Abstract: An interactive information system includes: a first frame, a first interactive module arranged in the first frame, a second frame, a control module arranged in the second frame and configured to generate a graphic user interface (GUI) and to perform a function of the interactive information system based on the first user input; and a first internal cable connecting the first interactive module bridge board and the control module and configured to transmit the plurality of inter-frame signals between the first frame and the second frame. The first interactive module includes: a first display module for display of the GUI; a first touch input module configured to receive a first user input to the GUI; and a first interactive module bridge board configured to transmit a plurality of inter-frame signals comprising electrical signals of the first display module and the first touch input module.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A dielectric grating apparatus comprises a substrate; a grating layer, disposed above the substrate; a first interference layer, disposed above the substrate; and a second interference layer, adjacent to the first interference layer, wherein a refractive index of a material of the second interference layer is greater than a refractive index of a material of the first interference layer.

Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first diffusion barrier layer made of a dielectric material including a metal element, nitrogen, and oxygen and a first protection layer made of a dielectric material including silicon and oxygen and in direct contact with the top surface of the first diffusion barrier layer. The semiconductor device structure also includes a first thickening layer made of a dielectric material including the metal element and oxygen and in direct contact with the top surface of the first protection layer. A maximum metal content in the first thickening layer is greater than that in the first diffusion barrier layer. The semiconductor device structure further includes a conductive feature surrounded by and in direct contact with the first diffusion barrier layer, the first protection layer, and the first thickening layer.

Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.

Abstract: A recess etching solution for recess etching a metal wiring in a semiconductor substrate manufacturing process; and a recess etching method employing the same. The recess etching solution is for applying recess etching to a surface of a cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate, and contains (A) an organic acid, one of or both of (B) a nitrogen-containing heterocyclic compound and (C) an organic solvent, and (D) water. The recess etching method includes applying recess etching to a surface of a cobalt-containing metal layer by bringing the recess etching solution into contact with the surface of the cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A 3-dimension facet light-emitting source device including a transparent container, an anode plate, a cathode plate, a plurality of transparent plates and a low-pressure gas layer is provided. The transparent container has a sealed space. The transparent plates are disposed between the anode plate and the cathode plate, and have a fluorescent layer thereon respectively. The lower pressure gas layer is filled in the sealed space to induce electrons emitting from the cathode plate, and the electrons fly in a direction parallel to the transparent plates and hit each fluorescent layer to emit light, so as to form a set of 3-dimension facet patterns.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A 3-dimension facet light-emitting source device including a transparent container, an anode plate, a cathode plate, a plurality of transparent plates and a low-pressure gas layer is provided. The transparent container has a sealed space. The transparent plates are disposed between the anode plate and the cathode plate, and have a fluorescent layer thereon respectively. The lower pressure gas layer is filled in the sealed space to induce electrons emitting from the cathode plate, and the electrons fly in a direction parallel to the transparent plates and hit each fluorescent layer to emit light, so as to form a set of 3-dimension facet patterns.

Abstract: A three-dimensional surround scanning device and a method thereof are described, which are adopted to perform surround scanning on a scene area, so as to construct a three-dimensional model. The device includes an image acquisition element, a first moving mechanism, a range acquisition element, and a controller. The controller controls the image acquisition element, the range acquisition element, and the first moving mechanism to perform three-dimensional image acquisition, so as to obtain a two-dimensional image covering the scene area, depth information with three-dimensional coordinates, and corresponding position signals. The controller rearranges and combines the two-dimensional image, position signals, and depth information, so as to construct the three-dimensional model.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A plane light source is provided. The plane light source includes an anode layer, a cathode layer, a discharging gas, and at least one fluorescent layer. The discharging gas is between the anode layer and the cathode layer. The fluorescent layer is disposed on the anode layer and located between the anode layer and the cathode layer. In the plane light source, electrons is activated by discharge of the discharging gas and emitted from the cathode layer. The fluorescent layer is adapted for emitting a light when being bombarded by the electrons.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A dual-purpose light-penetrating and light-emitting device is provided. The dual-purpose light-penetrating and light-emitting device includes a first transparent substrate, a spacing sidewall, a second transparent substrate, and a light-penetrative illuminating structure. The spacing sidewall is disposed between the first transparent substrate and the second transparent substrate for configuring a hermetic space. The light-penetrative illuminating structure includes a cathode structure, an anode structure, a low pressure gas layer, and a patterned fluorescent layer. The low pressure gas layer is accommodated in the hermetic space. The cathode structure and the anode structure are oppositely disposed on the first transparent substrate and the second transparent substrate, respectively. The patterned fluorescent layer is positioned between the cathode structure and the anode structure, for allowing an ambient natural light penetrating therethrough.

Abstract: The present invention provides a multi-touch position tracking technique and an interactive system and a multi-touch interactive image processing method using the same. In the present invention, a light guide element is designed to comprise frustrating structures to frustrate total internal reflection (TIR) so that the light beam therein can be dispersed to form a dispersed optical field distribution. The dispersed optical field is used to respond a physical relation between an object and the light guide element.

Abstract: A three-dimensional surround scanning device and a method thereof are described, which are adopted to perform surround scanning on a scene area, so as to construct a three-dimensional model. The device includes an image acquisition element, a first moving mechanism, a range acquisition element, and a controller. The controller controls the image acquisition element, the range acquisition element, and the first moving mechanism to perform three-dimensional image acquisition, so as to obtain a two-dimensional image covering the scene area, depth information with three-dimensional coordinates, and corresponding position signals. The controller rearranges and combines the two-dimensional image, position signals, and depth information, so as to construct the three-dimensional model.

Abstract: A production device monitors a transporting status of a circuit board in production equipment. The production device includes a transporting unit, a holding unit and at least one detecting unit. In this case, the transporting unit transports the circuit board. The holding unit is set in the production equipment and at least one part of the holding unit is disposed below the transporting unit. The detecting unit is disposed on the production equipment. The detecting unit is connected to and cooperated with the holding unit. Furthermore, production equipment, including a machine housing, a transporting unit, a holding unit, and at least one detecting unit, is disclosed.

Abstract: The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wave former to increase the total height of enclosing walls thereof for increasing the wave height, and the gland is disposed on the partial opening of the wave former to press the molten solder for have higher solder wave on other partial opening of the wave former uncovered by the gland.