Abstract: A thin-film chip resistor-capacitor includes a substrate, a resistor layer, a dielectric layer, a thin-film capacitor layer, a first terminal electrode and a second terminal electrode. The resistor layer is disposed on the substrate. The dielectric layer is disposed on the resistor layer. The thin-film capacitor layer is disposed on the dielectric layer and includes first and second capacitor electrodes that are physically separated with respect to each other. The first terminal electrode is disposed on a first side edge of the substrate and is coupled to the resistor layer and the first capacitor electrode. The second terminal electrode is disposed on a second side edge of the substrate opposite to the first side edge and is coupled to the resistor layer and the second capacitor electrode.

Abstract: A relay includes a first contact for receiving an input signal, a second contact for receiving a power signal, a rectifier coupled to the first and second contacts for converting the power signal into a direct-current power signal when the power signal is an alternating-current power signal, a voltage clamping circuit coupled to the rectifier for clamping a voltage of the input signal and the power signal, a Schmidt trigger coupled to the voltage clamping circuit for generating a trigger signal according to the input signal and the power signal, and a power outputting circuit coupled to the Schmidt trigger for generating an output voltage according to the trigger signal and a supply power.