Patents by Inventor PO-KUEI YANG

PO-KUEI YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096822
    Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Chia-Kuei HSU, Ming-Chih YEW, Shu-Shen YEH, Che-Chia YANG, Po-Yao LIN, Shin-Puu JENG
  • Patent number: 11036280
    Abstract: In one example, an electronic device is described, which includes a main body, a display unit pivotally connected to the main body, an angle detection unit disposed in the display unit to determine angle of rotation of the display unit relative to the main body, and a control unit to execute at least one command to control the electronic device based on the determined angle of rotation.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: June 15, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Po-Kuei Yang, Ann Weng
  • Publication number: 20200081518
    Abstract: In one example, an electronic device is described, which includes a main body, a display unit pivotally connected to the main body, an angle detection unit disposed in the display unit to determine angle of rotation of the display unit relative to the main body, and a control unit to execute at least one command to control the electronic device based on the determined angle of rotation.
    Type: Application
    Filed: April 4, 2017
    Publication date: March 12, 2020
    Inventors: PO-KUEI YANG, ANN WENG