Patents by Inventor Po-Hsuan Liao
Po-Hsuan Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11322377Abstract: A stacking structure is applicable to manufacturing a circuit board. The stacking structure includes a transferring layer and a dielectric layer disposed on the transferring layer. The transferring layer includes a substrate and a thin film disposed on the substrate and having a plurality of recess structures thereon. The recess structures are connected as a single piece and bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement. At least a portion of the dielectric layer being is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.Type: GrantFiled: September 9, 2020Date of Patent: May 3, 2022Assignee: Unimicron Technology Corp.Inventor: Po-Hsuan Liao
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Publication number: 20200411349Abstract: A stacking structure is applicable to manufacturing a circuit board. The stacking structure includes a transferring layer and a dielectric layer disposed on the transferring layer. The transferring layer includes a substrate and a thin film disposed on the substrate and having a plurality of recess structures thereon. The recess structures are connected as a single piece and bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement. At least a portion of the dielectric layer being is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.Type: ApplicationFiled: September 9, 2020Publication date: December 31, 2020Inventor: Po-Hsuan LIAO
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Patent number: 10813231Abstract: The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.Type: GrantFiled: October 3, 2019Date of Patent: October 20, 2020Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Po-Hsuan Liao, Wen-Fang Liu
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Patent number: 10804126Abstract: A method for manufacturing a circuit board includes forming recess structures on a transferring layer; forming a dielectric layer on the transferring layer to form a stacking structure, in which the dielectric layer is at least embedded with the recess structures; bonding the stacking structure a base board by pressing, such that the dielectric layer is in contact with the base board; patterning the dielectric layer, including performing an exposure process on the stacking structure through the transferring layer; and after the exposure process is finished, removing the transferring layer.Type: GrantFiled: November 17, 2017Date of Patent: October 13, 2020Assignee: UNIMICRON TECHNOLOGY CORP.Inventor: Po-Hsuan Liao
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Patent number: 10729014Abstract: A method for manufacturing a circuit board includes forming a patterned first dielectric layer on a substrate; forming a first adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the first adhesive layer; patterning the second dielectric layer to expose a portion of a top surface of the first adhesive layer opposite to the substrate; and filling at least the patterned second dielectric layer with a conductive material, such that the conductive material is in contact with the top surface of the first adhesive layer.Type: GrantFiled: August 19, 2019Date of Patent: July 28, 2020Assignee: Unimicron Technology Corp.Inventor: Po-Hsuan Liao
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Publication number: 20200037455Abstract: The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.Type: ApplicationFiled: October 3, 2019Publication date: January 30, 2020Inventors: Po-Hsuan LIAO, Wen-Fang LIU
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Publication number: 20190373737Abstract: A method for manufacturing a circuit board includes forming a patterned first dielectric layer on a substrate; forming a first adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the first adhesive layer; patterning the second dielectric layer to expose a portion of a top surface of the first adhesive layer opposite to the substrate; and filling at least the patterned second dielectric layer with a conductive material, such that the conductive material is in contact with the top surface of the first adhesive layer.Type: ApplicationFiled: August 19, 2019Publication date: December 5, 2019Inventor: Po-Hsuan LIAO
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Patent number: 10477701Abstract: A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has at least one through hole. The through hole has an inner wall. The second dielectric layer is disposed on the adhesive layer and has a second through hole communicated with the first through hole. The conductive line is located in the second through hole of the second dielectric layer and is in contact with the inner wall of the adhesive layer.Type: GrantFiled: December 11, 2017Date of Patent: November 12, 2019Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Po-Hsuan Liao, Wen-Fang Liu
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Patent number: 10468570Abstract: A circuit board includes a base plate, a first circuit layer, a first dielectric layer, and a light emitting element. The first circuit layer is disposed on the base plate. The first dielectric layer is disposed on the base plate and has plural openings. The first circuit layer is embedded in the first dielectric layer and exposes the openings. A Young's modulus of the first dielectric layer is greater than a Young's modulus of the base plate. The light emitting element is electrically connected to the first circuit layer through the openings.Type: GrantFiled: January 26, 2018Date of Patent: November 5, 2019Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Po-Hsuan Liao, Zong-Hua Li
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Patent number: 10433426Abstract: A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a first conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has a top surface opposite to the substrate. The second dielectric layer is disposed on the adhesive layer and has at least one first through hole. The first conductive line is located in the first through hole of the second dielectric layer and is in contact with the top surface of the adhesive layer.Type: GrantFiled: December 11, 2017Date of Patent: October 1, 2019Assignee: UNIMICRON TECHNOLOGY CORP.Inventor: Po-Hsuan Liao
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Publication number: 20190181315Abstract: A circuit board includes a base plate, a first circuit layer, a first dielectric layer, and a light emitting element. The first circuit layer is disposed on the base plate. The first dielectric layer is disposed on the base plate and has plural openings. The first circuit layer is embedded in the first dielectric layer and exposes the openings. A Young's modulus of the first dielectric layer is greater than a Young's modulus of the base plate. The light emitting element is electrically connected to the first circuit layer through the openings.Type: ApplicationFiled: January 26, 2018Publication date: June 13, 2019Inventors: Po-Hsuan LIAO, Zong-Hua LI
