Patents by Inventor Po-Feng Lee

Po-Feng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961546
    Abstract: A reference circuit for generating a reference current includes a plurality of resistive elements including at least one magnetic tunnel junction (MTJ). A control circuit is coupled to a first terminal of the at least one MTJ and is configured to selectively flow current through the at least one MTJ in the forward and inverse direction to generate a reference current.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Fu Lee, Hon-Jarn Lin, Po-Hao Lee, Ku-Feng Lin, Yi-Chun Shih, Yu-Der Chih
  • Publication number: 20240079408
    Abstract: A method includes the following operations: disconnecting at least one of drain regions that are formed on a first active area, of first transistors, from a first voltage; and disconnecting at least one of drain regions that are formed on a second active area, of second transistors coupled to the first transistors from a second voltage. The at least one of drain regions of the second transistors corresponds to the at least one of drain regions of the first transistors.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Feng CHANG, Po-Lin PENG, Jam-Wem LEE
  • Patent number: 11231384
    Abstract: The present invention provides a humidity sensor, comprising a substrate having a coating wire and at least one humidity detecting portion S, each humidity detecting portion S comprises at least two electrodes, and each of electrodes is connected to their respective coating wires, and an electrochemical medium which is electrically insulated when dry and conductive when wet is provided between electrodes. This kind of humidity sensors can be used to monitor humidity in a highly sensitive manner, especially monitor the amount and extent of urine.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: January 25, 2022
    Assignee: BIOCONN CORPORATION
    Inventors: Kuo Chung Chang, Guo Cai Huang, Po-Feng Lee, Mei-Yen Fang
  • Publication number: 20190302048
    Abstract: The present invention provides a humidity sensor, comprising a substrate having a coating wire and at least one humidity detecting portion S, each humidity detecting portion S comprises at least two electrodes, and each of electrodes is connected to their respective coating wires, and an electrochemical medium which is electrically insulated when dry and conductive when wet is provided between electrodes. This kind of humidity sensors can be used to monitor humidity in a highly sensitive manner, especially monitor the amount and extent of urine.
    Type: Application
    Filed: February 26, 2019
    Publication date: October 3, 2019
    Inventors: Kuo Chung CHANG, Guo Cai HUANG, Po-Feng LEE, Mei-Yen FANG
  • Patent number: 10175309
    Abstract: An electromagnetic impedance sensing device includes a first substrate, a first patterned conductive layer, a second substrate, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The first substrate has a first surface, and the first patterned conductive layer is formed on the first surface. The second substrate has a second surface facing to the first surface, and the second patterned conductive layer is formed on the second surface and electrically contacted to the first patterned conductive layer. The first and second patterned conductive layers are physically integrated to define an accommodation space allowing the magneto-conductive wire passing there through. The magneto-conductive wire is encapsulated by the encapsulation layer to make the magneto-conductive wire electrically isolated from the first and second patterned conductive layers, respectively.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: January 8, 2019
    Assignee: PROLIFIC TECHNOLOGY INC.
    Inventors: Hung-Ta Li, Po-Feng Lee
  • Patent number: 10132878
    Abstract: An electromagnetic impedance sensing device includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The substrate has a surface and a trench extending into thereof. The first patterned conductive layer is formed on the surface, as well as a bottom and sidewalls of the trench. The magneto-conductive wire is disposed in the trench. The second patterned conductive layer extending across the trench and electrically in contact with the first patterned conductive layer is formed on the first patterned conductive layer to make the magneto-conductive wire sandwiched between the first and the second patterned conductive layers. The magneto-conductive wire is encapsulated by the encapsulation layer to make the magneto-conductive wire electrically isolated from the first and second patterned conductive layers.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: November 20, 2018
    Assignee: PROLIFIC TECHNOLOGY INC.
    Inventors: Hung-Ta Li, Po-Feng Lee
  • Publication number: 20170074951
    Abstract: An electromagnetic impedance sensing device includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The substrate has a surface and a trench extending into thereof. The first patterned conductive layer is formed on the surface, as well as a bottom and sidewalls of the trench. The magneto-conductive wire is disposed in the trench. The second patterned conductive layer extending across the trench and electrically in contact with the first patterned conductive layer is formed on the first patterned conductive layer to make the magneto-conductive wire sandwiched between the first and the second patterned conductive layers. The magneto-conductive wire is encapsulated by the encapsulation layer to make the magneto-conductive wire electrically isolated from the first and second patterned conductive layers.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 16, 2017
    Applicant: PROLIFIC TECHNOLOGY INC.
    Inventors: Hung-Ta LI, Po-Feng LEE
  • Publication number: 20170074950
    Abstract: An electromagnetic impedance sensing device includes a first substrate, a first patterned conductive layer, a second substrate, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The first substrate has a first surface, and the first patterned conductive layer is formed on the first surface. The second substrate has a second surface facing to the first surface, and the second patterned conductive layer is formed on the second surface and electrically contacted to the first patterned conductive layer. The first and second patterned conductive layers are physically integrated to define an accommodation space allowing the magneto-conductive wire passing there through. The magneto-conductive wire is encapsulated by the encapsulation layer to make the magneto-conductive wire electrically isolated from the first and second patterned conductive layers, respectively.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 16, 2017
    Applicant: PROLIFIC TECHNOLOGY INC.
    Inventors: Hung-Ta LI, Po-Feng LEE
  • Patent number: D419898
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: February 1, 2000
    Assignee: Chun-Mu Huang
    Inventors: Po-Feng Lee, Yi Tsung Wu