Abstract: The invention discloses a semiconductor package structure including a package carrier, at least one electronic component, a packaging layer, a support component and a shielding layer. The electronic component is disposed on a first surface of the package carrier. The packaging layer is disposed on the first surface and covers the electronic component. The support component is embedded in the packaging layer to surround the electronic component. An end surface of the support component is electrically connected to a build-up circuit and electrically grounded. A patterned metal layer of the shielding layer is electrically connected to the support component. The shielding range of the patterned metal layer covers at least electronic component. A shielding space, which covers the electronic component, is formed by the support component and the shielding layer. In addition, a semiconductor EMI shielding component and a method of making a semiconductor package structure are also disclosed.

Abstract: The invention discloses a semiconductor package structure including a package carrier, at least one electronic component, a packaging layer, a support component and a shielding layer. The electronic component is disposed on a first surface of the package carrier. The packaging layer is disposed on the first surface and covers the electronic component. The support component is embedded in the packaging layer to surround the electronic component. An end surface of the support component is electrically connected to a build-up circuit and electrically grounded. A patterned metal layer of the shielding layer is electrically connected to the support component. The shielding range of the patterned metal layer covers at least electronic component. A shielding space, which covers the electronic component, is formed by the support component and the shielding layer. In addition, a semiconductor EMI shielding component and a method of making a semiconductor package structure are also disclosed.

Abstract: Power path management method and circuit are provided. The supply current drained from a power supply is detected and controlled not to exceed a supply current limit . The charge current charging a battery is detected and controlled not to exceed a charge current limit . When the supply current is found to exceed the supply current limit, the charge current limit is decreased.

Abstract: Circuits providing a regulated voltage. An output stage has a power switch with a control node, a power input node and a power output node. The power input node is coupled to a source voltage and the power output node provides the regulated voltage. An amplifier stage compares a feedback voltage with a reference voltage, having first and second output nodes. The feedback voltage is about in proportion to the regulated voltage. A buffer stage has an input node connected to the first output node. The output node of the buffer stage and the second output node of the amplifier stage together drive the control node of the output stage.

Abstract: A multi-input single-output power converter comprises several switching regulators coupled to a common output for converting separate supply voltages to an output voltage in compliance with respective modulation signals. The output voltage is compared with a first reference signal to generate an error signal, the currents of the switching regulators are sensed to generate respective sense signals, and the modulation signal of one switching regulator is determined based on the sense signal of the switching regulator, the average sense signal of all the switching regulators, a second reference signal and the error signal. Particularly, the difference between the sense signal and average sense signal is used to adjust the level of the second reference signal for the error signal to compare to determine the modulation signal.

Abstract: A multi-input single-output power converter comprises several switching regulators coupled to a common output for converting separate supply voltages to an output voltage in compliance with respective modulation signals. The output voltage is compared with a first reference signal to generate an error signal, the currents of the switching regulators are sensed to generate respective sense signals, and the modulation signal of one switching regulator is determined based on the sense signal of the switching regulator, the average sense signal of all the switching regulators, a second reference signal and the error signal. Particularly, the difference between the sense signal and average sense signal is used to adjust the level of the second reference signal for the error signal to compare to determine the modulation signal.