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Publication number: 20190124775Abstract: A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a first conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has a top surface opposite to the substrate. The second dielectric layer is disposed on the adhesive layer and has at least one first through hole. The first conductive line is located in the first through hole of the second dielectric layer and is in contact with the top surface of the adhesive layer.Type: ApplicationFiled: December 11, 2017Publication date: April 25, 2019Inventor: Po-Hsuan LIAO
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Publication number: 20190124778Abstract: A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has at least one through hole. The through hole has an inner wall. The second dielectric layer is disposed on the adhesive layer and has a second through hole communicated with the first through hole. The conductive line is located in the second through hole of the second dielectric layer and is in contact with the inner wall of the adhesive layer.Type: ApplicationFiled: December 11, 2017Publication date: April 25, 2019Inventors: Po-Hsuan LIAO, Wen-Fang LIU
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Publication number: 20190096725Abstract: A method for manufacturing a circuit board includes forming recess structures on a transferring layer; forming a dielectric layer on the transferring layer to form a stacking structure, in which the dielectric layer is at least embedded with the recess structures; bonding the stacking structure a base board by pressing, such that the dielectric layer is in contact with the base board; patterning the dielectric layer, including performing an exposure process on the stacking structure through the transferring layer; and after the exposure process is finished, removing the transferring layer.Type: ApplicationFiled: November 17, 2017Publication date: March 28, 2019Inventor: Po-Hsuan LIAO
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Publication number: 20180160543Abstract: A manufacturing method of a circuit board including the following steps is provided. A first patterned circuit layer is formed on a surface of a circuit substrate, and the first patterned circuit layer exposes a portion of the surface of the circuit substrate. A patterned glue layer is formed on the portion of the surface of the circuit substrate exposed by the first patterned circuit layer. A second patterned circuit layer is transfer-printed on the corresponding patterned glue layer. In addition, a structure of the circuit board is also mentioned.Type: ApplicationFiled: February 13, 2017Publication date: June 7, 2018Applicant: Unimicron Technology Corp.Inventors: Po-Hsuan Liao, Chi-Min Chang, Cheng-Po Yu
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Patent number: 9466123Abstract: An image identification method, an electronic device with image identification function and a computer program product executing the image identification method with a software program are provided. The image identification method comprises steps of: proceeding texture feature extraction on a color source image to obtain a plurality of texture parameters; proceeding color feature extraction on a color source image to obtain a plurality of color momentums; and weighting the plurality of texture parameters and the plurality of color momentums to obtain an image identification parameter corresponding to the color source image.Type: GrantFiled: January 13, 2016Date of Patent: October 11, 2016Assignee: WISTRON CORPORATIONInventor: Po-Hsuan Liao
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Publication number: 20160125623Abstract: An image identification method, an electronic device with image identification function and a computer program product executing the image identification method with a software program are provided. The image identification method comprises steps of: proceeding texture feature extraction on a color source image to obtain a plurality of texture parameters; proceeding color feature extraction on a color source image to obtain a plurality of color momentums; and weighting the plurality of texture parameters and the plurality of color momentums to obtain an image identification parameter corresponding to the color source image.Type: ApplicationFiled: January 13, 2016Publication date: May 5, 2016Inventor: Po-Hsuan Liao
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Patent number: 9269019Abstract: An image identification method, an electronic device with image identification function and a computer program product executing the image identification method with a software program are provided. The image identification method comprises steps of: proceeding texture feature extraction on a color source image to obtain a plurality of texture parameters; proceeding color feature extraction on a color source image to obtain a plurality of color momentums; and weighting the plurality of texture parameters and the plurality of color momentums to obtain an image identification parameter corresponding to the color source image.Type: GrantFiled: October 8, 2013Date of Patent: February 23, 2016Assignee: WISTRON CORPORATIONInventor: Po-Hsuan Liao
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Publication number: 20140222841Abstract: A display method, an electronic device, a multimedia system and a computer program product are provided. The display method includes steps of: searching storage positions of a plurality of multimedia files in a storage device so as to retrieve a plurality of storage path strings corresponding to the plurality of multimedia files; parsing the plurality of storage path strings and consequently retrieving at least one simplified path corresponding to the plurality of multimedia files; displaying the at least one simplified path; selecting one of the at least one simplified path according to a directory selection operation; displaying at least one multimedia file corresponding to the at least one simplified path being selected.Type: ApplicationFiled: September 12, 2013Publication date: August 7, 2014Applicant: Wistron CorporationInventor: Po-Hsuan Liao
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Publication number: 20140219557Abstract: An image identification method, an electronic device with image identification function and a computer program product executing the image identification method with a software program are provided. The image identification method comprises steps of: proceeding texture feature extraction on a color source image to obtain a plurality of texture parameters; proceeding color feature extraction on a color source image to obtain a plurality of color momentums; and weighting the plurality of texture parameters and the plurality of color momentums to obtain an image identification parameter corresponding to the color source image.Type: ApplicationFiled: October 8, 2013Publication date: August 7, 2014Applicant: Wistron CorporationInventor: Po-Hsuan Liao