Abstract: An optoelectronic circuit used with signal light comprises photonic. The photonic devices are configured to condition the signal light and are fabricated with an optical characteristic being electronically tunable. A fabricated performance of the optical characteristic can be varied from a target performance due to a difference (e.g., alteration, change, error, or discrepancy) in the process used to fabricate the device. A ground bus, a power bus, and banks of electronic components are disposed on the platform in electrical communication with the photonic devices. The electronic components in a given bank are selectively configurable to tune the optical characteristic of the associated device so a variance can be diminished between the fabrication and target performances of the device's optical characteristic due to the difference in the fabrication process.

Abstract: Embodiments of the present disclosure may comprise a system for filling undercuts with an index-matching liquid on a wafer, the system comprising a plurality of edge couplers, each comprising an undercut and a waveguide. Embodiments may also comprise ribs that suspend the waveguide over the undercut. Embodiments may also comprise one or more main buckets and one or more monitor buckets. Embodiments may also comprise a duct that couples together the plurality of edge couplers, the one or more main buckets, and the one or more monitor buckets.

Abstract: An optical circuit is used with continuous wave signals having different wavelengths at a channel spacing from one another. A portion of the optical circuit is implemented in a photonic integrated circuit. Modulators in a modulation stage modulate the continuous wave signals to produce modulated signals. A multiplexing stage, which can have multiplexing filters, power combiners, or power couplers, multiplexes the continuous wave or modulated signals to produce multiplexed signals. The multiplexing stage may be placed either before or after the modulation stage. One or more polarization rotator and combiner (PRC) devices in a final stage combines the multiplexed signals into an output signal. The output signal has a first set of the different wavelengths at a first polarization and has a second separate set of the different wavelengths at a second polarization orthogonal to the first polarization.

Abstract: An optoelectronic circuit used with signal light comprises photonic devices disposed on a platform. The photonic devices are configured to condition the signal light and are fabricated with an optical characteristic being electronically tunable. A fabricated performance of the optical characteristic can be varied from a target performance due to a difference (e.g., alteration, change, error, or discrepancy) in the process used to fabricate the device. A ground bus, a power bus, and banks of electronic components are disposed on the platform in electrical communication with the photonic devices. The electronic components in a given bank are selectively configurable to tune the optical characteristic of the associated device so a variance can be diminished between the fabrication and target performances of the device's optical characteristic due to the difference in the fabrication process.

Abstract: A photonics integrated circuit (PIC) chip includes: an input unit, including at least one optical input (IN) and a number of optical outputs (ISO); a modulation unit (MU) including a number of light modulators (M) having optical inputs(S) coupled to optical outputs ISO of the input unit, and optical outputs (T); a first stage optical switch unit (1SOSU) including a number of optical inputs (I) optically coupled to optical outputs T of the MU, and optical outputs (P), a first subset of which define a first subset of optical outputs (O) of the PIC chip; and a second stage optical switch unit (2SOSU) including a number of optical inputs I and optical outputs (O) that define second subset of the optical outputs O of the PIC chip. Each optical switch of 1SOSU and 2SOSU may be configured in a coupler mode; a bar mode; and/or a cross mode.

Abstract: An optical frequency-division demultiplexer, with a plurality of cascaded half-band filters, each of which comprises a plurality of stages. At least a first half-band filter and a second half-band filter have different orders but the same channel spacing.

Abstract: A photonic integrated circuit (PIC) device has photonic devices arranged in an array with respect to control and common conductors. Each of the photonic devices has a photonic component (e.g., photodiode, thermo-optic phase shifter, etc.) and a switching diode connected in series with one another between a control connection and a common connection. The photonic component has at least one optical port, which can be coupled to a waveguide in the PIC device. The switching diode is configured to switch between reverse and forward bias in response to the electrical signals. In this way, control circuitry for providing control and monitoring signals to the conductors can be greatly simplified, and the PIC device can be more compact.

