Patents by Inventor Po-Hsien Lin

Po-Hsien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210375672
    Abstract: A method includes forming a patterned mask comprising a first opening, plating a conductive feature in the first opening, depositing a passivation layer on a sidewall and a top surface of the conductive feature, and patterning the passivation layer to form a second opening in the passivation layer. The passivation layer has sidewalls facing the second opening. A planarization layer is dispensed on the passivation layer. The planarization layer is patterned to form a third opening. After the planarization layer is patterned, a portion of the planarization layer is located in the second opening and covers the sidewalls of the passivation layer. An Under-Bump Metallurgy (UBM) is formed to extend into the third opening.
    Type: Application
    Filed: December 4, 2020
    Publication date: December 2, 2021
    Inventors: Ming-Da Cheng, Tzy-Kuang Lee, Hao Chun Liu, Po-Hao Tsai, Chih-Hsien Lin, Ching-Wen Hsiao
  • Patent number: 11134753
    Abstract: An automatic lacing mechanism automatically laces between two shoe pieces, and includes a clamping module, a positioning module, a shoelace-running module, and a shoelace-arranging module. The clamping module is adapted to fixedly clamp shoe pieces. The positioning module is adapted to position the shoe pieces prior to the shoe pieces are fixedly clamped, so that the clamping module could firmly clamp the shoe pieces. The shoelace-running module is adapted to run the shoelace through the lace eyelets on the shoe pieces. The shoelace-arranging module is adapted to change the direction of the shoelace during lacing. The positioning module has two positioning pins, wherein a distance therebetween is adjustable, and therefore the positioning module is suitable for the positioning of footwear having different distances between its lace eyelets, which could make the automatic lacing process smoother.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: October 5, 2021
    Inventors: Chang-Chen Yang, Po-Chih Lin, Chun-Hsien Ou
  • Publication number: 20210298140
    Abstract: In one example in accordance with the present disclosure, a computing device is described. The computing device includes a housing and a light source to illuminate through a window in the housing. The computing device also includes a controller. The controller determines a usage level of a processor of the computing device. The controller also adjusts a characteristic of the light source based on a determined usage level of the processor.
    Type: Application
    Filed: November 29, 2018
    Publication date: September 23, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Po-Hsien Lin, An Chih Chu
  • Publication number: 20210280511
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Application
    Filed: May 10, 2021
    Publication date: September 9, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin