Patents by Inventor PO-KAI CHEN

PO-KAI CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996317
    Abstract: A method includes etching a semiconductor substrate to form a trench and a semiconductor strip. A sidewall of the semiconductor strip is exposed to the trench. The method further includes depositing a silicon-containing layer extending into the trench, wherein the silicon-containing layer extends on the sidewall of the semiconductor strip, filling the trench with a dielectric material, wherein the dielectric material is on a sidewall of the silicon-containing layer, and oxidizing the silicon-containing layer to form a liner. The liner comprises oxidized silicon. The liner and the dielectric material form parts of an isolation region. The isolation region is recessed, so that a portion of the semiconductor strip protrudes higher than a top surface of the isolation region and forms a semiconductor fin.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Kai Hsiao, Han-De Chen, Tsai-Yu Huang, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20240172456
    Abstract: A method of manufacturing a hybrid random access memory in a system-on-chip, including steps of providing a semiconductor substrate with a magnetoresistive random access memory (MRAM) region and a resistive random-access memory (ReRAM) region, forming multiple ReRAM cells in the ReRAM region on the semiconductor substrate, forming a first dielectric layer on the semiconductor substrate, wherein the ReRAM cells are in the first dielectric layer, forming multiple MRAM cells in the MRAM region on the first dielectric layer, and forming a second dielectric layer on the first dielectric layer, wherein the MRAM cells are in the second dielectric layer.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 23, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Kai Hsu, Hui-Lin Wang, Ching-Hua Hsu, Yi-Yu Lin, Ju-Chun Fan, Hung-Yueh Chen
  • Publication number: 20240162114
    Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.
    Type: Application
    Filed: February 9, 2023
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Shian-Chiau Chiou, Chun-Kai Liu, Po-Kai Chiu, Chih-Ming Tzeng, Yao-Shun Chen
  • Publication number: 20240152880
    Abstract: A multi-channel payment method for a multi-channel payment system comprises the payer or the payee who initiated the payment request logs in to the multi-channel payment system; the payer or the payee who initiated the payment request placing an order in the multi-channel payment system, wherein the order comprises a designated payment gateway; the multi-channel payment system determining a predicted fee of the order according to the designated payment gateway, past order records, and a real-time exchange rate; the multi-channel payment system performing an anti-money laundering verification of the order; the payer reviewing the order and the predicted fee through a multiple auditing method; and the multi-channel payment system executing payment from the payer to the payee according to the order and the designated payment gateway, and storing a payment detail of the order.
    Type: Application
    Filed: February 13, 2023
    Publication date: May 9, 2024
    Applicant: OBOOK INC.
    Inventors: Chun-Kai Wang, Chung-Han Hsieh, Chun-Jen Chen, Po-Hua Lin, Wei-Te Lin, Pei-Hsuan Weng, Mei-Su Wang, I-Cheng Lin, Cheng-Wei Chen
  • Publication number: 20240136401
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.
    Type: Application
    Filed: January 5, 2024
    Publication date: April 25, 2024
    Inventors: Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Yi-Shin Chu, Po-Chun Liu, Kuan-Chieh Huang, Jyh-Ming Hung, Jen-Cheng Liu
  • Patent number: 11968856
    Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 23, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Chung-Chih Wu, Po-Jui Chen, Hoang Yan Lin, Guo-Dong Su, Wei-Kai Lee, Chi-Jui Chang, Wan-Yu Lin, Byung Sung Kwak, Robert Jan Visser
  • Publication number: 20240130246
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
  • Patent number: 11957061
    Abstract: A semiconductor device includes a substrate, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer is disposed on the substrate, around a first metal interconnection. The second dielectric layer is disposed on the first dielectric layer, around a via and a second metal interconnection. The second metal interconnection directly contacts the first metal interconnection. The third dielectric layer is disposed on the second dielectric layer, around a first magnetic tunneling junction (MTJ) structure and a third metal interconnection. The third metal interconnection directly contacts top surfaces of the first MTJ structure and the second metal interconnection, and the first MTJ structure directly contacts the via.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Yi-Yu Lin, Ching-Hua Hsu, Hung-Yueh Chen
  • Publication number: 20240106844
    Abstract: A system and a method for cybersecurity threat detection and early warning are provided. The method includes the following steps: determining whether a network element has an abnormal change according to operation information; if yes, performing a deduction by a cybersecurity event inference model according to the operation information of an abnormal network element to generate a cybersecurity prediction warning; at the same time, collecting and comparing cybersecurity event information and further performing a self-response test on the abnormal network element and a comparison for response result information to finally generate a threat event decision. The cybersecurity prediction warning provides early warning of potential cyberattacks, and the threat event decision provides a robust judgment of the cyberattack event. The present invention solves the problems of long determination time and easily missing judgment and misjudgment.
