Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

Abstract: A light emitting device including a light emitting unit, two electrodes, a reflective member, and a light transmissive member is provided. The two electrodes are disposed on one side of the light emitting unit, and electrically connected to the light emitting unit. The reflective member is disposed on the other side of the light emitting unit, and has at least one reflective surface. The light transmissive member is disposed between the reflective member and the light emitting unit, and covers a part of the light emitting unit. A lateral surface of the light transmissive member is served as a light emitting surface of the light emitting device. A manufacturing method of a light emitting device is also provided.

Abstract: Polypropylene-coated functionalized multiwall carbon nanotubes (PP/f-MWNT) comprising functionalized multiwall carbon nanotubes (f-MWNT) in an amount of from about 0.5 wt. % to about 80 wt. %, based on the total weight of the PP/f-MWNT; and polypropylene (PP) in an amount of from about 20 wt. % to about 99.5 wt. %, based on the total weight of the PP/f-MWNT. A method of making PP/f-MWNT comprising (a) contacting pristine multiwall carbon nanotubes (p-MWNT) with nitric acid to produce f-MWNT; (b) contacting at least a portion of the f-MWNT with a first solvent to form a f-MWNT dispersion; (c) contacting PP with a second solvent to form a PP solution; (d) contacting at least a portion of the f-MWNT dispersion with at least a portion of the PP solution to form a PP and f-MWNT suspension; and (e) drying at least a portion of the PP and f-MWNT suspension to form the PP/f-MWNT.

Abstract: A method of making a HIPP composite comprising blending polypropylene-coated functionalized multiwall carbon nanotubes (PP/f-MWNT) with a first PP to produce a PP and PP/f-MWNT mixture, wherein PP/f-MWNT comprise f-MWNT coated with a second PP via non-covalent interactions, wherein PP and PP/f-MWNT mixture comprises 0.0005 to 5 wt. % f-MWNT, based on the weight of PP and PP/f-MWNT mixture, wherein the first PP and the second PP are the same or different; melt blending the PP and PP/f-MWNT mixture to form a molten PP and PP/f-MWNT mixture; and shaping the molten PP and PP/f-MWNT mixture to form the HIPP composite. A HIPP composite comprising a continuous polymeric phase having dispersed therein a plurality of PP/f-MWNT, wherein the continuous polymeric phase comprises a first PP, wherein PP/f-MWNT comprise f-MWNT coated with a second PP via non-covalent interactions, wherein HIPP composite comprises 0.0005 to 5 wt. % f-MWNT, based on the weight of HIPP.

Abstract: Polypropylene-coated functionalized multiwall carbon nanotubes (PP/f-MWNT) comprising functionalized multiwall carbon nanotubes (f-MWNT) in an amount of from about 0.5 wt. % to about 80 wt. %, based on the total weight of the PP/f-MWNT; and polypropylene (PP) in an amount of from about 20 wt. % to about 99.5 wt. %, based on the total weight of the PP/f-MWNT. A method of making PP/f-MWNT comprising (a) contacting pristine multiwall carbon nanotubes (p-MWNT) with nitric acid to produce f-MWNT; (b) contacting at least a portion of the f-MWNT with a first solvent to form a f-MWNT dispersion; (c) contacting PP with a second solvent to form a PP solution; (d) contacting at least a portion of the f-MWNT dispersion with at least a portion of the PP solution to form a PP and f-MWNT suspension; and (e) drying at least a portion of the PP and f-MWNT suspension to form the PP/f-MWNT.

Abstract: A method, a system and an electronic apparatus for searching nearby apparatuses are proposed. The method includes: searching at least one first apparatus belonging to a first subnet which the electronic apparatus belongs to, and accordingly generating a first list; scanning at least one access point (AP) near the electronic apparatus, and accordingly generating a first AP list; uploading the first AP list to a server, and receiving a second list from the server, where the second list includes at least one second apparatus, and a similarity between a second AP list of each second apparatus and the first AP list is higher than a predetermined threshold; and uniting the first list and the second list to generate a pairing list including at least one apparatus to be paired.

Abstract: A method, a system and an electronic apparatus for searching nearby apparatuses are proposed. The method includes: searching at least one first apparatus belonging to a first subnet which the electronic apparatus belongs to, and accordingly generating a first list; scanning at least one access point (AP) near the electronic apparatus, and accordingly generating a first AP list; uploading the first AP list to a server, and receiving a second list from the server, where the second list includes at least one second apparatus, and a similarity between a second AP list of each second apparatus and the first AP list is higher than a predetermined threshold; and uniting the first list and the second list to generate a pairing list including at least one apparatus to be paired.

Abstract: A method, a system and an electronic apparatus for searching nearby apparatuses are proposed. The method includes: searching at least one first apparatus belonging to a first subnet which the electronic apparatus belongs to, and accordingly generating a first list; scanning at least one access point (AP) near the electronic apparatus, and accordingly generating a first AP list; uploading the first AP list to a server, and receiving a second list from the server, where the second list includes at least one second apparatus, and a similarity between a second AP list of each second apparatus and the first AP list is higher than a predeteiuiined threshold; and uniting the first list and the second list to generate a pairing list including at least one apparatus to be paired.

Abstract: A method, a system and an electronic apparatus for searching nearby apparatuses are proposed. The method includes: searching at least one first apparatus belonging to a first subnet which the electronic apparatus belongs to, and accordingly generating a first list; scanning at least one access point (AP) near the electronic apparatus, and accordingly generating a first AP list; uploading the first AP list to a server, and receiving a second list from the server, where the second list includes at least one second apparatus, and a similarity between a second AP list of each second apparatus and the first AP list is higher than a predetermined threshold; and uniting the first list and the second list to generate a pairing list including at least one apparatus to be paired.

Abstract: A method, a system and an electronic apparatus for searching nearby apparatuses are proposed. The method includes: searching at least one first apparatus belonging to a first subnet which the electronic apparatus belongs to, and accordingly generating a first list; scanning at least one access point (AP) near the electronic apparatus, and accordingly generating a first AP list; uploading the first AP list to a server, and receiving a second list from the server, where the second list includes at least one second apparatus, and a similarity between a second AP list of each second apparatus and the first AP list is higher than a predetermined threshold; and uniting the first list and the second list to generate a pairing list including at least one apparatus to be paired.

Abstract: A method, a system and an electronic apparatus for searching nearby apparatuses are proposed. The method includes: searching at least one first apparatus belonging to a first subnet which the electronic apparatus belongs to, and accordingly generating a first list; scanning at least one access point (AP) near the electronic apparatus, and accordingly generating a first AP list; uploading the first AP list to a server, and receiving a second list from the server, where the second list includes at least one second apparatus, and a similarity between a second AP list of each second apparatus and the first AP list is higher than a predetermined threshold; and uniting the first list and the second list to generate a pairing list including at least one apparatus to be paired.

Abstract: An electronic device and a method for data copy between electronic devices are provided, and the method includes following steps. Data is added to a clipboard of an electronic device. It is determined whether the electronic device is connected to a network associated to a network unit, so as to determine to use the network unit or a wireless transmission unit to transmit the data. If the electronic device is not connected to the network, the data is directly transmitted to another electronic device by the wireless transmission unit, such that the data is added to another clipboard of another electronic device. If the electronic device is connected to the network, the data is indirectly transmitted to the another electronic device by the network unit via a sever in the network, such that the data is added to the another clipboard of the another electronic device.