Patents by Inventor Po Hsiang Chuang

Po Hsiang Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240047581
    Abstract: A semiconductor structure includes a semiconductor substrate, a gate electrode, a first spacer, and a first contact etch stop layer (CESL). The semiconductor substrate includes a fin structure. The gate electrode is over the fin structure. The first spacer is over the fin structure and on a lateral side of the gate electrode, wherein a top surface of the first spacer is inclined towards the gate electrode. The first CESL is over the fin structure and contacting the first spacer, wherein an angle between the top surface of the first spacer and a sidewall of the first CESL is less than about 140°.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 8, 2024
    Inventors: SHAO-HUA HSU, CHIH-WEI WU, MAO-LIN WENG, WEI-YEH TANG, YEN-CHENG LAI, CHUN-CHAN HSIAO, PO-HSIANG CHUANG, CHIH-LONG CHIANG, YIH-ANN LIN, RYAN CHIA-JEN CHEN
  • Patent number: 11758642
    Abstract: In one embodiment, a grounding structure for a printed circuit board (PCB) of an information handling system includes: a first ground via electrically coupled to a ground layer of the PCB; a second ground via electrically coupled to the ground layer of the PCB; and a conductive strip electrically coupling the first ground via to the second ground via, the conductive strip providing a vertical ground reference for a signal transferred from a first surface of the PCB to a second surface of the PCB through a signal via disposed on the PCB.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Fong-An Kan, Chian-Ting Chen, Po Hsiang Chuang
  • Publication number: 20230199938
    Abstract: In one embodiment, a grounding structure for a printed circuit board (PCB) of an information handling system includes: a first ground via electrically coupled to a ground layer of the PCB; a second ground via electrically coupled to the ground layer of the PCB; and a conductive strip electrically coupling the first ground via to the second ground via, the conductive strip providing a vertical ground reference for a signal transferred from a first surface of the PCB to a second surface of the PCB through a signal via disposed on the PCB.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 22, 2023
    Inventors: Fong-An Kan, Chian-Ting Chen, Po Hsiang Chuang