    Type: Application
    Filed: November 2, 2022
    Publication date: March 28, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Chih-Kai CHEN, Po-Yu LIAO
  • Patent number: 11925035
    Abstract: A hybrid random access memory for a system-on-chip (SOC), including a semiconductor substrate with a MRAM region and a ReRAM region, a first dielectric layer on the semiconductor substrate, multiple ReRAM cells in the first dielectric layer on the ReRAM region, a second dielectric layer above the first dielectric layer, and multiple MRAM cells in the second dielectric layer on the MRAM region.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: March 5, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Kai Hsu, Hui-Lin Wang, Ching-Hua Hsu, Yi-Yu Lin, Ju-Chun Fan, Hung-Yueh Chen
  • Patent number: 10367805
    Abstract: Disclosed herein are methods for dynamic user Identity authentication for authenticating the identity of a user of a login device. In some embodiments, the method includes the following steps: using a web server to receive an access request from the login device, generate a resource address information and a session identifier, and transmit the same to the login device; using the login device to generate an initiation signal and transmit the same to a signing device thereby initiating an air signature procedure to generate a target signature, wherein the signing device includes a motion sensor configured to sense movement features produced when the user moves the signing device; using a determination module to determine whether the target signature matches a reference signature and generate a authentication information based on the determination; and using the web server to determine whether the access request is granted based on the authentication information.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: July 30, 2019
    Assignee: AirSig Inc.
    Inventor: Po-Kai Chen
  • Publication number: 20180212947
    Abstract: Disclosed herein are methods for dynamic user Identity authentication for authenticating the identity of a user of a login device. In some embodiments, the method includes the following steps: using a web server to receive an access request from the login device, generate a resource address information and a session identifier, and transmit the same to the login device; using the login device to generate an initiation signal and transmit the same to a signing device thereby initiating an air signature procedure to generate a target signature, wherein the signing device includes a motion sensor configured to sense movement features produced when the user moves the signing device; using a determination module to determine whether the target signature matches a reference signature and generate a authentication information based on the determination; and using the web server to determine whether the access request is granted based on the authentication information.
    Type: Application
    Filed: January 25, 2017
    Publication date: July 26, 2018
    Applicant: AirSig Inc.
    Inventor: Po-Kai Chen
  • Publication number: 20160226865
    Abstract: A motion-based authentication method of authenticating a user with a mobile device is provided. A pre-training routine is conducted to detect an orientation characteristic and a duration characteristic associated with a user input. A training routine is conducted to capture a set of base signatures and to compute the consistency level associated with the signatures. A verification routine is conducted to compare the target signature with the set of base signatures. Authorization is granted if the target signature has reached the similarity threshold with respect to the base signatures.
    Type: Application
    Filed: January 27, 2016
    Publication date: August 4, 2016
    Applicant: AirSig Technology Co. Ltd.
    Inventors: PO-KAI CHEN, YU-JIE CHEN, YU-CHENG HO, MENG-HSI CHUANG
  • Publication number: 20150365515
    Abstract: A method of triggering identity authentication mode of an electronic device is disclosed. The method includes following steps: when a triggering event is detected, automatically entering identity authentication mode; accepting a user operation of a user under identity authentication mode; generating input data corresponding to the user operation; if the input data is determined matching one of a plurality of predefined input data established previously, authenticating the user identity, and obtaining a control command corresponding to the predefined input data; and executing the control command. With the method of the present invention, the electronic device automatically enters identity authentication mode when a triggering event is detected, which effectively simplified the operation required to enter the identity authentication mode.
    Type: Application
    Filed: June 16, 2015
    Publication date: December 17, 2015
    Inventor: PO-KAI CHEN
  • Publication number: 20150363591
    Abstract: A method of activate-upon-authentication for an electronic device is disclosed. The method includes following steps: accepting a first user operation corresponding to specific function; generating input data corresponding to the first user operation; authenticating a user identity, and simultaneously obtaining a control command corresponding to the predefined input data for triggering the function when the input data matching one of a plurality of predefined input data previously established; and executes the control command in order to trigger above-mentioned function. The present invention uses a single user operation to identify user identity and trigger above-mentioned function at the same time, which eliminates the need to execute additional operation to input identification data.
    Type: Application
    Filed: June 16, 2015
    Publication date: December 17, 2015
    Inventor: PO-KAI CHEN