Patents by Inventor Po-Kai Hsiao

Po-Kai Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10524373
    Abstract: The disclosure provides a fixing assembly adapted to fix an expansion card on an expansion slot of a motherboard. The fixing assembly includes a casing, a first positioning component and a second positioning component. The first positioning component is slidably disposed on the casing so that a distance between the first positioning component and the expansion slot of the motherboard is adjustable. The second positioning component is slidably disposed on the first positioning component. The second positioning component and the first positioning component are configured to press against the expansion card, and sliding directions of the first positioning component and the second positioning component are different from each other.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: December 31, 2019
    Assignee: WISTRON CORP.
    Inventors: Yi Chien Liu, Po-Kai Wang, Yu-Hsin Yu, Jung-Shu Hsiao, Ching-Hua Wang
  • Publication number: 20190307012
    Abstract: The disclosure provides a fixing assembly adapted to fix an expansion card on an expansion slot of a motherboard. The fixing assembly includes a casing, a first positioning component and a second positioning component. The first positioning component is slidably disposed on the casing so that a distance between the first positioning component and the expansion slot of the motherboard is adjustable. The second positioning component is slidably disposed on the first positioning component. The second positioning component and the first positioning component are configured to press against the expansion card, and sliding directions of the first positioning component and the second positioning component are different from each other.
    Type: Application
    Filed: September 5, 2018
    Publication date: October 3, 2019
    Applicant: WISTRON CORP.
    Inventors: Yi Chien LIU, Po-Kai WANG, Yu-Hsin YU, Jung-Shu HSIAO, Ching-Hua WANG
  • Patent number: 9893185
    Abstract: A FinFET including a substrate, a plurality of isolation structures, a plurality of blocking layers, and a gate stack is provided. The substrate has a plurality of semiconductor fins. The isolation structures are located on the substrate to isolate the semiconductor fins. In addition, the semiconductor fins protrude from the isolation structures. The blocking layers are located between the isolation structures and the semiconductor fins. The material of the blocking layers is different from the material of the isolation structures. The gate stack is disposed across portions of the semiconductor fins, portions of the blocking layers and portions of the isolation structures. In addition, a method for fabricating the FinFET is also provided.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: February 13, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Ta Wu, Yu-Ting Lin, Po-Kai Hsiao, Po-Kang Ho, Ting-Chun Wang
  • Publication number: 20170250282
    Abstract: A FinFET including a substrate, a plurality of isolation structures, a plurality of blocking layers, and a gate stack is provided. The substrate has a plurality of semiconductor fins. The isolation structures are located on the substrate to isolate the semiconductor fins. In addition, the semiconductor fins protrude from the isolation structures. The blocking layers are located between the isolation structures and the semiconductor fins. The material of the blocking layers is different from the material of the isolation structures. The gate stack is disposed across portions of the semiconductor fins, portions of the blocking layers and portions of the isolation structures. In addition, a method for fabricating the FinFET is also provided.
    Type: Application
    Filed: February 26, 2016
    Publication date: August 31, 2017
    Inventors: Cheng-Ta Wu, Yu-Ting Lin, Po-Kai Hsiao, Po-Kang Ho, Ting-Chun Wang