Abstract: The present invention discloses a multifunctional flexible handwriting board and its manufacturing method. The multifunctional flexible handwriting board comprises a name plate, a linear plate, a shock absorbing layer and a circuit board. The name plate is made of a flexible material and has an upper surface uses as a mouse pad. The linear plate is made of a flexible material and has a sensing area at the middle. The shock absorbing layer is made of a soft material for protecting the linear plate. The circuit board is electrically coupled to the sensing area of the linear plate for transmitting information. The method of manufacturing the multifunctional flexible handwriting board is to couple the circuit board to an edge of the linear plate and sequentially couple the name plate, the linear plate and the shock absorbing layer.

Abstract: In a manufacturing method of a flexible printed circuit board and its structure, the manufacturing method includes the steps of: providing a substrate; performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, an X-axis circuit, a Y-axis circuit and an external circuit on a surface of the substrate by a screen printing method, forming a ground circuit layer on the substrate and corresponding to the ground circuit, forming on a Y-axis circuit layer on a surface of the substrate and corresponding to the Y-axis circuit, forming an X-axis circuit layer on a surface of the substrate and corresponding to the X-axis circuit, and forming a carbon paste enhancement layer according to the external circuit.

Abstract: In a manufacturing method of a flexible printed circuit board and its structure, the manufacturing method includes the steps of: providing a substrate; performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, an X-axis circuit, a Y-axis circuit and an external circuit on a surface of the substrate by a screen printing method, forming a ground circuit layer on the substrate and corresponding to the ground circuit, forming on a Y-axis circuit layer on a surface of the substrate and corresponding to the Y-axis circuit, forming an X-axis circuit layer on a surface of the substrate and corresponding to the X-axis circuit, and forming a carbon paste enhancement layer according to the external circuit.