Abstract: An optical system is provided, including a movable part, a fixed part, and a driving assembly. The movable part is connected to a first optical element. The movable part is movable relative to the fixed part. The fixed part has a fixed part opening, wherein a light passes through the fixed part opening. The driving assembly drives the movable part to move relative to the fixed part. The first optical element at least partially overlaps the fixed part opening when the movable part is in a first position. When the movable part is in an extreme position, the first optical element does not overlap the fixed part opening.

Abstract: An optical system is provided, including a fixed part, a movable part, and a driving assembly. The fixed part has an opening. A light passes through the opening. The movable part is movable relative to the fixed part and connected to a first optical element. The driving assembly drives the movable part to move relative to the fixed part. The first optical element at least partially overlaps the opening when the movable part is in a first position. The first optical element further includes a first optical element surface, and the first optical element surface faces the light.

Abstract: An optical element driving mechanism is provided, which includes a movable portion, a fixed portion and a driving assembly. The movable portion is connected with an optical element. The movable portion is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A nail machine with effort-saving mechanism is provided, including: a shell body; an operating mechanism, disposed on the shell body and including a pressing lever, a driving rod and a linkage, the operating mechanism provided for being operated to move between a first position and a second position; an actuating member, two ends thereof having a sliding portion and an engaging portion respectively; a striking force accumulating mechanism, including a striking board and a force accumulating member, the striking board being movable between an initial position and a releasing position; wherein when the operating mechanism moves toward the second position, the engaging portion is engaged with the striking board, and the striking board moves toward the releasing position; when the operating mechanism is in the second position, the engaging portion is detached from the striking board, and the striking board moves toward the initial position.

Abstract: A nail machine with effort-saving mechanism is provided, including: a shell body; an operating mechanism, disposed on the shell body and including a pressing lever, a driving rod and a linkage, the operating mechanism provided for being operated to move between a first position and a second position; an actuating member, two ends thereof having a sliding portion and an engaging portion respectively; a striking force accumulating mechanism, including a striking board and a force accumulating member, the striking board being movable between an initial position and a releasing position; wherein when the operating mechanism moves toward the second position, the engaging portion is engaged with the striking board, and the striking board moves toward the releasing position; when the operating mechanism is in the second position, the engaging portion is detached from the striking board, and the striking board moves toward the initial position.

Abstract: A connecting mechanism of adjusting an angle of a first module relative to a second module of an electronic device is disclosed in the present invention. The connecting mechanism includes a hinge assembly disposed on the second module, a rod disposed on the hinge assembly and pivoting to the first module, a torsional spring disposed between the rod and the hinge assembly, and a damper assembly disposed on the rod and sheathed by the torsional spring. The hinge assembly includes a first hinge installed inside the second module, and a second hinge slidably disposed on the first hinge. The torsional spring drives the rod to rotate relative to the second hinge from a first position to a second position, so that the first module can stand on the second module. The damper assembly can be for absorbing a vibration generated from the rod.