Patents by Inventor Po-Hsuan Lin

Po-Hsuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152880
    Abstract: A multi-channel payment method for a multi-channel payment system comprises the payer or the payee who initiated the payment request logs in to the multi-channel payment system; the payer or the payee who initiated the payment request placing an order in the multi-channel payment system, wherein the order comprises a designated payment gateway; the multi-channel payment system determining a predicted fee of the order according to the designated payment gateway, past order records, and a real-time exchange rate; the multi-channel payment system performing an anti-money laundering verification of the order; the payer reviewing the order and the predicted fee through a multiple auditing method; and the multi-channel payment system executing payment from the payer to the payee according to the order and the designated payment gateway, and storing a payment detail of the order.
    Type: Application
    Filed: February 13, 2023
    Publication date: May 9, 2024
    Applicant: OBOOK INC.
    Inventors: Chun-Kai Wang, Chung-Han Hsieh, Chun-Jen Chen, Po-Hua Lin, Wei-Te Lin, Pei-Hsuan Weng, Mei-Su Wang, I-Cheng Lin, Cheng-Wei Chen
  • Patent number: 11942375
    Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a first semiconductor fin and a second semiconductor fin over a semiconductor substrate. The second semiconductor fin is wider than the first semiconductor fin. The method also includes forming a gate stack over the semiconductor substrate, and the gate stack extends across the first semiconductor fin and the second semiconductor fin. The method further includes forming a first source/drain structure on the first semiconductor fin, and the first source/drain structure is p-type doped. In addition, the method includes forming a second source/drain structure on the second semiconductor fin, and the second source/drain structure is n-type doped.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsing-Hui Hsu, Po-Nien Chen, Yi-Hsuan Chung, Bo-Shiuan Shie, Chih-Yung Lin
  • Patent number: 11943608
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably generate and transmit target Bluetooth packets containing an auto-pair request to the Bluetooth host device. The second member device is arranged to operably generate a resolvable set identifier corresponding to the second member device according to a device set identification information. The Bluetooth host device is arranged to operably identify the first member device as a first privileged device according to the auto-pair request in the target Bluetooth packets, and to operably transmit a first privileged pairing notice to the first member device and to operably generate a first cypher key. The first member device further generates a second cypher key corresponding to the first cypher key after receiving the first privileged pairing notice.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 26, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Patent number: 11943609
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device generates a first resolvable set identifier corresponding to the first member device, and generates and transmits target Bluetooth packets containing the first resolvable set identifier to the Bluetooth host device. The second member device generates a resolvable set identifier corresponding to the second member device according to a device set identification information. The Bluetooth host device identifies the first member device as a first privileged device according to the position of the first resolvable set identifier, and transmits a first privileged pairing notice to the first member device and generates a first cypher key. The first member device further generates a second cypher key corresponding to the first cypher key after receiving the first privileged pairing notice.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 26, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20240090238
    Abstract: A memory device and a method for manufacturing the memory device are provided. The memory device includes a stack and a plurality of memory strings. The stack is disposed on the substrate, and the stack includes a plurality of conductive layers and a plurality of insulating layers alternately stacked. The memory strings pass through the stack along a first direction, wherein a first memory string in the memory strings includes a first conductive pillar and a second conductive pillar, a channel layer, and a memory structure. The first conductive pillar and the second conductive pillar respectively extend along the first direction and are separated from each other. The channel layer is disposed between the first conductive pillar and the second conductive pillar. The memory structure surrounds the second conductive pillar, and the memory structure includes a resistive memory material.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Feng-Min LEE, Erh-Kun LAI, Dai-Ying LEE, Yu-Hsuan LIN, Po-Hao TSENG, Ming-Hsiu LEE
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20240076417
    Abstract: The present disclosure provides a method for manufacturing an auto-crosslinked hyaluronic acid gel, comprising conducting auto-crosslinking reaction of a colloid containing hyaluronic acid continuously at low temperature in an acidic environment, and treating the reaction product with steam at high temperature to obtain the auto-crosslinked hyaluronic acid gel with high viscosity.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 7, 2024
    Applicant: SCIVISION BIOTECH INC.
    Inventors: TAI-SHIEN HAN, TSUNG-WEI PAN, TOR-CHERN CHEN, CHUN-CHANG CHEN, PO-HSUAN LIN, LI-SU CHEN
  • Patent number: 11924631
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device generates a first cypher key according to an instruction from the first member device and a device information of the first member device after receiving a selection command. The first member device establishes a connection with the Bluetooth host device, and generates a second cypher key corresponding to the first cypher key according to a device information of the Bluetooth host device.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 5, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Patent number: 9797543
    Abstract: An adjustable tablet device holder includes a holder body including an arched sliding slot located in the back side and a locating plate extended from the back side adjacent to the arched sliding slot, and an adjustment mechanism including a turnable mounted in the holder body and having a position-limit rod extended out of the arched sliding slot and movable between the two ends of the arched sliding slot to rotate the turnable and lockable to the locating plate by a lock to stop the turntable from rotation and four clamping plates vertically and horizontally mounted in four sides and defining a clamping space for holding a mobile tablet device and movable inwardly and outwardly to adjust the horizontal width and vertical height of the clamping space upon rotation of the turnable.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: October 24, 2017
    Assignee: Chen-Source Inc.
    Inventor: Po-Hsuan Lin
  • Publication number: 20170188724
    Abstract: An adjustable tablet device holder includes a holder body including an arched sliding slot located in the back side and a locating plate extended from the back side adjacent to the arched sliding slot, and an adjustment mechanism including a turnable mounted in the holder body and having a position-limit rod extended out of the arched sliding slot and movable between the two ends of the arched sliding slot to rotate the turnable and lockable to the locating plate by a lock to stop the turntable from rotation and four clamping plates vertically and horizontally mounted in four sides and defining a clamping space for holding a mobile tablet device and movable inwardly and outwardly to adjust the horizontal width and vertical height of the clamping space upon rotation of the turnable.
    Type: Application
    Filed: March 17, 2016
    Publication date: July 6, 2017
    Inventor: Po-Hsuan LIN
  • Publication number: 20070238047
    Abstract: The present invention relates to a photosensitive resin composition for color filters of LCDs (Liquid Crystal Displays). Particularly, the photosensitive resin composition performs good photosensitivity in exposure and remains less scum on the unexposed and black matrix of a substrate after development. The color filters made from the composition also exhibit good heat resistance. The composition comprises an alkali-soluble resin (A); a photopolymerizable monomer (B); a photoinitiator (C); an organic solvent (D); and a pigment (E); wherein the photopolymerizable monomer (B) comprises the compound (B-1) having a carboxylic acid group and at least 7 functional groups represented by the following general formula (1), wherein R1 is a hydrogen or a methyl group.
    Type: Application
    Filed: October 25, 2006
    Publication date: October 11, 2007
    Inventors: Jung-Pin Hsu, Po-Hsuan Lin, Pei-Hua Sheng