Abstract: A photonics integrated circuit chip includes a substrate, an interface port unit IPU formed on the substrate, a photonics circuit unit PCU formed on the substrate, a photonics circuit 1PC formed on the substrate and optically coupled between the interface port unit IPU and the photonics circuit unit PCU, and a photonics circuit 2PC formed on the substrate and optically coupled between the interface port unit IPU and the photonics circuit unit PCU in parallel with photonics circuit 1PC. The photonics circuit 1PC and the photonics circuit 2PC may be at least one of the following: functional duplicates of each other with intentionally introduced physical differences in their fabrication layouts; differently optically tuned versions of each other; and/or functionally equivalent versions of each other with intentionally introduced differences in their circuit layouts.

Abstract: A photonic integrated circuit (PIC) device has photonic devices arranged in an array with respect to control and common conductors. Each of the photonic devices has a photonic component (e.g., photodiode, thermo-optic phase shifter, etc.) and a switching diode connected in series with one another between a control connection and a common connection. The photonic component has at least one optical port, which can be coupled to a waveguide in the PIC device. The switching diode is configured to switch between reverse and forward bias in response to the electrical signals. In this way, control circuitry for providing control and monitoring signals to the conductors can be greatly simplified, and the PIC device can be more compact.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: An apparatus including an optical modulator and an electronic controller. The optical modulator includes a parallel-nested pair of MZIs, each arm of the MZIs including one or more EAMs therein. The electronic controller is electrically connected to drive the MZIs such that the optical modulator outputs an optical carrier modulated according to a quadrature amplitude modulation constellation with at least five different symbols.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: An optoelectronic circuit used with signal light comprises photonic devices disposed on a platform. The photonic devices are configured to condition the signal light and are fabricated with an optical characteristic being electronically tunable. A fabricated performance of the optical characteristic can be varied from a target performance due to a difference (e.g., alteration, change, error, or discrepancy) in the process used to fabricate the device. A ground bus, a power bus, and banks of electronic components are disposed on the platform in electrical communication with the photonic devices. The electronic components in a given bank are selectively configurable to tune the optical characteristic of the associated device so a variance can be diminished between the fabrication and target performances of the device's optical characteristic due to the difference in the fabrication process.

Abstract: An optical circuit for routing a signal includes a coupler and first and second waveguides. The coupler has an input for the signal and has first and second outputs. The first waveguide has a first optical connection to the first output, and the second waveguide has a second optical connection to the second output. Both waveguides have the same propagation length. The first and second waveguides include different widths at the respective optical connections to the respective outputs. This coupler can be used with another input couplers, two additional waveguides, and two 2×2 output couplers to provide a 90-degree hybrid for mixing signal light and local oscillator light in a coherent receiver or the like.

Abstract: An optical circuit is used with continuous wave signals having different wavelengths at a channel spacing from one another. A portion of the optical circuit is implemented in a photonic integrated circuit. Modulators in a modulation stage modulate the continuous wave signals to produce modulated signals. A multiplexing stage, which can have multiplexing filters, power combiners, or power couplers, multiplexes the continuous wave or modulated signals to produce multiplexed signals. The multiplexing stage may be placed either before or after the modulation stage. One or more polarization rotator and combiner (PRC) devices in a final stage combines the multiplexed signals into an output signal. The output signal has a first set of the different wavelengths at a first polarization and has a second separate set of the different wavelengths at a second polarization orthogonal to the first polarization.

Abstract: A photonic integrated circuit (PIC) device has photonic devices arranged in an array with respect to control and common conductors. Each of the photonic devices has a photonic component (e.g., photodiode, thermo-optic phase shifter, etc.) and a switching diode connected in series with one another between a control connection and a common connection. The photonic component has at least one optical port, which can be coupled to a waveguide in the PIC device. The switching diode is configured to switch between reverse and forward bias in response to the electrical signals. In this way, control circuitry for providing control and monitoring signals to the conductors can be greatly simplified, and the PIC device can be more compact.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: An optical circuit for routing a signal includes a coupler and first and second waveguides. The coupler has an input for the signal and has first and second outputs. The first waveguide has a first optical connection to the first output, and the second waveguide has a second optical connection to the second output. Both waveguides have the same propagation length. The first and second waveguides include different widths at the respective optical connections to the respective outputs. This coupler can be used with another input couplers, two additional waveguides, and two 2×2 output couplers to provide a 90-degree hybrid for mixing signal light and local oscillator light in a coherent receiver or the like.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.