Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.

Abstract: A calibration apparatus includes a processor, an alignment device, and an arm. The alignment device captures images in a three-dimensional space, and a tool is arranged on a flange of the arm. The processor records a first matrix of transformation between an end-effector coordinate-system and a robot coordinate-system, and performs a tool calibration procedure according to the images captured by the alignment device for obtaining a second matrix of transformation between a tool coordinate-system and the end-effector coordinate-system. The processor calculates relative position of a tool center point of the tool in the robot coordinate-system based on the first and second matrixes, and controls the TCP to move in the three-dimensional space for performing a positioning procedure so as to regard points in an alignment device coordinate-system as points of the TCP, and calculates the relative positions of points in the alignment device coordinate-system and in the robot coordinate-system.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.

Abstract: Event intensity assessment can include detecting an event description within textual input received via a data communication network. An event-correlated data structure based on the event can be generated, the event-correlated data structure including an event descriptor corresponding to the event. An event sentiment can be determined based on the event descriptor and an event impact based on a quantitative temporal-spatial measure corresponding to the event. An event intensity can be determined based on the event sentiment and event impact. A GUI can be modified in response to the event intensity exceeding a predetermined threshold. The GUI can be modified to indicate the event and the event intensity.

Abstract: An endoscope particularly suited for endocranial procedures and a method of using the endoscope. In some examples the endoscope is rigid except for a bend/tilt portion near a distal end of a rigid tube that is inserted in a patient's cranium, which distal end is controlled in a degree and direction of tilt with a finger operated controller at the endoscope's handle. Some examples use telescoping tubes that allow customizing the endoscope size for specific procedures. A distal portion of the endoscope can be disposable, supplied in a sterile package for a single procedure, thus taking into account contamination dangers that are particularly high for intracranial and certain other interventions and the fact that it can be difficult or impossible to effectively autoclave heat-sensitive components of certain endoscopes or effectively sterilize them using other techniques.

Abstract: A security system includes a physical unclonable function circuit, a write-in protection circuit, a memory, and a readout decryption circuit. The physical unclonable function circuit provides a plurality of random bit strings. The write-in protection circuit receives a write-in address and original data, and includes an address scrambling unit. The address scrambling unit generates a scrambled address by scrambling a write-in address according to a random bit string provided by the physical unclonable function circuit. The memory stores the storage data corresponding to the original data according to the scrambled address. The readout decryption circuit reads out the storage data from the memory according to the write-in address to derive the original data.

Abstract: Various examples with respect to method and apparatus for active stereo vision are described. An apparatus may include an electromagnetic (EM) wave emitter, a first sensor and a second sensor. During operation, the EM wave emitter emits EM waves toward a scene, the first sensor captures a first image of the scene in an infrared (IR) spectrum, and the second sensor captures a second image of the scene in a light spectrum. The first image and second image, when processed, may enable active stereo vision.

Abstract: A security system with entropy bits includes a physically unclonable function circuit, and a security key generator. The physically unclonable function circuit provides a plurality of entropy bit strings. The security key generator generates a security key by manipulating a manipulation bit string derived from the plurality of entropy bit strings according to an operation entropy bit string. Each bit of the operation entropy bit string is used to determine whether to perform a corresponding operation to the manipulation bit string.

Abstract: A sensing amplification circuit includes a sensing amplifier and a trigger control circuit. The sensing amplifier receives a data voltage and a reference voltage, and outputs a first data signal and a second data signal by comparing the data voltage and the reference voltage. The trigger control circuit includes a logic circuit and a set-reset latch. The logic circuit receives the first data signal and the second data signal, and changes a first control signal from a first voltage level to a second voltage level when one of the first data signal and the second data signal changes its state. The first set-reset latch receives the first control signal and a second control signal, and generates a trigger signal to enable the sensing amplifier when the second control signal changes state and disable the sensing amplifier when the first control signal changes state.

Abstract: A sensing amplification circuit includes a sensing amplifier and a trigger control circuit. The sensing amplifier receives a data voltage and a reference voltage, and outputs a first data signal and a second data signal by comparing the data voltage and the reference voltage. The trigger control circuit includes a logic circuit and a set-reset latch. The logic circuit receives the first data signal and the second data signal, and changes a first control signal from a first voltage level to a second voltage level when one of the first data signal and the second data signal changes its state. The first set-reset latch receives the first control signal and a second control signal, and generates a trigger signal to enable the sensing amplifier when the second control signal changes state and disable the sensing amplifier when the first control signal changes state.

Abstract: An endoscope particularly suited for endocranial procedures and a method of using the endoscope. In some examples the endoscope is rigid except for a bend/tilt portion near a distal end of a rigid tube that is inserted in a patient's cranium, which distal end is controlled in a degree and direction of tilt with a finger operated controller at the endoscope's handle. Some examples use telescoping tubes that allow customizing the endoscope size for specific procedures. A distal portion of the endoscope can be disposable, supplied in a sterile package for a single procedure, thus taking into account contamination dangers that are particularly high for intracranial and certain other interventions and the fact that it can be difficult or impossible to effectively autoclave heat-sensitive components of certain endoscopes or effectively sterilize them using other techniques.

Abstract: Various examples with respect to method and apparatus for active stereo vision are described. An apparatus may include an electromagnetic (EM) wave emitter, a first sensor and a second sensor. During operation, the EM wave emitter emits EM waves toward a scene, the first sensor captures a first image of the scene in an infrared (IR) spectrum, and the second sensor captures a second image of the scene in a light spectrum. The first image and second image, when processed, may enable active stereo vision.

Abstract: An endoscope particularly suited for endocranial procedures and a method of using the endoscope. In some examples the endoscope is rigid except for a bend/tilt portion near a distal end of a rigid tube that is inserted in a patient's cranium, which distal end is controlled in a degree and direction of tilt with a finger operated controller at the endoscope's handle. Some examples use telescoping tubes that allow customizing the endoscope size for specific procedures. A distal portion of the endoscope can be disposable, supplied in a sterile package for a single procedure, thus taking into account contamination dangers that are particularly high for intracranial and certain other interventions and the fact that it can be difficult or impossible to effectively autoclave heat-sensitive components of certain endoscopes or effectively sterilize them using other techniques.

Abstract: A security system includes a physical unclonable function circuit, a write-in protection circuit, a memory, and a readout decryption circuit. The physical unclonable function circuit provides a plurality of random bit strings. The write-in protection circuit receives a write-in address and original data, and includes an address scrambling unit. The address scrambling unit generates a scrambled address by scrambling a write-in address according to a random bit string provided by the physical unclonable function circuit. The memory stores the storage data corresponding to the original data according to the scrambled address. The readout decryption circuit reads out the storage data from the memory according to the write-in address to derive the original data.