Patents by Inventor Po-Hsun LEE

Po-Hsun LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136946
    Abstract: This patent presents a multidimensional space vector modulation (MDSVM) circuit formed by coupling a half-bridge logic control circuit not directly coupled to electronic components with at least three half-bridge logic control circuits coupled to electronic components. The half-bridge logic control circuit not directly coupled with any electronic components can form a full-bridge circuit with any other half-bridge logic control circuit coupled with electronic components. Therefore, users can further control the voltage difference between both ends of each electronic component separately and then individually control the strength and direction of current flowing through each electronic component and solving the problem of control attributed to the complexity of prior art.
    Type: Application
    Filed: April 10, 2023
    Publication date: April 25, 2024
    Applicant: TENSOR TECH CO., LTD
    Inventors: Shang Jung LEE, Po-Hsun YEN, Yung-Cheng CHANG, Sung-Liang HOU
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Publication number: 20230348673
    Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.
    Type: Application
    Filed: October 12, 2022
    Publication date: November 2, 2023
    Inventors: Sheng-Yen WU, Po-Hsun LEE, Chun-Ming CHIU, Wen-Pin SU, Jui-Teng HSU, Chen-Yu HUANG, Chun-Han LIN
  • Patent number: 9771456
    Abstract: The invention relates to a polyimide containing polymaleic anhydride having the formula: wherein X represents functional groups having carbon chain with carbon numbers more than 10, benzene ring and a combination of carbon chain with carbon numbers more than 10 and benzene ring; and m, n and l are integers, and larger than or equal to 1.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: September 26, 2017
    Assignee: ITEQ Corporation
    Inventors: Chao-Hui Kuo, Ming-Hung Huang, Po-Hsun Lee, Shun-Cheng Wang
  • Publication number: 20150038039
    Abstract: The invention provides a method for manufacturing an organic-inorganic hybrid material film. The method mainly comprises hybridization of polymaleic anhydride-polyimide and silica by sol-gel route and by using a silane coupling agent to produce a structure of polymaleic anhydride-polyimide having silane, then casting and curing to form a material film. Also, the invention provides a polymaleic anhydride-polyimide-silica organic-inorganic hybrid material film.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 5, 2015
    Applicant: ITEQ CORPORATION
    Inventors: Chao-Hui KUO, Ming-Hung HUANG, Po-Hsun LEE, Shun-Cheng WANG
  • Publication number: 20150004862
    Abstract: The invention relates to a polyimide containing polymaleic anhydride having the formula: wherein X represents functional groups having carbon chain with carbon numbers more than 10, benzene ring and a combination of carbon chain with carbon numbers more than 10 and benzene ring; and m, n and l are integers, and larger than or equal to 1.
    Type: Application
    Filed: July 1, 2013
    Publication date: January 1, 2015
    Inventors: Chao-Hui KUO, Ming-Hung HUANG, Po-Hsun LEE, Shun-Cheng WANG