Patents by Inventor Po-Chung Chian

Po-Chung Chian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6651302
    Abstract: The present invention is to provide an auxiliary tool for dismantling a guide ring, and an application method of the same. The auxiliary tool of the present invention for dismantling a guide ring is to install a plurality of supporting elements on the top of a guide ring whose structure is the same as that of the guide ring to be dismantled, thereby dismantling the guide ring closely engaged with a top ring module, wherein the top ring module is used in a chemical-mechanical polishing (CMP) machine for carrying a wafer, and the guide ring to be dismantled is for holding the wafer within the top ring module. The application method of the auxiliary tool for dismantling a guide ring is first to insert the supporting elements of the auxiliary tool of the present invention into the grooves of the top ring modules, and thereafter to tap a combined surface of the guide ring and top ring module in a way like plotting a circle, so as to disengage the guide ring from the top ring module.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: November 25, 2003
    Assignee: Winbond Electronics Corporation
    Inventors: Po-Chung Chian, Sam Hu, Stanley Sung
  • Publication number: 20030097742
    Abstract: The present invention is to provide an auxiliary tool for dismantling a guide ring, and an application method of the same. The auxiliary tool of the present invention for dismantling a guide ring is to install a plurality of supporting elements on the top of a guide ring whose structure is the same as that of the guide ring to be dismantled, thereby dismantling the guide ring closely engaged with a top ring module, wherein the top ring module is used in a chemical-mechanical polishing (CMP) machine for carrying a wafer, and the guide ring to be dismantled is for holding the wafer within the top ring module. The application method of the auxiliary tool for dismantling a guide ring is first to insert the supporting elements of the auxiliary tool of the present invention into the grooves of the top ring modules, and thereafter to tap a combined surface of the guide ring and top ring module in a way like plotting a circle, so as to disengage the guide ring from the top ring module.
    Type: Application
    Filed: November 29, 2001
    Publication date: May 29, 2003
    Applicant: WINBOND ELECTRONICS CORP.
    Inventors: Po-Chung Chian, Sam Hu, Stanley Sung