Abstract: An image sensor includes a first pixel array. The first pixel array includes multiple photo diodes and a polyhedron structure. The polyhedron structure is located above the photo diodes, and the polyhedron structure includes a bottom facet, a top facet, and at least one side facet. The bottom facet is located between the side facet and the photo diodes, and an orthogonal projection of the polyhedron structure overlaps with photo diodes. The polyhedron structure is configured to divide an incident light into a plurality of light beams focused in the photo diodes.

Abstract: An image sensor includes a sensor layer and a color filter layer disposed on the sensor layer. The image sensor further includes a lens layer disposed on the color filter layer. The lens layer includes a plurality of micro lenses. The image sensor further includes a first cut filter layer disposed over the lens layer. The first surface of the first cut filter layer has a plurality of first protrusions.

Abstract: A fan-out package includes a molding compound die frame laterally surrounding at least one semiconductor die; and an organic interposer including redistribution dielectric layers embedding redistribution wiring interconnects and located on a first horizontal surface of the molding compound die frame. An alignment mark region including a localized recess region is located within an opening in a second horizontal surface of the molding compound die frame. The localized recess region extends from the second horizontal surface toward the organic interposer.

Abstract: An apparatus and a method for effectively exhausting evaporated material are provided. In an embodiment the apparatus includes a hot plate and an exhaust hood assembly suspended over the hot plate. The exhaust hood assembly includes a trench plate, a cover plate over the trench plate and a single exhaust pipe header over and attached to a single exhaust opening of the cover plate. During operation, the exhaust hood assembly reduces the amount of condensation and also collects any remaining condensation in order to help prevent condensation from impacting further manufacturing steps.

Abstract: A method of fabricating a redistribution circuit structure including the following steps is provided. A conductive via is formed. A photosensitive dielectric layer is formed to cover the conductive via. The photosensitive dielectric layer is partially removed to reveal the conductive via at least through an exposure and development process. A redistribution wiring is formed on the photosensitive dielectric layer and the revealed conductive via.

Abstract: A semiconductor device includes a semiconductor substrate, a plurality of semiconductor dies, a dielectric layer, a connector, and a passivation layer. The plurality of semiconductor dies are stacked on one another and disposed over the semiconductor substrate. The dielectric layer cover a top surface and a side surface of the each of the plurality of semiconductor dies. The connector is disposed over a topmost one of the plurality of semiconductor dies. The passivation layer is disposed over the dielectric layer and laterally surrounds the connector, wherein, from a cross sectional view, an acute angle is included between an outermost side surface of the passivation layer and a bottom surface of the passivation layer.

Abstract: A method includes forming a metal post over a first redistribution structure; attaching a first device die to the first redistribution structure, the first device die comprising a through via embedded in a semiconductor substrate; encapsulating the metal post and the first device die in an encapsulant, a first top surface of the encapsulant being level with a second top surface of the semiconductor substrate; recessing the second top surface to expose the through via; forming a dielectric isolation layer around the through via; forming a dielectric layer over the dielectric isolation layer; etching the dielectric layer to form a first opening and a second opening in the dielectric layer; forming a first metal via in the first opening and a second metal via in the second opening; and forming a second redistribution structure over the dielectric layer.

Abstract: A shock wave generating unit includes a housing and a disk in the housing. The disk includes a vibration plate, which corresponds to a shock wave transmission member covering a first opening of the housing and includes an insulating thin elastic plate and a thin metal plate. The insulating thin elastic plate, with one side corresponding to the shock wave transmission member and the opposite side provided with the thin metal plate, has a hollow portion for partially exposing the thin metal plate and forms an accommodating cavity together with the exposed portion of the thin metal plate and the shock wave transmission member. A shock wave transmission medium can circulate through the accommodating cavity via a channel in the housing and is in contact with the exposed portion of the thin metal plate to facilitate dissipation of the heat generated by the disk during operation.

Abstract: A shock wave generating unit includes a housing and a disk in the housing. The disk includes a vibration plate, which corresponds to a shock wave transmission member covering a first opening of the housing and includes an insulating thin elastic plate and a thin metal plate. The insulating thin elastic plate, with one side corresponding to the shock wave transmission member and the opposite side provided with the thin metal plate, has a hollow portion for partially exposing the thin metal plate and forms an accommodating cavity together with the exposed portion of the thin metal plate and the shock wave transmission member. A shock wave transmission medium can circulate through the accommodating cavity via a channel in the housing and is in contact with the exposed portion of the thin metal plate to facilitate dissipation of the heat generated by the disk during operation.

Abstract: An invasive shock wave applicator for applying shock waves sideways includes a bar-shaped invasive member and a disk. The invasive member defines a lateral side, has a first end with a recess extending inward from the lateral side, and is provided with a shock wave transmission member detachably sealing the opening of the recess. The disk is embedded in the invasive member; divides the recess into first and second receiving rooms, which are adjacent to and away from the shock wave transmission member respectively; and is provided with a vibration plate adjacent to the first receiving room and facing the shock wave transmission member. The first receiving room is filled with a shock wave transmission medium. Shock waves propagate toward the lateral side of the invasive member to facilitate the performance of an invasive shock wave treatment in a human cavity of the human body.

Abstract: The present invention discloses a shockwave head structure having a bending angle. The shockwave head structure includes a shockwave waveguide body and a path regulation unit. The path regulation unit is located inside the shockwave waveguide body and can refract or reflect an energy wave entering from an incident port of the shockwave waveguide body to an exit port of the shockwave waveguide body, thereby regulating the path of the energy wave. With the implementation of the present invention, the shockwave head structure can be applied to different body parts or body positions. Thus, the practicability of the shockwave head structure is increased.