Abstract: An inlet module is adapted to be disposed on a housing of an electronic device, and includes an insert board and at least one adjusting plate. The insert board has a plurality of first air passages, at least one second air passage, and at least one positioning unit. The second air passage is located between two of the first air passages, and has an area larger than that of each first air passage. The adjusting plate has an opening having an area smaller than that of the second air passage. The adjusting plate is operable to be positioned at a position where the opening and the second air passage are overlapped with each other, thereby reducing an area of the airflow passing through the second air passage.

Abstract: An absorption testing apparatus supports a carrier board and includes a supporting platform, an electrically conductive component, a sealing ring and an electrical probe. The supporting platform has opposite top and bottom surfaces and a pathway penetrating through the top and bottom surfaces. The electrically conductive component, having a plate and elastic arms, is located in the pathway and is embedded in the supporting platform to divide the pathway into absorption and accommodating areas that are isolated by the plate. The elastic arms penetrate through the plate. The sealing ring, on the top surface, surrounds the absorption area and supports the carrier board. Each elastic arm has one end in the absorption area, electrically connecting to the carrier board. The electrical probe is located in the pathway and includes a body and probe heads. Each elastic arm has another end in the accommodating area, electrically connecting to the probe heads.

Abstract: A method for testing air tightness includes connecting a testing chamber and a storage chamber, supplying negative pressure to the storage chamber, measuring the pressure in the storage or testing chamber to obtain a first pressure value, determining air tightness of the testing chamber according to the negative pressure and the first pressure value, stopping the negative pressure to the storage chamber, measuring the pressure in the storage chamber to obtain a second pressure value, measuring the pressure in the storage chamber after stopping the negative pressure to the storage chamber to obtain a third pressure value, and determining air tightness of the testing chamber according to the second and third pressure values. The device includes testing and storage chambers, a negative pressure generator, and a pressure gauge connected to the storage chamber, which is connected to the testing chamber. The negative pressure generator is connected to the storage chamber.

Abstract: A method for testing air tightness includes connecting a testing chamber and a storage chamber, supplying negative pressure to the storage chamber, measuring the pressure in the storage or testing chamber to obtain a first pressure value, determining air tightness of the testing chamber according to the negative pressure and the first pressure value, stopping the negative pressure to the storage chamber, measuring the pressure in the storage chamber to obtain a second pressure value, measuring the pressure in the storage chamber after stopping the negative pressure to the storage chamber to obtain a third pressure value, and determining air tightness of the testing chamber according to the second and third pressure values. The device includes testing and storage chambers, a negative pressure generator, and a pressure gauge connected to the storage chamber, which is connected to the testing chamber. The negative pressure generator is connected to the storage chamber.

Abstract: An absorption testing apparatus supports a carrier board and includes a supporting platform, an electrically conductive component, a sealing ring and an electrical probe. The supporting platform has opposite top and bottom surfaces and a pathway penetrating through the top and bottom surfaces. The electrically conductive component, having a plate and elastic arms, is located in the pathway and is embedded in the supporting platform to divide the pathway into absorption and accommodating areas that are isolated by the plate. The elastic arms penetrate through the plate. The sealing ring, on the top surface, surrounds the absorption area and supports the carrier board. Each elastic arm has one end in the absorption area, electrically connecting to the carrier board. The electrical probe is located in the pathway and includes a body and probe heads. Each elastic arm has another end in the accommodating area, electrically connecting to the probe heads.

Abstract: A calibration board and a timing calibration method thereof are provided. The calibration board for calibrating signal delays of test channels in an automatic test equipment is pluggably disposed in the automatic test equipment and includes calibration groups, a first common node, and a switching module. Each calibration group includes a second common node and conductive pads electrically connecting to the second common node. Each conductive pad selectively and electrically connects to one test channel. The switching module electrically connects to the first common node and each second common node. When a first delay calibration procedure is performed, the connection between the first common node and each second common node is disabled. When a second delay calibration procedure is performed, the connection between the first common node and each second common node is built.

Abstract: A calibration board and a timing calibration method thereof are provided. The calibration board for calibrating signal delays of test channels in an automatic test equipment is pluggably disposed in the automatic test equipment and includes calibration groups, a first common node, and a switching module. Each calibration group includes a second common node and conductive pads electrically connecting to the second common node. Each conductive pad selectively and electrically connects to one test channel. The switching module electrically connects to the first common node and each second common node. When a first delay calibration procedure is performed, the connection between the first common node and each second common node is disabled. When a second delay calibration procedure is performed, the connection between the first common node and each second common node is built.