports of the original S-parameter file are unselected in response to the selecting command, and connects each unselected port to the ground through one terminal impedance. The method then generates an optimized S-parameter file that comprises only the selected ports in response to the executing command.Type: GrantFiled: August 2, 2012Date of Patent: February 11, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Po-Chuan Hsieh, Chun-Neng Liao, Shin-Ting Yen
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Patent number: 8633785Abstract: A Marchand balun circuit includes a Marchand balun, an unbalanced matching circuit, and a balanced matching circuit. The Marchand balun includes an unbalanced terminal, and two balanced terminals. The unbalanced matching circuit includes a first and the second impedances which are connected between the unbalanced terminal and ground in series, and a first resistor which is connected between ground and a connection node of the first and the second impedances. The balanced matching circuit includes a third and a fourth impedances which are connected between one balanced terminal and ground in series, a fifth and a sixth impedance which are connected between the other balanced terminal and ground in series, a second resistor which is connected between ground and a connection node of the third and the fourth impedances, and a third resistor which is connected between ground and a connection node of the fifth and the sixth impedances.Type: GrantFiled: December 14, 2011Date of Patent: January 21, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: En-Shuo Chang, Po-Chuan Hsieh, Ying-Tso Lai
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Publication number: 20130342290Abstract: An equalizer for compensating transmission losses of electronic communication signals includes a circuit board and a compensation module. The compensation module includes a pair of input pins, a pair of output pins, first and second resistors, first and second vias, and a pair of micro-strips. When a signal transmitted by the circuit board is received by the input pins, a first part of the signal is directly outputted from the output pins, a second part of the signal is reflected by the first resistor and transmitted back to the output pins to be outputted, and a third part of the signal is reflected by the second resistor and transmitted back to the output pins to be outputted, such that the output of the equalizer applies two stages of compensation.Type: ApplicationFiled: December 24, 2012Publication date: December 26, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIEN-HSUN CHEN, PO-CHUAN HSIEH