Abstract: Provided is an etching composition for a semiconductor substrate for a memory element capable of providing a semiconductor substrate for a memory element having improved performance. The etching composition for a semiconductor substrate for a memory element comprises: (A) an oxidizing agent; (B) a fluorine compound; and (C) a metal tungsten corrosion inhibitor, wherein (C) the metal tungsten corrosion inhibitor contains at least one selected from the group consisting of an ammonium salt represented by formula (1) and a heteroaryl salt having a C14-C30 alkyl group.

Abstract: A recess etching solution for recess etching a metal wiring in a semiconductor substrate manufacturing process; and a recess etching method employing the same. The recess etching solution is for applying recess etching to a surface of a cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate, and contains (A) an organic acid, one of or both of (B) a nitrogen-containing heterocyclic compound and (C) an organic solvent, and (D) water. The recess etching method includes applying recess etching to a surface of a cobalt-containing metal layer by bringing the recess etching solution into contact with the surface of the cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A 3-dimension facet light-emitting source device including a transparent container, an anode plate, a cathode plate, a plurality of transparent plates and a low-pressure gas layer is provided. The transparent container has a sealed space. The transparent plates are disposed between the anode plate and the cathode plate, and have a fluorescent layer thereon respectively. The lower pressure gas layer is filled in the sealed space to induce electrons emitting from the cathode plate, and the electrons fly in a direction parallel to the transparent plates and hit each fluorescent layer to emit light, so as to form a set of 3-dimension facet patterns.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A 3-dimension facet light-emitting source device including a transparent container, an anode plate, a cathode plate, a plurality of transparent plates and a low-pressure gas layer is provided. The transparent container has a sealed space. The transparent plates are disposed between the anode plate and the cathode plate, and have a fluorescent layer thereon respectively. The lower pressure gas layer is filled in the sealed space to induce electrons emitting from the cathode plate, and the electrons fly in a direction parallel to the transparent plates and hit each fluorescent layer to emit light, so as to form a set of 3-dimension facet patterns.

Abstract: A three-dimensional surround scanning device and a method thereof are described, which are adopted to perform surround scanning on a scene area, so as to construct a three-dimensional model. The device includes an image acquisition element, a first moving mechanism, a range acquisition element, and a controller. The controller controls the image acquisition element, the range acquisition element, and the first moving mechanism to perform three-dimensional image acquisition, so as to obtain a two-dimensional image covering the scene area, depth information with three-dimensional coordinates, and corresponding position signals. The controller rearranges and combines the two-dimensional image, position signals, and depth information, so as to construct the three-dimensional model.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A plane light source is provided. The plane light source includes an anode layer, a cathode layer, a discharging gas, and at least one fluorescent layer. The discharging gas is between the anode layer and the cathode layer. The fluorescent layer is disposed on the anode layer and located between the anode layer and the cathode layer. In the plane light source, electrons is activated by discharge of the discharging gas and emitted from the cathode layer. The fluorescent layer is adapted for emitting a light when being bombarded by the electrons.

Abstract: An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10?3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.

Abstract: A dual-purpose light-penetrating and light-emitting device is provided. The dual-purpose light-penetrating and light-emitting device includes a first transparent substrate, a spacing sidewall, a second transparent substrate, and a light-penetrative illuminating structure. The spacing sidewall is disposed between the first transparent substrate and the second transparent substrate for configuring a hermetic space. The light-penetrative illuminating structure includes a cathode structure, an anode structure, a low pressure gas layer, and a patterned fluorescent layer. The low pressure gas layer is accommodated in the hermetic space. The cathode structure and the anode structure are oppositely disposed on the first transparent substrate and the second transparent substrate, respectively. The patterned fluorescent layer is positioned between the cathode structure and the anode structure, for allowing an ambient natural light penetrating therethrough.

Abstract: The present invention provides a multi-touch position tracking technique and an interactive system and a multi-touch interactive image processing method using the same. In the present invention, a light guide element is designed to comprise frustrating structures to frustrate total internal reflection (TIR) so that the light beam therein can be dispersed to form a dispersed optical field distribution. The dispersed optical field is used to respond a physical relation between an object and the light guide element.

Abstract: A three-dimensional surround scanning device and a method thereof are described, which are adopted to perform surround scanning on a scene area, so as to construct a three-dimensional model. The device includes an image acquisition element, a first moving mechanism, a range acquisition element, and a controller. The controller controls the image acquisition element, the range acquisition element, and the first moving mechanism to perform three-dimensional image acquisition, so as to obtain a two-dimensional image covering the scene area, depth information with three-dimensional coordinates, and corresponding position signals. The controller rearranges and combines the two-dimensional image, position signals, and depth information, so as to construct the three-dimensional model.

Abstract: A production device monitors a transporting status of a circuit board in production equipment. The production device includes a transporting unit, a holding unit and at least one detecting unit. In this case, the transporting unit transports the circuit board. The holding unit is set in the production equipment and at least one part of the holding unit is disposed below the transporting unit. The detecting unit is disposed on the production equipment. The detecting unit is connected to and cooperated with the holding unit. Furthermore, production equipment, including a machine housing, a transporting unit, a holding unit, and at least one detecting unit, is disclosed.

Abstract: The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wave former to increase the total height of enclosing walls thereof for increasing the wave height, and the gland is disposed on the partial opening of the wave former to press the molten solder for have higher solder wave on other partial opening of the wave former uncovered by the gland.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.

Abstract: An adjustable frame structure for carrying a circuit board of different sizes, includes a frame and at least one movable bar, wherein a plurality of first fasteners and at least a pair of parallel tracks are mounted on the frame, and at least one second fastener and at least two rolling pieces are formed on the at least one movable bar. The rolling pieces roll within the tracks such that the at least one movable bar can smoothly move on the frame to adjust the location of the bar on the frame according to the size of the circuit board.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.