Patents by Inventor Po-Hsuan Lai

Po-Hsuan Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990381
    Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Po-Yuan Teng, Chen-Hua Yu
  • Publication number: 20240090238
    Abstract: A memory device and a method for manufacturing the memory device are provided. The memory device includes a stack and a plurality of memory strings. The stack is disposed on the substrate, and the stack includes a plurality of conductive layers and a plurality of insulating layers alternately stacked. The memory strings pass through the stack along a first direction, wherein a first memory string in the memory strings includes a first conductive pillar and a second conductive pillar, a channel layer, and a memory structure. The first conductive pillar and the second conductive pillar respectively extend along the first direction and are separated from each other. The channel layer is disposed between the first conductive pillar and the second conductive pillar. The memory structure surrounds the second conductive pillar, and the memory structure includes a resistive memory material.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Feng-Min LEE, Erh-Kun LAI, Dai-Ying LEE, Yu-Hsuan LIN, Po-Hao TSENG, Ming-Hsiu LEE
  • Publication number: 20200147891
    Abstract: A three-dimensional printing apparatus includes a platform, a printing head, a filament box, a connecting member and a guiding tube. The connecting member is disposed between the printing head and the filament box, and includes a main body, a first transfer tube, a second transfer tube and a third transfer tube. The first transfer tube, the second transfer tube and the third transfer tube are detachably mounted to the main body. The main body has a first passage, a second passage and a third passage that communicate with each other. The first transfer tube, the second transfer tube and the third transfer tube communicate respectively with the first passage, the second passage and the third passage. The guiding tube is connected to the third transfer tube and the printing head, and communicates with the third transfer tube.
    Type: Application
    Filed: January 10, 2019
    Publication date: May 14, 2020
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Shih-Wei Huang, Po-Hsuan Lai