Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer adjacent to the gate structure, wherein the first spacer comprises silicon carbon nitride (SiCN); forming a second spacer adjacent to the first spacer, wherein the second spacer comprises silicon oxycarbonitride (SiOCN); and forming a source/drain region adjacent to two sides of the second spacer.

Abstract: A wafer map recognition method using artificial intelligence includes obtaining wafer maps of a plurality of wafers; performing an unsupervised algorithm on the wafer map of each wafer in the plurality of wafers to generate a feature data set for the corresponding wafer map; and performing a clustering algorithm according to a plurality of feature data sets for the plurality of wafer maps to find a wafer map with a potential defect.

Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.

Abstract: A multi-board mid-plane includes a disk backplane board (DBB) having a front side and a rear side. Venting holes are provided within the DBB extending between the front side of the DBB and the rear side of the DBB. The multi-board mid-plane also includes a controller backplane board (CBB) having a front side and a rear side. The front side of the CBB includes venting holes provided within the CBB extending between the front side of the CBB and the rear side of the CBB. A top fabric plane board (TFPB) and a bottom fabric plane board (BFPB) are provided for connecting the DBB with the CBB. A combination of the DBB and the CBB has a venting ratio that is equal to a lower of the venting ratio of the DBB and the venting ratio of the CBB.

Abstract: A multi-board mid-plane includes a disk backplane board (DBB) having a front side and a rear side. Venting holes are provided within the DBB extending between the front side of the DBB and the rear side of the DBB. The multi-board mid-plane also includes a controller backplane board (CBB) having a front side and a rear side. The front side of the CBB includes venting holes provided within the CBB extending between the front side of the CBB and the rear side of the CBB. A top fabric plane board (TFPB) and a bottom fabric plane board (BFPB) are provided for connecting the DBB with the CBB. A combination of the DBB and the CBB has a venting ratio that is equal to a lower of the venting ratio of the DBB and the venting ratio of the CBB.

Abstract: A package structure for an electronic component is disclosed. The package structure includes a box body and a first cutting line. The first cutting line is formed at the box body and defines a first plate. The first plate can be detached from the box body along the first cutting line and forms a connecting hole for the electronic component. The package structure is used as an environmental friendly computer assembly casing and solves the problem of buying an additional computer assembly casing.

Abstract: A Sync On Green signal detection circuit includes a clamping circuit for clamping a voltage of a video graphics signal within a default range and then outputting a clamped input signal; a first PGA (programmable gain amplifier) for receiving and amplifying the clamped input signal by a first gain to generate a first gain signal; a first low-pass filter for receiving the first gain signal and then generating a first filtered signal; a second PGA for receiving and amplifying the clamped input signal by a second gain to generate a second gain signal, wherein the second gain is different from the first gain; a second low-pass filter for receiving the second gain signal and then generating a second filtered signal; a programmable voltage shifter for receiving and adjusting the first filtered signal and then outputting a level shifted signal; and a comparator for receiving the level shifted signal and the second filtered signal and then generating a comparison signal as a SOG signal.

Abstract: A Sync On Green signal detection circuit includes a clamping circuit for clamping a voltage of a video graphics signal within a default range and then outputting a clamped input signal; a first PGA (programmable gain amplifier) for receiving and amplifying the clamped input signal by a first gain to generate a first gain signal; a first low-pass filter for receiving the first gain signal and then generating a first filtered signal; a second PGA for receiving and amplifying the clamped input signal by a second gain to generate a second gain signal, wherein the second gain is different from the first gain; a second low-pass filter for receiving the second gain signal and then generating a second filtered signal; a programmable voltage shifter for receiving and adjusting the first filtered signal and then outputting a level shifted signal; and a comparator for receiving the level shifted signal and the second filtered signal and then generating a comparison signal as a SOG signal.

Abstract: An analog-to-digital converter including analog-to-digital converting units connected in serial. The current comparator includes a current input terminal to receive a sampling current, a reference current input terminal to receive a reference current and a bit output terminal for outputting a bit signal. The current operation circuit includes a current output terminal for outputting a compared current according to the sampling current and the reference current. The operation controlling terminal selects the compared current according to the bit signal. The controlling terminal receives a clock signal to latch the bit signal. The analog-to-digital converting units output the bit signals in sequence in a period of the clock signal.

Abstract: An analog-to-digital converter including analog-to-digital converting units connected in serial. The current comparator includes a current input terminal to receive a sampling current, a reference current input terminal to receive a reference current and a bit output terminal for outputting a bit signal. The current operation circuit includes a current output terminal for outputting a compared current according to the sampling current and the reference current. The operation controlling terminal selects the compared current according to the bit signal. The controlling terminal receives a clock signal to latch the bit signal. The analog-to-digital converting units output the bit signals in sequence in a period of the clock signal.