Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: A method for treating Type II diabetes. The method involves administering to a subject a pharmaceutical composition comprising an effective amount of a 5-HT1A receptor antagonist. The pharmaceutical composition comprises an effective amount of a 5-HT1A receptor antagonist, and pharmaceutically acceptable carriers thereof.

Abstract: A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in the first dielectric layer. The second semiconductor die includes a second bonding structure. The second bonding structure includes a second dielectric layer and second conductors embedded in the second dielectric layer. The first dielectric layer is in contact with the second dielectric layer, and the first conductors are in contact with the second conductors. Thermal conductivity of the first dielectric layer and the second dielectric layer is greater than thermal conductivity of silicon dioxide.

Abstract: To solve the problems of the prior art, an optical element driving mechanism is provided. The optical element driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movable relative to the fixed part. The driving assembly drives the movable part to move relative to the fixed part.

Abstract: An optical element driving mechanism is provided, which includes a movable assembly, a fixed portion, a driving assembly, and an adhesive element. The movable assembly is used for connecting an optical element. The movable assembly is movable relative to the fixed portion. The fixed portion includes a case and a bottom. The driving assembly is used for driving the movable assembly to move relative to the fixed portion. The case is affixed on the bottom through the adhesive element.

Abstract: An optical element driving mechanism is provided, which includes a movable assembly, a fixed portion, and a driving assembly. The movable assembly is used for connecting an optical element. The movable assembly is movable relative to the fixed portion. The driving assembly is used for driving the movable assembly to move relative to the fixed portion.

Abstract: An optical element driving mechanism is provided, which includes a movable assembly, a fixed portion, a driving assembly, and a circuit assembly. The movable assembly is used for connecting an optical element. The movable assembly is movable relative to the fixed portion. The driving assembly is used for driving the movable assembly to move relative to the fixed portion. The circuit assembly connects the movable assembly and the fixed portion.

Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.

Abstract: An optical element driving mechanism is provided, including a first movable part, a fixed part, and a first driving assembly. The first movable part is connected to a first optical element. The first movable part is movable relative to the fixed part. The first driving assembly drives the first movable part to move.

Abstract: An optical element driving mechanism is provided, including a first movable part, a fixed part, and a first driving assembly. The first movable part is connected to a first optical element. The first movable part is movable relative to the fixed part.

Abstract: An optical element driving mechanism is provided, which includes a fixed portion, a first movable portion, and a driving assembly. The first movable portion is used for connecting to a first optical element. The first movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the first movable portion to move relative to the fixed portion.

Abstract: An optical component driving mechanism is provided, including a holder, a fixed portion, a driving assembly, and a first circuit assembly. The holder is used to connect the optical component. The holder is movable relative to the fixed portion. The driving assembly is used to drive the holder to move relative to the fixed portion. The first circuit assembly is fixedly disposed on the holder. The first circuit assembly is electrically connected to the driving assembly.

Abstract: The present invention provides a wireless communication method of an access point. The wireless communication method comprises the steps of: establishing a cache table comprising a plurality of reference MAC and corresponding PMKs and reference PMKIDs; receiving an association request from a station; reading a MAC address of the station and a PMKID from the association request; if the MAC address of the station and the PMKID do not match items of the cache table, performing a calculation on the PMKID to obtain an original PMKID; determining if the original PMKID matches any one of the reference PMKIDs within the cache table; and if the original PMKID matches one reference PMKID within the cache table, determining that the reference MAC recorded in the cache table and the MAC address belong to the same station.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is configured to connect an optical member. The movable portion is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion.

Abstract: An optical member driving mechanism is provided, including a movable portion, a fixed portion, and a driving assembly. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion.

Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.

Abstract: A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in the first dielectric layer. The second semiconductor die includes a second bonding structure. The second bonding structure includes a second dielectric layer and second conductors embedded in the second dielectric layer. The first dielectric layer is in contact with the second dielectric layer, and the first conductors are in contact with the second conductors. Thermal conductivity of the first dielectric layer and the second dielectric layer is greater than thermal conductivity of silicon dioxide.

Abstract: An optical member driving mechanism is provided, including a movable portion, a fixed portion, a driving assembly, and a guiding assembly. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion, and the movable portion moves relative to the fixed portion through the guiding assembly.

Abstract: An optical component driving mechanism is provided. The optical component driving mechanism includes a first holder, a fixed portion, a first driving assembly, and a support assembly. The first holder is connected to a first optical component having an optical axis. The first holder is movable relative to the fixed portion. The first driving assembly is configured to drive the first holder to move relative to the fixed portion. The first holder is movable relative to the fixed portion via the support assembly.

Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.