Abstract: A package structure is provided. The package structure includes a semiconductor die over a redistribution structure, bonding elements below the redistribution structure, and an underfill layer surrounding the bonding elements and the redistribution structure. The semiconductor die has a rectangular profile in a plan view. A pitch of the bonding elements is defined as the sum of a diameter of the bonding elements and a spacing between neighboring two of the bonding elements. A first circular area of the redistribution structure is entirely covered and in direct contact with the underfill layer. The center of the first circular area is aligned with a first corner of the rectangular profile of the semiconductor die. A diameter of the first circular area is greater than twice the pitch of the bonding elements.

Abstract: A method of compiling a deep learning model includes reading metadata from a compiled result, the metadata indicating a structure of the deep learning model corresponding to a low-level IR, receiving shape information of an input tensor of the deep learning model, determining a shape of an output tensor of a first computation operation of the computation operations based on the shape information of the input tensor of the deep learning model and the structure of the deep learning model, tiling the output tensor of the first computation operation into one or more tiles according to the shape of the output tensor of the first computation operation and hardware limitations of a processor executing the deep learning model, and patching one or more copies of a templated hardware command into executable hardware commands.

Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.

Abstract: The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode road lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface. The bottom surface includes an elongate recess concave to the spherical surface and formed with an inner surface corresponding to the spherical surface and two vertical side surfaces adjacent to the inner surface. The inner surface of the elongate recess includes a similar Gaussian distribution curve provided on a section parallel to the vertical side surfaces. A focus is contained in a center of the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area.

Abstract: The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode illumination lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface, and the bottom surface includes an inward space concave to the spherical surface and formed with a free surface corresponding to the spherical surface. The free surface is axially-symmetrical formed as rotational molding with respect to an axis connected from the focus to a center point of the spherical surface, to form the free surface with a similar Gaussian distribution curve provided on a section vertically cut from the spherical surface to the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area.

Abstract: The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode road lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface. The bottom surface includes an elongate recess concave to the spherical surface and formed with an inner surface corresponding to the spherical surface and two vertical side surfaces adjacent to the inner surface. The inner surface of the elongate recess includes a similar Gaussian distribution curve provided on a section parallel to the vertical side surfaces. A focus is contained in a center of the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area.

Abstract: A diffusion plate having microstructures with two lengthy and slant faces and its relevant backlight module as well as optical device includes an optical base and a diffusion plate with pluralities of microstructures; wherein, the microstructures on the optical base are located by different allocation, and an angle is defined by the cooperation of two longitude and slant faces of each microstructure. The above arrangements substantially impinge on controlling the light return and transmission of the backlight module or the optical device including a brightness enhancement film, a light source, and a reflecting plate disposed thereon, thereby increasing the uniformity of backlight through the optical reflection and refraction.

Abstract: A micro-structural film manufacturing process operating on a principle of static absorption by having multiple optical particles adhered to an adhesive layer containing adhesion on a surface of a base material, followed with solidification and static removing processes for the optical particles to form a film of micro-lens diffusion layer to deliver scattering results when light is permeated for achieving the purpose of having uniform luminance while reducing production cost and allowing control the surface of the base material to develop a micro-structural film under different diffusion conditions.